Abstract: A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a temperature sensor operatively connected to the LED assembly at a remote location that is remote from the LED junction. The temperature sensor is configured to measure a temperature of the LED assembly at the remote location. A temperature calculation module is operatively connected to the temperature sensor for receiving the measured temperature at the remote location from the temperature sensor. The temperature calculation module is configured to determine a junction temperature at the LED junction based on the measured temperature a the remote location.

Abstract: A thermoplastic molding composition containing A) at least one polyester, B) optionally one polycarbonate, C) a copolymer made of c1) styrene or of substituted styrenes of the formula I c2) at least one unsaturated nitrile, D) a copolymer made of d1) structural units deriving from one or more vinylaromatic monomers, d2) structural units deriving from one or more vinyl cyanides, d3) structural units deriving from one or more dicarboxylic anhydrides, and d4) optionally structural units deriving from other copolymerizable monomers.

Abstract: The present invention relates to a thermoplastic molding composition which comprises the following components: A) from 10 to 50% by weight of at least one polyarylene ether having an average of at most 0.5 phenolic end groups per polymer chain and having no carboxy groups, B) from 5 to 44.5% by weight of at least one polyphenylene sulfide, C) from 10 to 65% by weight of at least one fibrous and/or particulate filler, D) from 0.5 to 20% by weight of an elastic graphite, E) from 0 to 20% by weight of at least one polyarylene ether comprising carboxy groups, F) from 0 to 20% by weight of at least one polyarylene ether having an average of at least 1.5 phenolic end groups per polymer chain and having no carboxy groups, and G) from 0 to 40% by weight of at least one additive where the sum of the proportions by weight of components A) to G) is 100% by weight, based on the molding composition.

Abstract: The present invention relates to thermoplastic molding materials comprising the following components: (A) at least one polyarylene ether, (B) at least one polyarylene sulfide, (C) optionally at least one functionalized polyarylene ether comprising carboxyl groups, (D) at least one fibrous or particulate filler and (E) optionally further additives and/or processing assistants, the ratio of the apparent viscosity of the component (A) to that of the component (B), determined at 350° C. and a shear rate of 1150 s?1, being from 2.5 to 3.7.

Abstract: The present invention is directed to thin film composite membrane (TFC membrane) comprising a substrate layer (S) based on a sulfonated polymer, e.g. a sulfonated polyarylether, and a polyamide film layer (F) and further to a method for their preparation. Furthermore, the present invention is directed to osmosis processes, in particular to forward osmosis (FO) processes, using said membrane.

Abstract: An apparatus that has an electro-acoustic transducer, a frame supporting the transducer, and an enclosure made from two enclosure members that are each coupled to the frame. At least one of the enclosure members is made partially or entirely of foam.

Abstract: The present invention relates to thermoplastic molding materials comprising the following components: (A) at least one polyarylene ether, (B) at least one polyarylene sulfide, (C) at least one functionalized polyarylene ether comprising carboxyl groups having a viscosity number according to DIN EN ISO 1628-1 of 45 to 65 ml/g measured in 1% strength by weight solution in N-methyl-2-pyrrolidone at 25° C., (D) at least one fibrous or particulate filler and (E) optionally further additives and/or processing assistants. In addition, the present invention relates to a process for the preparation of the thermoplastic molding materials according to the invention, the use thereof for the production of shaped articles and the use of functionalized polyarylene ethers comprising carboxyl groups having a viscosity number according to DIN EN ISO 1628-1 of 45 to 65 ml/g measured in 1% strength by weight solution in N-methyl-2-pyrrolidone at 25° C.

Abstract: The present invention relates to processes for preparing copolymers A) with a reduced soil particle content, comprising 49.2 to 93.2% by weight of structural units which derive from one or more vinylaromatic monomers (component A1)), 6 to 50% by weight of structural units which derive from one or more vinyl cyanides (component A2)), 0.

Abstract: The invention relates to a process for the preparation of a hollow filament (F) based on one or several molten or dissolved hyperbranched polymers (P) and potentially one or several further polymers (FP), characterized in that the molten or dissolved hyperbranched polymer (P) or the mixture of the hyperbranched polymer (P) with the further polymer (FP) is passed through one or several spinnerets (S), wherein the ratio between the spinneret die-length (L) and the die-channel (Delta-D) is between 0.1 and 9.5. The process can be applied for the preparation of hyperbranched polyethersulfone (HPES) hollow filaments.

Abstract: A socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB) with an LED mounted thereto. The LED package has a power contact configured to receive power from a power source to power the LED. The socket assembly also includes a socket housing having a receptacle that removably receives the LED package. The socket housing has a securing feature engaging the LED PCB to secure the LED PCB within the receptacle, where the securing feature is configured to release the LED PCB to remove the LED PCB from the receptacle. Optionally, the socket housing may include mounting features configured to mount the socket housing to a base, where the LED package is removable from the socket housing while the socket housing remains mounted to the base. A second LED package may be provided, where the LED package is removable from the receptacle and is replaced by the second LED package.

Abstract: The epitaxial layer defects generated from voids of a silicon substrate wafer containing added hydrogen are suppressed by a method for producing an epitaxial wafer by: growing a silicon crystal by the Czochralski method comprising adding hydrogen and nitrogen to a silicon melt and growing from the silicon melt a silicon crystal having a nitrogen concentration of from 3×1013 cm?3 to 3×1014 cm?3, preparing a silicon substrate by machining the silicon crystal, and forming an epitaxial layer at the surface of the silicon substrate.

Abstract: An end cap assembly for a light tube that has a circuit board with one or more solid state lighting devices mounted thereto and a lens covering the circuit board includes an end cap body having a lens engagement surface configured to engage the lens and an external mating interface configured to mate with a socket connector of a fixture. An end cap connector extends from the end cap body. The end cap connector holds contacts having first mating portions configured to be electrically connected to the circuit board and second mating portions configured to be electrically connected to the socket connector.

Abstract: Semiconductor wafers of silicon are produced by pulling a single crystal growing on a phase boundary from a melt contained in a crucible and cutting of semiconductor wafers therefrom, wherein during pulling of the single crystal, heat is delivered to a center of the phase boundary and a radial profile of a ratio V/G from the center to an edge of the phase boundary is controlled, G being the temperature gradient perpendicular to the phase boundary and V being the pull rate. The radial profile of the ratio V/G is controlled so that the effect of thermomechanical stress in the single crystal adjoining the phase boundary, is compensated with respect to creation of intrinsic point defects. The invention also relates to defect-free semiconductor wafers of silicon, which can be produced economically by this method.

Abstract: The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) as component A, at least one thermoplastic matrix polymer selected from poly-amides, polyesters, polyacetals, and polysulfones, where this can also take the form of polymer blend, b) as component B, from 0.1 to 5% by weight of at least one highly branched or hyperbranched polymer which has functional groups which can react with the matrix polymer of component A, and c) as component C, from 0.1 to 15% by weight of conductive carbon fillers selected from carbon nanotubes, graphenes, carbon black, graphite, and mixtures thereof, with the exclusion of specific thermoplastic molding compositions.

Abstract: The present invention provides polymer blends comprising the components (a) from 40% to 95% by weight of at least one polyaryl ether copolymer constructed of (a1) from 50% to 99.9% by weight of building units of the general formula I and from 0% to 40% by weight of further building units II selected from segments of one or more thermoplastic polymers, and (a2) from 0.

Abstract: An LED connector assembly includes a housing having a cavity formed therein. A connector interface is positioned on the housing to receive electrical wiring from a power source. An LED package is provided having at least one LED die coupled thereto. The LED package is removably received in the cavity of the housing and retained using features in the LED package and housing. The LED package is electrically coupled to the connector interface to provide power to the at least one LED die.

Abstract: A socket assembly includes a lighting package and a socket housing having a receptacle that removably receives the lighting package. A thermal management structure is coupled to the socket housing and is positioned at the receptacle in thermal engagement with the lighting package. The thermal management structure is configured to engage a heat sink to dissipate heat from the lighting package to the heat sink. Optionally, at least one of the socket housing and the thermal management structure may have mounting features configured to mount the socket assembly to a heat sink, where the lighting package is removable from the receptacle while the socket assembly remains mounted to the heat sink. The thermal management structure may be coupled to the socket housing such that the thermal management structure and the socket housing are coupled to a heat sink as a unit.

Abstract: The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) at least one polyamide, copolyamide or a polyamide-comprising polymer blend as component A, b) from 0.1 to 10% by weight of carbon nanotubes, graphenes or mixtures thereof as component B, c) from 0.1 to 3% by weight of ionic liquids as component C, wherein the thermoplastic molding composition does not comprise any polyamide-12 units.

Abstract: The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) as component A, at least one polyamide or copolyamide, or one polymer blend comprising polyamide, b) as component B, from 3 to 20% by weight of carbon black or graphite, or a mixture thereof, c) as component C, from 0.1 to 3% by weight of ionic liquids.

Abstract: Thermoplastic molding compositions comprising A) from 10 to 69% by weight of a thermoplastic polyester B) from 30 to 79% by weight of an aluminum oxide C) from 0.01 to 10% by weight of an organic or inorganic acid or mixture of these D) from 0 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these E) from 0 to 50% by weight of other additives, where the entirety of the percentages by weight of components A) to E) gives 100%.