Abstract: Thermoplastic molding compositions comprising A) from 10 to 69% by weight of a thermoplastic polyester B) from 30 to 79% by weight of an aluminum oxide C) from 0.01 to 10% by weight of an organic or inorganic acid or mixture of these D) from 0 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these E) from 0 to 50% by weight of other additives, where the entirety of the percentages by weight of components A) to E) gives 100%.

Abstract: A method is provided for controlling operation of a pedal cycle (10) having a rear hub-mounted electro-mechanical transmission arrangement in which a chain-driven rear sprocket (80), an input electrical machine (120) and the hub (100) are each coupled to a respective branch of a three-branch epicyclic gear set (140). Allowing for natural variations in input torque by a cyclist over a cycle of the crank arms (50), a substantially constant current is caused to exist in the input electrical machine (120) such that a change in torque applied by the cyclist results in a change in transmission ratio between the rear sprocket (80) and the hub (100), thereby providing a form of automatic and continuously variable transmission for the pedal cycle (10).

Abstract: An electrical connector is provided including a housing having a receptacle for receiving a wire. A fixed contact is positioned within the housing and has a termination contact configured to electrically couple to a signal path. A moveable contact is electrically coupled to the fixed contact. The moveable contact has a contact interface for engaging the wire. The contact interface is moveable between a connection position, wherein the contact interface engages the wire, and a release position, wherein the contact interface is disengaged from the wire to enable the wire to be removed from the receptacle.

Abstract: The present invention relates to polyarylene ether block copolymers according to the general formula A-K—X—K-A, where —X— is a polyarylene ether segment with number-average molar mass of at least 5000 g/mol, and A- is a segment of the general structure R2NH—(R1—NH—CO—Ar—CO—NH)n—R1—NH—, in which R1 is a linear or branched alkylene group having from 2 to 12 carbon atoms and Ar is an arylene group having from 6 to 18 carbon atoms, and R2 is selected from aryloyl, alkyloyl, and H, and in which the number average of n is from 1 to 3, and there is a coupling group K of the structure —CO—Ar3—CO— linking each A to X, in which Ar13 is an aromatic group having from 6 to 18 carbon atoms. The present invention also relates to a process for the production of the polyarylene ether block copolymers of the invention, to polymer compositions comprising the polyarylene ether block copolymers of the invention, and also to the use thereof for the production of moldings, of films, of fibers, or of foams.

Abstract: A socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB) with an LED mounted thereto. The socket assembly also includes a clamp for holding the LED package to a support structure. The clamp includes a base that is configured to be mounted to the support structure such that the base engages the support structure. The clamp also includes a spring finger that extends from the base such that the base and the spring finger define a unitary body of the clamp. The spring finger is configured to engage the LED PCB of the LED package and apply a clamping force to the LED PCB that acts in a direction toward the support structure.

Abstract: The present invention relates to a mixture of at least two different dispersing agents, an aqueous dispersion containing a UV absorber selected from benzotriazoles, benzotriazines and benzophenones and a mixture of at least two different dispersing agents and a method for reducing the differential pressure in the static dyeing process.

Abstract: Thermoplastic molding compositions comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.01 to 30% by weight of at least one highly branched or hyperbranched polyetheramine, C) from 0 to 70% by weight of further added materials, where the total of the percentages by weight of components A) to C) is 100%; the use of polyetheramines for improving the flowability and/or thermal stability of polyamides; and to the use of the molding compositions for the production of fibers, of foils, or of moldings of any type, and also to the resultant fibers, foils, or moldings.

Abstract: A socket housing is provided for light emitting diode (LED) packages having an LED printed circuit board (PCB). The socket housing includes first and second housing segments that define a recess therebetween for receiving an LED package therein. The first and second housing segments are configured to engage the LED PCB of the LED package to secure the LED package within the recess. A relative position between the first and second housing segments is selectively adjustable such that a size of the recess is selectively adjustable for receiving differently sized LED packages therein.

Abstract: Lighting elements composed of thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of at least one thermoplastic polyester, B) from 0.1 to 50% by weight of at least one terpolymer, obtainable from b1) at least one vinylaromatic monomer, b2) at least one C1-C4-alkyl (meth)acrylate or (meth)acrylonitrile, and b3) from 0.1 to 10% by weight, based on the total weight of the components b1) to b3), of at least one monomer which comprises an ?,?-unsaturated anhydride, and C) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to C) is 100%.

Abstract: The present invention relates to molding compositions comprising (A) from 29 to 89% by weight of at least one polyarylene ether sulfone having an average number of phenolic end groups per chain of from 0 to 0.2, (B) from 0.5 to 20% by weight of a thermotropic polymer, (C) from 0.5 to 10% by weight of a polyarylene ether having predominantly OH end groups, (D) from 10 to 70% by weight of at least one fibrous or particulate filler, (E) from 0 to 40% by weight of additives or processing aids, where the total of the proportions by weight is 100% by weight, based on the thermoplastic molding composition.

Abstract: Semiconductor wafers composed of monocrystalline silicon and doped with nitrogen contain an OSF region and a Pv region, wherein the OSF region extends from the center radially toward the edge of the wafer as far as the Pv region; the wafer has an OSF density of less than 10 cm?2, a BMD density in the bulk of at least 3.5×108 cm?3, and a radial distribution of the BMD density with a fluctuation range BMDmax/BMDmin of not more than 3. The wafers are produced by controlling initial nitrogen content and maintaining oxygen within a narrow window, followed by a heat treatment.

Abstract: A process for producing an expandable pelletized polymeric material which comprises: a) providing a polymer component, consisting of a styrene polymer component having a glass transition temperature of ?130° C., formed from and one or more thermoplastic polymers selected from the group consisting of aromatic polyethers; polyolefins; polyacrylates; polycarbonates; polyesters; polyamides; polyether sulfones; polyether ketones and polyether sulfides, (b) heating the polymer component to form a polymer melt, (c) introducing a blowing agent component into the polymer melt to form a foamable melt, (d) homogenizing the mixture, (f) extruding the blowing agent-containing polymer melt through a die plate, (g) pelletizing the blowing agent-containing melt in a liquid-filled chamber to form a pelletized material.

Abstract: The present invention provides a footwear article with arch support and cushioning. The footwear article maybe in the form of a sandal including but not limited to a thong sandal, such as a flip flop.

Abstract: A process for preparing polyaryl ethers in which a polycondensation of the monomer building blocks is carried out using microwave irradiation leads to thermoplastic molding compositions having improved color properties.

Abstract: The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.

Abstract: An electrical connector is provided including a housing having a receptacle for receiving a wire. A fixed contact is positioned within the housing and has a termination contact configured to electrically couple to a signal path. A moveable contact is electrically coupled to the fixed contact. The moveable contact has a contact interface for engaging the wire. The contact interface is moveable between a connection position, wherein the contact interface engages the wire, and a release position, wherein the contact interface is disengaged from the wire to enable the wire to be removed from the receptacle.

Abstract: An optic assembly is provided. The assembly includes a housing having an upstream end and a downstream end. An LED is positioned in the upstream end of the housing. The LED is configured to generate excitation light therefrom. The excitation light has a first wavelength. An optic is positioned in the downstream end of the housing. The optic is positioned remotely from the LED so that a cavity is formed between the LED and the optic. The excitation light generated from the LED passes downstream through the cavity to the optic. Quantum dots are positioned on the optic. The excitation light excites the quantum dots so that the quantum dots produce emitted light having a second wavelength that is different than the first wavelength of the excitation light.

Abstract: Processes for producing thermoplastic molding compositions, which comprise a) from 3 to 79% by weight of one or more (methyl)styrene-acrylonitrile copolymers, which have no maleic-anhydride-derived units, b) from 15 to 91% by weight of one or more polyamides, c) from 5 to 50% by weight of one or more rubbers, d) from 1 to 25% by weight of one or more compatibilizers, e) from 0 to 2% by weight of one or more low-molecular-weight compounds which comprise a dicarboxylic anhydride group, f) from 0 to 50% by weight of one or more fibrous or particulate fillers, and g) from 0 to 40% by weight of further additives, by producing a melt comprising components A, B, and C in a first step and subsequently incorporating D, Also, thermoplastic molding compositions obtainable by these processes, the use of these thermoplastic molding compositions, and moldings, fibers, and foils comprising these thermoplastic molding compositions.

Abstract: A lighting assembly for a light emitting diode (LED) package having an LED chip on the top of a mounting substrate with power leads on the top of the mounting substrate arranged proximate to a first edge of the mounting substrate, which is mounted to a base, includes power contacts defining separable interfaces for contacting the power leads on the mating substrate of the LED package and supplying power to the LED chip. The power contacts have compliant beams extending to the separable interfaces that are deflected when contacting the power leads such that the power contacts are biased against the power leads. The power contacts are terminated to corresponding power conductors opposite the separable interfaces. The lighting assembly also includes a dielectric housing holding the power contacts, with the housing having mounting features for securing the housing to the base independent of the LED package.

Abstract: The invention relates to a thermoplastic molding composition containing at least one polyester, a compound of the formula (I) a mixture of compounds of the formula (II) and optionally additional compounds and additives. The invention further relates to the use of the thermoplastic molding composition for the producing fibers, foils and moldings. The invention further relates to fibers, foils and moldings containing the thermoplastic molding composition.