Patents by Inventor Martin Weigert

Martin Weigert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6860621
    Abstract: An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: March 1, 2005
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Bernhard Bachl, Günter Kirchberger, Franz Schellhorn, Martin Weigert
  • Publication number: 20040258367
    Abstract: The present invention relates to an electrooptical module that efficiently employs optical bandwidth. The invention includes two or electrooptical components that are in an optical free-beam connection with an optical waveguide using at least one respective lens.
    Type: Application
    Filed: March 26, 2004
    Publication date: December 23, 2004
    Inventors: Martin Weigert, Bemhard Bachl, Ralf Ehrlich, Gregor Ploger
  • Publication number: 20040202478
    Abstract: The invention relates to an electro-optical module for transmitting and/or receiving optical signals of at least two optical data channels which are guided in an optical waveguide. The module includes at least one transmission component and at least one reception component. According to the invention, the optical waveguide is formed as a single waveguide piece with a bevelled end face which has a wavelength-selective filter or is connected to such a filter. Light from one data channel is reflected at the wavelength-selective filter and coupled out at an angle to the optical axis of the waveguide piece. Light of the other data channel passes through the wavelength-selective filter and enters the bevelled end face. A free beam region is formed between the bevelled end face and the transmission and reception components.
    Type: Application
    Filed: February 10, 2004
    Publication date: October 14, 2004
    Inventors: Lutz Melchior, Volker Plickert, Martin Weigert, Thomas Murphy
  • Publication number: 20040094283
    Abstract: A process for producing a sputtering target from a silicon-based alloy with an aluminum content of 5-50 wt. %. The target material is produced by a casting technique in which the material is melted and vacuum-cast, such that the casting is carried out in a hollow cylindrical casting mold.
    Type: Application
    Filed: September 3, 2003
    Publication date: May 20, 2004
    Applicant: W.C. Heraeus GmbH & Co. KG
    Inventors: Martin Weigert, Josef Heindel, Uwe Konietzka
  • Patent number: 6733189
    Abstract: An electrooptical transmitting and/or receiving module has a lead frame and an optoelectronic transducer mounted thereon. The lead frame and the optoelectronic transducer are potted by a shaped body made from transparent, formable material. Introduced into the shaped body is a reflector element. A radiation beam emitted by a transmitter, or a received radiation beam to be directed onto a receiver is deflected at a prescribed angle by the reflector element. The module can be used in an electrooptical transmitting and/or receiving unit which is constructed as a sidelooker. A method is also provided for molding the electrooptical transmitting and/or receiving module.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: May 11, 2004
    Assignee: Infineon Technologies AG
    Inventors: Hans Hurt, Gustav Müller, Martin Weigert, Josef Wittl
  • Patent number: 6693312
    Abstract: A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90° on the rod-shaped element with the reflective coating and traverses the submount.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: February 17, 2004
    Assignee: Infineon Technologies AG
    Inventors: Ralf Dietrich, Mathias Kämpf, Wolfgang Gramann, Martin Weigert
  • Publication number: 20030183508
    Abstract: The target material for a sputtering target for depositing silicon layers in their nitride or oxide form by means of reactive cathode atomization, such as e.g. Si3N4 or SiO2 in the form of optical functional layers or in the form of thermal protective layers on glass substrates, is a cast silicon element, that has been solidified from the melt condition and which forms a parallelepiped, with a dopant, that has been mixed in with the melt, whereby the dopant is 1 wt % to 15 wt % aluminum, and whereby the casting mold preferably has a cavity which forms a parallelepiped.
    Type: Application
    Filed: March 25, 2003
    Publication date: October 2, 2003
    Inventors: Martin Weigert, Uwe Konietzka
  • Publication number: 20030142500
    Abstract: An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.
    Type: Application
    Filed: January 10, 2003
    Publication date: July 31, 2003
    Inventors: Bernhard Bachl, Gunter Kirchberger, Franz Schellhorn, Martin Weigert
  • Publication number: 20030138009
    Abstract: A laser device has a laser diode with an optical resonator. The resonator has an exit side for emitting light into an optical system. A monitor diode is provided and has a light-sensitive face for measuring optical quantities of the laser diode. The light-sensitive face of the monitor diode is optically coupled to a backside of the laser diode, on the other side from the light exit side of the resonator, the backside also emitting light. This configuration permits a space-saving SMD layout for the laser device.
    Type: Application
    Filed: January 9, 2003
    Publication date: July 24, 2003
    Inventors: Martin Weigert, Gunther Steinle, Hans-Dietrich Wolf, Hans-Ludwig Althaus
  • Patent number: 6581669
    Abstract: The target material for a sputtering target for depositing silicon layers in their nitride or oxide form by means of reactive cathode atomization, such as e.g. Si3N4 or SiO2 in the form of optical functional layers or in the form of thermal protective layers on glass substrates, is a cast silicon element, that has been solidified from the melt condition and which forms a parallelepiped, with a dopant, that has been mixed in with the melt, whereby the dopant is 1 wt % to 15 wt % aluminum, and whereby the casting mold preferably has a cavity which forms a parallelepiped.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: June 24, 2003
    Assignee: W.C. Heraeus GmbH & Co., KG
    Inventors: Martin Weigert, Uwe Konietzka
  • Patent number: 6576150
    Abstract: An etching mask with at least one etching window is applied on a glass object consisting substantially of boron silicate glass. Subsequently, the glass object is etched through the etching window by using, for instance, HF, thereby producing trapezoidal trenches or truncated pyramidal grooves in its cross-section.
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: June 10, 2003
    Assignee: Infineon Technologies AG
    Inventor: Martin Weigert
  • Publication number: 20030103857
    Abstract: A sputter target produced from an alloy powder, the individual particles of which are composed of an Si—Al alloy. It is found that a high degree of homogeneity of the sputter target can be achieved in this way.
    Type: Application
    Filed: August 19, 2002
    Publication date: June 5, 2003
    Applicant: W.C. Heraeus GmbH & Co. KG
    Inventors: Josef Heindel, Christoph Simons, Martin Weigert
  • Patent number: 6572280
    Abstract: A module essentially includes a module housing, into which is introduced a lead frame. An electro-optical transducer is mounted on the lead frame. The interior of the module housing is filled with a transparent potting compound. A plug receptacle part is moulded onto the outer housing wall and has a defined outer contour. Situated in the interior of the plug receptacle part is an optical waveguide piece, which proceeding from the surroundings of an outer area of the plug receptacle part, extends through the interior of the plug receptacle part and through a housing opening right into the housing interior. The optical waveguide piece is optically coupled to the electro-optical transducer. An optical waveguide plug interacting with the module has a sleeve-shaped plug section corresponding to the plug receptacle part.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: June 3, 2003
    Assignee: Infineon Technologies AG
    Inventors: Hans Hurt, Gustav Müller, Martin Weigert, Josef Wittl
  • Patent number: 6550982
    Abstract: An optoelectronic module is disclosed, which can be connected optically and electrically in a simply way. The optoeletronic module consists of a SMD-housing (1) for the electrical connection and a connector (5), on which a MT-plug is fitted, for the optical connection. The SMD-housing is assigned to the MT-plug. It includes a plug connector (5), which contains the optical/electrical interface and is positively fixed in the housing.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: April 22, 2003
    Assignee: Infineon Technologies AG
    Inventors: Albert Auburger, Hans Hurt, Bernd Waidhas, Joachim Reill, Gerhard Kuhn, Martin Weigert, Markus Wicke, Peter Gattinger
  • Publication number: 20030057443
    Abstract: A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90° on the rod-shaped element with the reflective coating and traverses the submount.
    Type: Application
    Filed: July 22, 2002
    Publication date: March 27, 2003
    Inventors: Ralf Dietrich, Mathias Kampf, Wolfgang Gramann, Martin Weigert
  • Publication number: 20030038028
    Abstract: An electrically conductive titanium dioxide sputter target with an electrical resistivity of less than 5 &OHgr;-cm, which contains as an additive at least one doping agent or a mixture of doping assents in an amount of less than 5 mole %. The doping agent or agents are selected from the group including indium oxide, zinc oxide, bismuth oxide, aluminun oxide, gallium oxide, antimony oxide, and zirconium oxide. This treatment renders the titanium dioxide sputter target suitable for use in a direct-current sputtering process without any negative effects on the properties of the coating.
    Type: Application
    Filed: August 19, 2002
    Publication date: February 27, 2003
    Applicant: W. C. Heraeus GmbH & Co. KG
    Inventors: Markus Schultheis, Christoph Simons, Martin Weigert
  • Publication number: 20030007749
    Abstract: An electrooptical transmitting and/or receiving module has a lead frame and an optoelectronic transducer mounted thereon. The lead frame and the optoelectronic transducer are potted by a shaped body made from transparent, formable material. Introduced into the shaped body is a reflector element. A radiation beam emitted by a transmitter, or a received radiation beam to be directed onto a receiver is deflected at a prescribed angle by the reflector element. The module can be used in an electrooptical transmitting and/or receiving unit which is constructed as a sidelooker. A method is also provided for molding the electrooptical transmitting and/or receiving module.
    Type: Application
    Filed: August 2, 2002
    Publication date: January 9, 2003
    Inventors: Hans Hurt, Gustav Muller, Martin Weigert, Josef Wittl
  • Publication number: 20030007753
    Abstract: A module essentially includes a module housing, into which is introduced a lead frame. An electro-optical transducer is mounted on the lead frame. The interior of the module housing is filled with a transparent potting compound. A plug receptacle part is moulded onto the outer housing wall and has a defined outer contour. Situated in the interior of the plug receptacle part is an optical waveguide piece, which proceeding from the surroundings of an outer area of the plug receptacle part, extends through the interior of the plug receptacle part and through a housing opening right into the housing interior. The optical waveguide piece is optically coupled to the electro-optical transducer. An optical waveguide plug interacting with the module has a sleeve-shaped plug section corresponding to the plug receptacle part.
    Type: Application
    Filed: July 18, 2002
    Publication date: January 9, 2003
    Inventors: Hans Hurt, Gustav Muller, Martin Weigert, Josef Wittl
  • Patent number: 6409397
    Abstract: A surface mounted, fiber-optic transmitting or receiving component, is formed from a beam deflection device which has two assemblies, in such a way that relative adjustment is possible before a fixed joint is produced between the assemblies. Due to the adjustment capability, fluctuations, due to manufacturing tolerances, in a distance between an optical fiber and a mounting surface can be compensated for.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: June 25, 2002
    Assignee: Infineon Technologies AG
    Inventor: Martin Weigert
  • Publication number: 20020021871
    Abstract: An optoelectronic surface-mountable module includes an optoelectronic component mounted on a transparent substrate. The optoelectronic component is connected to internal electrical connections which are coupled via electrical leads to external electrical connections. The external electrical connections define a light entry or exit opening. The external electrical connections are formed by a BGA, a lead frame or a plastic support with through contacts. An optical waveguide can be coupled to a circuit board of an optoelectronic coupling unit containing the module.
    Type: Application
    Filed: July 18, 2001
    Publication date: February 21, 2002
    Inventors: Albert Auburger, Hans Hurt, Bernd Waidhas, Joachim Reill, Gerhard Kuhn, Martin Weigert, Markus Wicke, Peter Gattinger