Abstract: A laterally switching cell structure including a metal-insulator-metal stack includes an active metal oxide layer including one or more sub-stoichiometric regions. The metal oxide layer includes one or more metal-oxides deposited conformally using a mixed precursor atomic layer deposition process. A graded oxygen profile in the metal oxide layer(s) of the stack including a mirrored impurity density may be formed wherein the sub-stoichiometric region(s) include a relatively high density of impurities obtained as reaction by-products. Arrays of cell structures can be formed with no requirement for a thick active electrode, allowing for more space for a metal fill and optional selector, thereby reducing access resistance.

Abstract: Artificial synaptic devices with an HfO2-based ferroelectric layer that can be implemented in the CMOS back-end are provided. In one aspect, an artificial synapse element is provided. The artificial synapse element includes: a bottom electrode; a ferroelectric layer disposed on the bottom electrode, wherein the ferroelectric layer includes an HfO2-based material that crystallizes in a ferroelectric phase at a temperature of less than or equal to about 400° C.; and a top electrode disposed on the bottom electrode. An artificial synaptic device including the present artificial synapse element and methods for formation thereof are also provided.

Abstract: Described herein is a crossbar array that includes a cross-point synaptic device at each of a plurality of crosspoints. The cross-point synaptic device includes a weight storage element comprising a set of nanocrystal dots. Further, the cross-point synaptic device includes at least three terminals for interacting with the weight storage element, wherein a weight is stored in the weight storage element by sending a first electric pulse via a gate terminal from the at least three terminals, the first electric pulse causes the nanocrystal dots to store a corresponding charge, and the weight is erased from the weight storage element by sending a second electric pulse via the gate terminal, the second electric pulse having an opposite polarity of the first electric pulse.

Abstract: A method of forming a semiconductor device that includes forming a metal oxide material on a III-V semiconductor channel region or a germanium containing channel region; and treating the metal oxide material with an oxidation process. The method may further include depositing of a hafnium containing oxide on the metal oxide material after the oxidation process, and forming a gate conductor atop the hafnium containing oxide. The source and drain regions are on present on opposing sides of the gate structure including the metal oxide material, the hafnium containing oxide and the gate conductor.

Abstract: A method of forming a ferroelectric/anti-ferroelectric (FE/AFE) dielectric layer is provided. The method includes forming a metal electrode layer on a substrate, wherein the metal electrode layer has an exposed surface with at least 80% {111} crystal face, and forming an FE/AFE dielectric layer on the exposed surface of the metal electrode layer, wherein the FE/AFE dielectric layer is a group 4 transition metal oxide.

Abstract: A method is presented for incorporating a metal-ferroelectric-metal (MFM) structure in a cross-bar array in back end of the line (BEOL) processing. The method includes forming a first electrode, forming a ferroelectric layer in direct contact with the first electrode, forming a second electrode in direct contact with the ferroelectric layer, such that the first electrode and the ferroelectric layer are perpendicular to the second electrode to form the cross-bar array, and biasing the second electrode to adjust domain wall movement within the ferroelectric layer.

Abstract: Controllable resistance elements and methods of setting the same include a junction field effect transistor configured to provide a resistance on a signal line. A first pass transistor is configured to apply a charge increment or decrement to the junction field effect transistor responsive to a control pulse, such that the resistance on the signal line changes.

Abstract: A laterally switching cell structure including a metal-insulator-metal stack includes an active metal oxide layer including one or more sub-stoichiometric regions. The metal oxide layer includes one or more metal-oxides deposited conformally using a mixed precursor atomic layer deposition process. A graded oxygen profile in the metal oxide layer(s) of the stack including a mirrored impurity density may be formed wherein the sub-stoichiometric region(s) include a relatively high density of impurities obtained as reaction by-products. Arrays of cell structures can be formed with no requirement for a thick active electrode, allowing for more space for a metal fill and optional selector, thereby reducing access resistance.

Abstract: Methods of training a neural network include applying an input signal to an array of weights to generate weighted output signals based on resistances of respective weights in the array of weights. A difference between the weighted output signals and a predetermined expected output is determined. Weights in the array of weights are set by applying a pulse to a controllable resistance element in each weight. The pulse increments or decrements a charge on a junction field effect transistor in the respective controllable resistance element.

Abstract: Neural networks include neuron layers arranged in order from an input neuron layer to an output neuron layer, with at least one hidden layer between them. Weight arrays between respective pairs of neuron layers each include controllable resistance elements and AND gates configured to control addressing of the plurality of controllable resistance elements. Each controllable resistance element includes a junction field effect transistor configured to provide a resistance on a signal line and a first pass transistor configured to apply a charge increment or decrement to the junction field effect transistor responsive to a control pulse, such that the resistance on the signal line changes. The control pulse is only passed to a controllable resistance element when a respective AND gate is triggered. A training module is configured to train the neural network by adjusting resistances of the plurality of controllable resistance elements in each of the weight arrays.

Abstract: A method for converting a dielectric material including a type IV transition metal into a crystalline material that includes forming a predominantly non-crystalline dielectric material including the type IV transition metal on a supporting substrate as a component of an electrical device having a scale of microscale or less; and converting the predominantly non-crystalline dielectric material including the type IV transition metal to a crystalline crystal structure by exposure to energy for durations of less than 100 milliseconds and, in some instances, less than 10 microseconds. The resultant material is fully or partially crystallized and contains a metastable ferroelectric phase such as the polar orthorhombic phase of space group Pca21 or Pmn21. During the conversion to the crystalline crystal structure, adjacently positioned components of the electrical devices are not damaged.

Abstract: A circuit is provided. The circuit includes a ferroelectric tunneling junction (“FTJ”) coupled in series with a YR read line. The circuit also includes a pull-up circuit having a write line YW as a first input with an output in series with the FTJ, and a pull-down circuit having the write line YW as a first input with an output in series with the second side of the FTJ.

Abstract: Artificial synaptic devices with a HfO2-based ferroelectric layer that can be implemented in the CMOS front-end are provided. In one aspect, a method of forming a FET device is provided. The method includes: forming a shallow STI region in a substrate separating a first active area of the substrate from a second active area of the substrate; forming at least one FeFET on the substrate in the first active area having a ferroelectric material including a HfO2-based material; and forming at least one logic FET alongside the at least one FeFET on the substrate in the second active area, wherein the at least one logic FET has a gate dielectric including the HfO2-based material. A FET device formed by the present techniques is also provided.

Abstract: Artificial synaptic devices with a HfO2-based ferroelectric layer that can be implemented in the CMOS front-end are provided. In one aspect, a method of forming a FET device is provided. The method includes: forming a shallow STI region in a substrate separating a first active area of the substrate from a second active area of the substrate; forming at least one FeFET on the substrate in the first active area having a ferroelectric material including a HfO2-based material; and forming at least one logic FET alongside the at least one FeFET on the substrate in the second active area, wherein the at least one logic FET has a gate dielectric including the HfO2-based material. A FET device formed by the present techniques is also provided.

Abstract: Semiconductor devices and methods of forming the same include forming a first channel region on a first semiconductor region. A second channel region is formed on a second semiconductor region. The second semiconductor region is formed from a semiconductor material that is different from a semiconductor material of the first semiconductor region. A semiconductor cap is formed on one or more of the first and second channel regions. A gate dielectric layer is formed over the nitrogen-containing layer. A gate is formed on the gate dielectric.

Abstract: A method is presented for forming a semiconductor device. The method includes forming an oxygen containing interfacial layer on a semiconductor substrate, forming a hafnium oxide layer on the interfacial layer, the hafnium oxide layer crystallizing to a non-centrosymmetric phase in a final structure, forming a first electrode containing a scavenging metal, which reduces a thickness of the interfacial layer via an oxygen scavenging reaction in the final structure, on the hafnium oxide layer, and forming a second electrode on the first electrode.

Abstract: A tunable resistance device and methods of forming the same include a magnetic fixed layer having a fixed magnetization, a magnetic free layer, and a non-magnetic conductive layer directly between the magnetic fixed layer and the magnetic free layer. The magnetic fixed layer, the magnetic free layer, and the non-magnetic conductive layer are formed in a lattice of wires, with each wire in the lattice being formed from a stack of the magnetic fixed layer, the magnetic free layer, and the non-magnetic conductive layer.

Abstract: A tapered metal nitride structure having a gentle sloping (i.e., tapered) sidewall is provided that includes an oxygen rich metal nitride portion located between each metal nitride portion of a stack of metal nitride portions. The structure is formed by incorporating/introducing oxygen into an upper portion of a first metal nitride layer to form an oxygen rich metal nitride surface layer. A second nitride is then formed atop the oxygen rich metal nitride surface layer. The steps of oxygen incorporation/addition and nitride layer formation may be repeated any number of times. An etch mask is then provided and thereafter a sputter etch is performed to provide the tapered metal nitride structure. The tapered metal nitride structure may be used as an electrode in a semiconductor device.

Abstract: Semiconductor devices and methods of forming the same include forming a first channel region on a first semiconductor region. A second channel region is formed on a second semiconductor region. The second semiconductor region is formed from a semiconductor material that is different from a semiconductor material of the first semiconductor region. A semiconductor cap is formed on one or more of the first and second channel regions. A gate dielectric layer is formed over the nitrogen-containing layer. A gate is formed on the gate dielectric.

Abstract: Semiconductor devices and methods of making the same include forming a first channel region on a first semiconductor region. A second channel region is formed on a second semiconductor region, the second semiconductor region being formed from a semiconductor material that is different from a semiconductor material of the first semiconductor region. A gate dielectric layer is formed over one or more of the first and second channel regions. A nitrogen-containing layer is formed on the gate dielectric layer. A gate is formed on the gate dielectric.