Abstract: Compact systems, compact devices and methods are provided to sense changes in luminescence due to environmental influences on a luminescent material. Such systems, devices and methods may be implemented in a compact device, e.g., an integrated circuit package, which may be incorporated into or attached to a device, such as a smartphone, watch, flashlight, vehicle, etc. The systems, devices, and methods described herein are useful in sensing luminescence, as well as changes in luminescence that are indicative of environmental influences, such as the presence and concentration of a gas or chemical, ambient temperature, pressure, light, etc., in an area surrounding a luminescent material included in a compact device.

Abstract: Embedded Wafer-Level Packaging (eWLP) methods and optoelectronic devices, packages and assemblies made by the eWLP methods are described. The eWLP methods allow electrical interconnections to be easily and economically made to the back sides of the chips of the eWLP wafer using eWLP wafer-level processes, thereby eliminating the need to use TMVs or TSVs to make such interconnections. The eWLP methods also allow thermal and optical interconnections between the back side and the front side of the eWLP wafer to be easily and economically made. In addition, the eWLP methods allow electrical and optical interfaces to be formed on the front side and/or on the back side of the eWLP wafer. The eWLP methods may be used to form a variety of very thin optoelectronic devices, packages and assemblies having a various useful configurations with high volume, yield and throughput.

Abstract: A photodetector integrated circuit (IC) having an electromagnetic interference (EMI) sensor integrated therein is provided for sensing EMI at the photodetector. Integrating the EMI sensor into the photodetector IC ensures that the EMI sensor is in proximity to the photodetector so that any EMI that is sensed is actually EMI to which the photodetector is exposed. The sensed EMI may then be used for a number of reasons, such as to determine the root cause of damage to circuitry of the system, to determine the point in time at which an EMI event occurred, or to trigger a warning when a determination is made that an EMI limit has been reached.

Abstract: Compact systems, compact devices and methods are provided to sense changes in luminescence due to environmental influences on a luminescent material. Such systems, devices and methods may be implemented in a compact device, e.g., an integrated circuit package, which may be incorporated into or attached to a device, such as a smartphone, watch, flashlight, vehicle, etc. The systems, devices, and methods described herein are useful in sensing luminescence, as well as changes in luminescence that are indicative of environmental influences, such as the presence and concentration of a gas or chemical, ambient temperature, pressure, light, etc., in an area surrounding a luminescent material included in a compact device.

Abstract: A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another.

Abstract: Embedded Wafer-Level Packaging (eWLP) methods and optoelectronic devices, packages and assemblies made by the eWLP methods are described. The eWLP methods allow electrical interconnections to be easily and economically made to the back sides of the chips of the eWLP wafer using eWLP wafer-level processes, thereby eliminating the need to use TMVs or TSVs to make such interconnections. The eWLP methods also allow thermal and optical interconnections between the back side and the front side of the eWLP wafer to be easily and economically made. In addition, the eWLP methods allow electrical and optical interfaces to be formed on the front side and/or on the back side of the eWLP wafer. The eWLP methods may be used to form a variety of very thin optoelectronic devices, packages and assemblies having a various useful configurations with high volume, yield and throughput.

Abstract: A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another.

Abstract: A semiconductor device package is formed by mounting a semiconductor die on an adhesive tape substrate, mounting a sacrificial structure on the adhesive tape substrate, applying molding material on the adhesive tape substrate to embed the die and at least a portion of the at least one sacrificial structure; removing the adhesive tape substrate to define a package assembly, forming a redistribution layer on a surface of the package assembly, and removing sacrificial material to form a void in the molding material having a shape corresponding to a shape of the sacrificial material that was removed.

Abstract: A photodetector integrated circuit (IC) having an electromagnetic interference (EMI) sensor integrated therein is provided for sensing EMI at the photodetector. Integrating the EMI sensor into the photodetector IC ensures that the EMI sensor is in proximity to the photodetector so that any EMI that is sensed is actually EMI to which the photodetector is exposed. The sensed EMI may then be used for a number of reasons, such as to determine the root cause of damage to circuitry of the system, to determine the point in time at which an EMI event occurred, or to trigger a warning when a determination is made that an EMI limit has been reached.

Abstract: An electronic display includes a light source system and a light guide system, where the light guide system emits light features laterally, i.e., from the side, at selected positions along its length. The light source system includes one or more electronically controllable light sources and further includes optical switches or other arrangements for coupling the light sources to the optical fibers or other light guides of the light guide system. The light source system can sequentially or progressively increase the selected longitudinal position at which the light feature is emitted, resulting in the appearance of movement of the light feature along the length of the light guide system.

Abstract: A sputter target includes a sputter material made of an alloy or a material mixture composed of at least two components which are in a state of thermodynamic disequilibrium. The components are compacted by an isostatic or uniaxial cold-pressing process.

Abstract: A communication arrangement and a method are provided for bidirectionally transmitting data between a first communication unit and a second communication unit. The first communication unit and the second communication unit are connected to one another via a fiber-optic link. In addition, the first communication unit and the second communication unit have a nonoptical link between them. Data in one transmission direction is transmitted via the fiber-optic link and data in the other transmission direction is transmitted via the nonoptical link.

Abstract: A tubular target is provided having a cylindrical carrier tube, at least one target tube arranged on its exterior surface, and a connecting layer arranged between the target tube and the carrier tube. The connecting layer is electrically conductive and has a wetting degree of >90%.

Abstract: An electronic display includes a light source system and a light guide system, where the light guide system emits light features laterally, i.e., from the side, at selected positions along its length. The light source system includes one or more electronically controllable light sources and further includes optical switches or other arrangements for coupling the light sources to the optical fibers or other light guides of the light guide system. The light source system can sequentially or progressively increase the selected longitudinal position at which the light feature is emitted, resulting in the appearance of movement of the light feature along the length of the light guide system.

Abstract: A sputter target is provided having a sputter material based on TiO2 and made such that the sputter material contains 15-60 mol. % Nb2O5. A method for the production of the sputter target includes the following steps: mixing of TiO2 and Nb2O5 powder in a liquid slurry; spray granulating this slurry to form TiO2:Nb2O5 mixed oxide granulate; and plasma spraying this granulate onto a sputter target base body.

Abstract: An electrically conductive titanium dioxide sputter target with an electrical resistivity of less than 5 ?-cm, which contains as an additive at least one doping agent or a mixture of doping agents in an amount of less than 5 mole %. The doping agent or agents are selected from the group including indium oxide, zinc oxide, bismuth oxide, aluminum oxide, gallium oxide, antimony oxide, and zirconium oxide. This treatment renders the titanium dioxide sputter target suitable for use in a direct-current sputtering process without any negative effects on the properties of the coating.

Abstract: An arrangement for connecting the terminal contacts of an optoelectronic component to electrical contacts of a printed circuit board using a flexible conductor arrangement. The flexible conductor arrangement has a planar form and includes a plurality of interconnects that are arranged to provide an electrical connection between the terminal contacts of the optoelectronic component and the electrical contacts of the printed circuit board. The flexible conductor arrangement is bent in such a way that, starting from the printed circuit board, it is led around the optoelectronic component and contacts the latter on a side facing away from the printed circuit board.

Abstract: An optoelectronic transceiver for a bidirectional optical signal transmission including a housing having a width of at most 13.5 mm, a first bidirectional optical subassembly arranged in the housing and serving for the simultaneous emission and reception of optical signals, a second bidirectional optical subassembly arranged in the housing and serving for the simultaneous emission and reception of optical signals, and an optical interface for the coupling of two optical waveguides, it being possible for a respective optical waveguide to be optically coupled to a subassembly. The invention enables a simultaneous bidirectional data transmission on both ports of the transceiver and thus an increase in the transmission capacity of the transceiver.

Abstract: A material mixture is produced having a cobalt-based alloy as the predominant component and an additional component of at least TiOx. The material mixture may be formed into a sputter target by hot pressing.

Abstract: Disclosed are microarrays comprising a plurality of oligonucleotide species capable of hybridizing to a polynucleotide comprising a sequence encoding at least a portion of a light chain variable region or a complement thereof. Also disclosed are methods of identifying light chain variable genes associated with a disease, methods of diagnosing a disease and methods of monitoring a disease. Methods of evaluating the ability of a therapeutic agent or a treatment to alter expression of the light chain variable gene are also provided.