Abstract: The present invention relates to a process for the production of low-halogen-content polybiphenyl sulfone polymers, to the resultant polybiphenyl sulfone polymers, to polybiphenyl sulfone polymers having less than 400 ppm content of polymer-bonded halogen, to thermoplastic molding compositions comprising these polybiphenyl sulfone polymers, and to their use for the production of moldings, of fibers, of films, of membranes, or of foams.

Abstract: An electrochemical gas sensor includes an electrolyte including at least one ionic liquid which includes an additive portion including at least one organic additive, at least one organometallic additive or at least one inorganic additive.

Abstract: The invention provides a polycrystalline silicon rod having a total diameter of at least 150 mm, including a core A having a porosity of 0 to less than 0.01 around a thin rod, and at least two subsequent regions B and C which differ in porosity by a factor of 1.7 to 23, the outer region C being less porous than region B.

Abstract: The present invention relates to a process for the production of low-chlorine-content polybiphenyl sulfone polymers, to the polybiphenyl sulfone polymers obtainable in this way, to polybiphenyl sulfone polymers with less than 800 ppm content of organically bonded chlorine, to thermoplastic molding compositions and moldings, fibers, films, membranes, or foams comprising the polybiphenyl sulfone polymers mentioned, and also to their use for the production of moldings, of fibers, of films, of membranes, or of foams.

Abstract: A relay connector assembly configured to electrically connect a power supply and a load includes a housing having a bottom configured to be mounted to a circuit board, the housing having contact cavities. Power contacts are received in corresponding contact cavities and held by the housing. The power contacts have relay tab ends and terminating ends having interfaces configured to be terminated to high current power conductors of either the power supply or the load. A relay is coupled to the housing. The relay has coil contacts configured to be electrically connected to a coil circuit of the circuit board used to energize the relay. The relay has relay tabs being terminated to the relay tab ends of corresponding power contacts. The relay electrically connects corresponding power contacts when the relay is energized.

Abstract: The present invention relates to a process for the production of low-chlorine-content polybiphenyl sulfone polymers, to the polybiphenyl sulfone polymers obtainable in this way, to polybiphenyl sulfone polymers with less than 800 ppm content of organically bonded chlorine, to thermoplastic molding compositions and moldings, fibers, films, membranes, or foams comprising the polybiphenyl sulfone polymers mentioned, and also to their use for the production of moldings, of fibers, of films, of membranes, or of foams.

Abstract: Molding compositions comprising: a composition (I) present in an amount of 10 to 100% by weight, based on the molding composition, wherein the composition (I) comprises: (A) 40 to 95% by weight, based on the composition (I), of a copolymer comprising: ?-methylstyrene in an amount of 55 to 90% by weight, acrylonitrile in an amount of 10 to 50% by weight, and one or more other monomers in an amount of 0 to 5% by weight, wherein the percentages by weight of the ?-methylstyrene, the acrylonitrile and the one or more other monomers are based on the weight of component (A); (B) 2.5 to 75% by weight, based on the composition (I), of a polymer comprising: a vinylaromatic monomer in an amount of 60 to 90% by weight, acrylonitrile in an amount of 8.01 to 39.8% by weight, and maleic anhydride in an amount of 0.2 to 1.99% by weight, wherein the percentages by weight of the vinylaromatic monomer, the acrylonitrile and the maleic anhydride are based on the weight of component (B); and (C) 2.

Abstract: The present invention relates to a process for preparing a block copolymer comprising polyarylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated polyarylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.

Abstract: The invention relates to a bearing arrangement (1), in particular for bearing the carrying shaft (30) of a parabolic trough collector (26), having a disc- or ring-shaped component (3), at least one support roller (5), which radially fixes the component (3) and on which the component (3) rolls on the circumferential side during rotation about a rotation axis (2), and a support structure (6), on which the support roller (5) is mounted by a radial sliding bearing (8). According to the invention, the lateral surface (12) of the support roller (5) which receives the component (3) has a convex curve in the axial direction. The invention further relates to parabolic trough collector (26) mounted on a plurality of such bearing arrangements (1).

Abstract: The invention provides a polycrystalline silicon rod having a total diameter of at least 150 mm, including a core A having a porosity of 0 to less than 0.01 around a thin rod, and at least two subsequent regions B and C which differ in porosity by a factor of 1.7 to 23, the outer region C being less porous than region B.

Abstract: A thermoplastic moulding compound that has proved to be extremely weather-resistant and low-emission containing the following components: A) 3-77% by weight of one or more styrene copolymers, component A; B) 15-89% by weight of one or more polyamides, component B; C) 5-50% by weight of two or more graft rubbers without olefinic double bonds in the rubber phase, component C; D) 1-25% by weight of a terpolymer of styrene, acrylonitrile and maleic anhydride, component D; E) 2-30% by weight of rubber based on olefinic monomers, component E; F) 0-50% by weight of fibrous or particulate filler or mixtures thereof, component F; G) 0-40% by weight of further additives, component G.

Abstract: A light bulb assembly includes a bulb housing that is configured to be connected to a light bulb socket. A light bulb is held by the bulb housing and includes a printed circuit board (PCB). The assembly includes an electrical connector having a connector housing, a negative terminal of the light bulb assembly, and a positive terminal of the light bulb assembly. The electrical connector is mounted to the PCB such that the positive terminal and the negative terminal are electrically connected to the PCB. The negative terminal is configured to mate with a corresponding negative terminal of the light bulb socket. The positive terminal is configured to mate with a corresponding positive terminal of the light bulb socket.

Abstract: A light bulb assembly includes a bulb housing that is configured to be mounted to a base that includes an electrically conductive shell configured to be connected to a light bulb socket. The shell defines a negative terminal of the light bulb assembly. A light bulb is held by the bulb housing and includes a printed circuit board (PCB). The assembly includes an electrical connector having a connector housing, a negative contact, and a positive terminal of the light bulb assembly. The electrical connector is mounted to the PCB such that the positive terminal and the negative contact are electrically connected to the PCB. The negative contact is configured to mate with the shell of the base. The positive terminal is configured to be exposed for mating with a corresponding terminal of the light bulb socket when the bulb housing is mounted to the base.

Abstract: The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.

Abstract: A thermoplastic molding composition, comprising: A) from 40 to 97.9% by weight of at least one polyether sulfone, B) from 2 to 59.9% by weight of at least one polysulfone, C) from 0.1 to 2% by weight of stearic acid, and also, if appropriate, further additives and auxiliaries, has improved flowability, surface quality, and notched impact resistance, and can be used for the construction of headlamps.

Abstract: The thermoplastic molding composition comprises a) as component A, from 3 to 78% by weight of one or more styrene copolymers which have no units derived from maleic anhydride, b) as component B, from 15 to 90% by weight of one or more polyamides, c) as component C, from 5 to 50% by weight of one or more impact-modifying graft rubbers without olefinic double bonds in the rubber phase, d) as component D, from 1 to 25% by weight of one or more styrene copolymers which have, based on the entire component D, from 0.5 to 5% by weight of units derived from maleic anhydride, e) as component E, from 1 to 30% by weight of one or more further rubbers based on olefinic monomers without core-shell structure, and having at least 0.1% by weight of functional monomers, f) as component F, from 0 to 50% by weight of one or more fibrous or particulate fillers, g) as component G, from 0 to 40% by weight of further additives, where the entire amount of components A to E and, if appropriate, F and G is 100% by weight.

Abstract: The invention relates to a thermoplastic molding composition containing at least one polyester, a compound of the formula (I) a mixture of compounds of the formula (II) and optionally additional compounds and additives. The invention further relates to the use of the thermoplastic molding composition for the producing fibers, foils and moldings. The invention further relates to fibers, foils and moldings containing the thermoplastic molding composition.

Abstract: A solid state lighting system includes an electronic driver having a power input configured to receive power from a power source and the electronic driver having a power output. The electronic driver controls the power supply to the power output according to a control protocol, and the electronic driver has at least one expansion port having a separable interface. The system also includes a light emitting diode (LED) subassembly having an LED board having at least one LED that receives power from the power output of the electronic driver to power the LED. The system further includes a first expansion module configured to be coupled to the at least one expansion port of the electronic driver having a first functionality affecting the control protocol, and a second expansion module configured to be coupled to the at least one expansion port of the electronic driver having a second functionality affecting the control protocol.

Abstract: The thermoplastic molding composition comprises: a) as component A, from 0 to 97.9% by weight of one or more (methyl)styrene-acrylonitrile copolymers which do not have any units derived from maleic anhydride, and which have an intrinsic viscosity smaller than 85 ml/g, b) as component B, from 1 to 98.9% by weight of one or more (methyl)styrene-acrylonitrile copolymers which have, based on the entire component B, from 0.5 to 5% by weight of units derived from maleic anhydride, c) as component C, from 1 to 75% by weight of glass fibers, d) from 0.1 to 20% by weight of one or more flow promoters, selected from d1) as component D1, at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), d2) as component D2, at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.

Abstract: A connectorized wireless node used to distribute power and control devices in a system. The connectorized wireless node includes a housing, power control circuitry and wireless control circuitry. The power control circuitry is provided in the housing and distributes power to the devices. The wireless control circuitry is provided in the housing and receives wireless signals which contain control information. The wireless control circuitry cooperates with the power control circuitry to control the devices within a system.