Abstract: A lighting assembly for a light emitting diode (LED) package having an LED chip on the top of a mounting substrate with power leads on the top of the mounting substrate arranged proximate to a first edge of the mounting substrate, which is mounted to a base, includes power contacts defining separable interfaces for contacting the power leads on the mating substrate of the LED package and supplying power to the LED chip. The power contacts have compliant beams extending to the separable interfaces that are deflected when contacting the power leads such that the power contacts are biased against the power leads. The power contacts are terminated to corresponding power conductors opposite the separable interfaces. The lighting assembly also includes a dielectric housing holding the power contacts, with the housing having mounting features for securing the housing to the base independent of the LED package.

Abstract: Thermoplastic molding compositions, comprising A) from 10 to 95% by weight of a thermoplastic polyamide, B) from 5 to 90% by weight of an acrylate rubber, obtainable via free-radical-initiated aqueous emulsion polymerization of ethylenically unsaturated monomers in the presence of at least one dispersing agent and of at least one free-radical initiator, where the emulsion polymerization uses from 1 to 50% by weight of an alkene having from 5 to 12 carbon atoms [monomer A], and from 50 to 99% by weight of an ester based on an ?,?-monoethylenically unsaturated mono- or dicarboxylic acid having from 3 to 6 carbon atoms and on an alkanol having from 1 to 12 carbon atoms [monomer B], and also, if appropriate, up to 10% by weight of an ?,?-monoethylenically unsaturated mono- or dicarboxylic acid having from 3 to 6 carbon atoms and/or its amide [monomer C], and up to 30% by weight of an ?,?-ethylenically unsaturated compound different from the monomers A to C [monomer D], and the monomers A to D give a total of 10

Abstract: A socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB) with an LED mounted thereto. The LED package has a power contact configured to receive power from a power source to power the LED. The socket assembly also includes a socket housing having a receptacle that removably receives the LED package. The socket housing has a securing feature engaging the LED PCB to secure the LED PCB within the receptacle, where the securing feature is configured to release the LED PCB to remove the LED PCB from the receptacle. Optionally, the socket housing may include mounting features configured to mount the socket housing to a base, where the LED package is removable from the socket housing while the socket housing remains mounted to the base. A second LED package may be provided, where the LED package is removable from the receptacle and is replaced by the second LED package.

Abstract: A solid state lighting system includes an electronic driver having a power input configured to receive power from a power source and the electronic driver having a power output. The electronic driver controls the power supply to the power output according to a control protocol, and the electronic driver has at least one expansion port having a separable interface. The system also includes a light emitting diode (LED) subassembly having an LED board having at least one LED that receives power from the power output of the electronic driver to power the LED. The system further includes a first expansion module configured to be coupled to the at least one expansion port of the electronic driver having a first functionality affecting the control protocol, and a second expansion module configured to be coupled to the at least one expansion port of the electronic driver having a second functionality affecting the control protocol.

Abstract: A socket assembly includes a lighting package and a socket housing having a receptacle that removably receives the lighting package. A thermal management structure is coupled to the socket housing and is positioned at the receptacle in thermal engagement with the lighting package. The thermal management structure is configured to engage a heat sink to dissipate heat from the lighting package to the heat sink. Optionally, at least one of the socket housing and the thermal management structure may have mounting features configured to mount the socket assembly to a heat sink, where the lighting package is removable from the receptacle while the socket assembly remains mounted to the heat sink. The thermal management structure may be coupled to the socket housing such that the thermal management structure and the socket housing are coupled to a heat sink as a unit.

Abstract: The invention relates to an electrochemical sensor including a housing with a chamber containing an electrolyte, at least one measuring electrode for oxygen detection, at least one counter electrode and at least one reference electrode, wherein the sensor has a two-part diffusion barrier, wherein a first part of the barrier forms a labyrinth with a second part of the barrier disposed between the measuring and the counter electrode.

Abstract: Thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of at least one thermoplastic polyamide B) from 0.1 to 50% by weight of a copolymer obtainable via (i) preparation of at least one reaction mixture (a) via free-radical copolymerization of one or more monoethylenically unsaturated monomeric compound(s) (monomer(s) B1) with one or more compound(s) selected from the group of itaconic acid, mesaconic acid, fumaric acid, maleic acid, aconitic acid, glutaconic acid, and salts, esters, and anhydrides thereof (monomer(s) B2), and (ii) if appropriate, reaction of at least one of the copolymers obtained in step (i) with one or more crosslinking agent(s) (b), and C) from 0 to 60% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%.

Abstract: The epitaxial layer defects generated from voids of a silicon substrate wafer containing added hydrogen are suppressed by a method for producing an epitaxial wafer by: growing a silicon crystal by the Czochralski method comprising adding hydrogen and nitrogen to a silicon melt and growing from the silicon melt a silicon crystal having a nitrogen concentration of from 3×1013 cm?3 to 3×1014 cm?3, preparing a silicon substrate by machining the silicon crystal, and forming an epitaxial layer at the surface of the silicon substrate.

Abstract: A method for manufacturing a semiconductor device includes providing a semiconductor substrate including a first surface and a second surface which is arranged opposite to the first surface. The semiconductor substrate includes a plurality of trench structures extending from the first surface into the semiconductor substrate. The thickness of the semiconductor substrate is then reduced by removing semiconductor material at the second surface to obtain a processed second surface with exposed bottom portions of the trench structures. At least a first mask is formed on the processed second surface in a self-aligned manner with respect to the bottom portions of the trench structures, and doping regions are formed in the semiconductor substrate between the trench structures.

Abstract: A surface mount header is shown which may be mounted to a surface of a printed circuit board, where pins project away from the board. Alternatively, the surface mount header may be connected to a surface of a printed circuit board with the pins projecting downwardly through an opening in the board. Insulative sleeves surround the pins in order to protect the pins from contact with conductive paths within the board.

Abstract: Thermoplastic molding compositions comprising A) from 40 to 96.2% by weight of a semiaromatic polyamide, B) from 2 to 30% by weight of an impact-modifying polymer which comprises functional groups, C) from 1 to 50% by weight of fibrous or particulate fillers or a mixture of these, D) from 0.2 to 5% by weight of a lubricant, E) from 0.5 to 15% by weight of an electrically conductive additive, F) from 0 to 30% by weight of other added materials, where the total of the percentages by weight of components A) to F) is 100%.

Abstract: A multicoat system on a substrate, comprising at least one radiation-curable coating system (F) and at least one elastic intercoat (D) which is located between substrate and radiation-curable coating system (F) and has a glass transition temperature (Tg) of ?20° C. or less.

Abstract: A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.

Abstract: An oven lighting fixture includes an LED assembly or assemblies optically coupled with an optical guide member. The lighting fixture also includes a mounting bracket and a pair of electrical leadwires to connect the LED lighting fixture to an external voltage source. The LED assembly has an LED attached to a printed circuit board containing ancillary circuitry for powering the LED, and a heat sink for removing heat from the LED. The mounting bracket is attachable to a door of the oven cavity to support the LED lighting fixture adjacent to a sidelight window. The mounting bracket has a slot adjacent to the window for transmitting light from the LED through the light guide and into the oven cavity. Positioning the lighting fixture outside of the oven cavity and adjacent to the sidelight window permits the LED to operate within required temperature limits.

Abstract: Thermoplastic molding compositions comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.01 to 30% by weight of at least one highly branched or hyperbranched polyetheramine, C) from 0 to 70% by weight of further added materials, where the total of the percentages by weight of components A) to C) is 100%; the use of polyetheramines for improving the flowability and/or thermal stability of polyamides; and to the use of the molding compositions for the production of fibers, of foils, or of moldings of any type, and also to the resultant fibers, foils, or moldings.

Abstract: Thermoplastic molding compositions, comprising A) at least one thermoplastic polyester A, B) at least one graft polymer B of b1) a graft base of an elastomeric polymer B1 based on alkyl acrylates, ethylene/propylene, dienes, or on siloxanes, and with a glass transition temperature below 0° C., b2) a graft B2 composed of b21) styrene or of substituted styrenes B21 of formula I ?where R is alkyl or hydrogen and R1 is alkyl radical and n is 1, 2, or 3, or mixture, and b22) at least one unsaturated nitrile B22, C) at least one thermoplastic copolymer C of c1) styrene and/or of substituted styrenes C1 of formula I, and c2) at least one unsaturated nitrile C2, D) at least one copolymer D, obtainable via reaction of d1) at least one thermoplastic methacrylate polymer D1 comprising at least one of epoxy, carboxy, hydroxy, anhydride, or oxazoline, with d2) at least one thermoplastic polyester D2.

Abstract: The invention relates to a process for dyeing polyester fibre material according to the exhaust method, which process comprises the following steps: (a) pre-treatment of the fibre material with one or more surfactants, (b) dyeing with one or more disperse dyes, and (c) reductive after-treatment with a hydroxyalkylsulfinic acid or a hydroxyalkylsulfinic acid salt, wherein steps (a), (b) and (c) are carried out in succession in a single liquor.

Abstract: A process for preparing polyaryl ethers in which a polycondensation of the monomer building blocks is carried out using microwave irradiation leads to thermoplastic molding compositions having improved color properties.

Abstract: Branched polyaryl ether copolymers which are made up of the building blocks of the general formulae I and II where t, q: independently of one another, 0, 1, 2 or 3, m: from 0 to 4, n: from 1 to 4, Q, T, Y: independently of one another, each a chemical bond or group selected from among —O—, —S—, —SO2—, S?O, C?O, —N?N—, —RaC?CRb, —CRcRd—, Ar, Ar1: independently of one another, a C6—C18-aryl group which may be substituted by C1—C12-alkyl, C6—C18-aryl or C1—C12-alkoxy groups or halogen atoms, and, in addition, comprise from 0.1 to 10% by weight, based on the total weight of the copolymer, of building blocks B which are derived from compounds having at least three hydroxy functions, a process for preparing polyaryl ether copolymers, polymer blends comprising at least one polyaryl ether copolymer and membranes comprising at least one polyaryl ether copolymer.

Abstract: An end cap assembly for a light tube that has a circuit board with one or more solid state lighting devices mounted thereto and a lens covering the circuit board includes an end cap body having a lens engagement surface configured to engage the lens and an external mating interface configured to mate with a socket connector of a fixture. An end cap connector extends from the end cap body. The end cap connector holds contacts having first mating portions configured to be electrically connected to the circuit board and second mating portions configured to be electrically connected to the socket connector.