Abstract: A sputter target is provided having a sputter material made of a silver alloy comprising silver and at least one further element selected from the group of Mg, Ca, Co, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, and Lu. The at least one further element is present in the alloy in a proportion of >50 at. ppm, respectively, and a total proportion of the group of <5 at. %. The sputter targets may be used to produce a glass substrate having a thermal insulation layer.

Abstract: A method for optical coupling an optical waveguide to an optical unit arranged in or on an optical module, a corresponding optical module, coupling element, and a kit of coupling elements is provided. The optical module has a reference geometry which defines a first axis of symmetry. Any offset between a first optical axis of the optical unit and the axis of symmetry of the reference geometry is determined. A coupling element corrects the offset and has an input/output area on opposite faces having offset second and third optical axes. Light input along the second optical axis is guided in the coupling element and output along the third optical axis, and vice versa. Once assembled, the center axis of the coupling element coincides with the axis of symmetry of the optical module, and the first optical axis of the optical unit and second optical axis of the coupling element coincide.

Abstract: The invention relates to an optoelectronic arrangement having a laser component. There are provided: a cooling device of small design for cooling the laser component down to a constant temperature, a device for the direct optical detection of the emitted wavelength of the laser component, whose signal is used to control the cooling device, and a package of small design with an extent of at most 6.5 mm perpendicular to the optical axis of the laser component and in which the above named components are arranged. The invention also relates to a method for controlling the emitted wavelength of a laser component.

Abstract: An optoelectronic arrangement having a surface-mountable semiconductor module having at least one optoelectronic transmitting and/or receiving unit, a housing, in which the optoelectronic transmitting and/or receiving unit is arranged, and a mounting side of the housing, which, in the case of surface mounting of the semiconductor module on a printed circuit board, faces the printed circuit board. The arrangement furthermore has a cooling element, which is thermally coupled to the semiconductor module for the purpose of cooling the optoelectronic transmitting and/or receiving unit. The cooling element is arranged on a side of the housing that is remote from the mounting side.

Abstract: An optoelectronic component with an optoelectronic transducer device and an electrical circuit electrically connected to the transducer device mounted on a carrier substrate which is optically transparent for specific wavelengths. The transducer device is arranged on the front side of the carrier substrate, and light coupling takes place through the back side. The electrical circuit is formed as a circuit integrated into the carrier substrate or is formed on the carrier substrate using hybrid technology, the terminal contacts of the circuit being arranged on the front side of the carrier substrate. An optoelectronic arrangement with an optoelectronic component includes an at least partly planar-formed mounting element, which is connected by its one side to an outer side of the component or is integrated in the latter and extends at least as far as an outer edge of the component, and includes a mechanical interface for the mechanical connection of the component.

Abstract: A sputtering target and a process for producing a sputtering target from a silicon-based alloy with an aluminum content of more than 6 wt. % up to 50 wt. %. Preferably, the aluminum content of the alloy is at least 8 wt. %, but no more than 30 wt. %. The target material is produced by a casting technique in which the material is melted and vacuum-cast, such that the casting is carried out in a hollow cylindrical casting mold.

Abstract: The invention relates to a communication arrangement and a method for bidirectionally transmitting data between a first communication unit and a second communication unit. The first communication unit and the second communication unit are connected to one another via a fiber-optic link. In addition, the first communication unit and the second communication unit have a nonoptical link between them, wherein data in one transmission direction is transmitted via the fiber-optic link and data in the other transmission direction is transmitted via the nonoptical link.

Abstract: A tubular sputtering target with a target body and with an attachment device arranged at at least one end of the target body. The attachment device and/or an end cover are joined with the target body by material joining or positive locking.

Abstract: A method for optical coupling an optical waveguide to an optical unit arranged in or on an optical module, a corresponding optical module, coupling element, and a kit of coupling elements is provided. The optical module has a reference geometry which defines a first axis of symmetry. Any offset between a first optical axis of the optical unit and the axis of symmetry of the reference geometry is determined. A coupling element corrects the offset and has an input/output area on opposite faces having offset second and third optical axes. Light input along the second optical axis is guided in the coupling element and output along the third optical axis, and vice versa. Once assembled, the center axis of the coupling element coincides with the axis of symmetry of the optical module, and the first optical axis of the optical unit and second optical axis of the coupling element coincide.

Abstract: A method for producing an optical or electronic module provided with a plastic package in which at least one optical or electronic component having an operative region is encapsulated with at least one polymer compound to form the plastic package. Portions of the polymer compound are then removed by a device, such as a laser, in such a way that an opening is defined in the polymer compound between the operative region of the component and the outer side of the plastic package. A functional structure is then introduced into the remaining polymer compound by the device.

Abstract: An optoelectronic arrangement having a surface-mountable semiconductor module having at least one optoelectronic transmitting and/or receiving unit, a housing, in which the optoelectronic transmitting and/or receiving unit is arranged, and a mounting side of the housing, which, in the case of surface mounting of the semiconductor module on a printed circuit board, faces the printed circuit board. The arrangement furthermore has a cooling element, which is thermally coupled to the semiconductor module for the purpose of cooling the optoelectronic transmitting and/or receiving unit. The cooling element is arranged on a side of the housing that is remote from the mounting side.

Abstract: The invention relates to a bidirectional emitting and receiving module and includes a support having a top face and a bottom face, an emitting component disposed on the top face that emits light having a first wavelength, and a receiving component arranged on the bottom face that receives light having a second wavelength. The support includes a slanted boundary surface that is coated with a wavelength-selective mirror, and light emitted by the emitting component is reflected and deflected on the mirror, while light that is emitted by the emitting component and is to be received by the receiving component is refracted thereon into the adjacent medium. Such light is refracted on the boundary surface, penetrates the support, and leaves the support on the bottom face thereof, and is then detected by the receiving component.

Abstract: A laser device has a laser diode with an optical resonator. The resonator has an exit side for emitting light into an optical system. A monitor diode is provided and has a light-sensitive face for measuring optical quantities of the laser diode. The light-sensitive face of the monitor diode is optically coupled to a backside of the laser diode, on the other side from the light exit side of the resonator, the backside also emitting light. This configuration permits a space-saving SMD layout for the laser device.

Abstract: The invention relates to an optoelectronic assembly having an optoelectronic or passive optical component and a cooling element for cooling the optoelectronic or passive optical component. According to the invention, the cooling element is a micropeltier cooler, wherein the component is arranged either directly thereon or a carrier substrate is arranged therebetween.

Abstract: The invention relates to an optoelectronic arrangement having a laser component. There are provided: a cooling device of small design for cooling the laser component down to a constant temperature, a device for the direct optical detection of the emitted wavelength of the laser component, whose signal is used to control the cooling device, and a package of small design with an extent of at most 6.5 mm perpendicular to the optical axis of the laser component and in which the above named components are arranged. The invention also relates to a method for controlling the emitted wavelength of a laser component.

Abstract: A module for bidirectional optical signal transmission having a transmitting component that emits light of a first wavelength, a receiving component that detects light of a second wavelength, a carrier substrate that is transparent to the light of the first wavelength, on which the transmitting component is arranged, and a monitor component that detects a fraction of the light emitted by the transmitting component, wherein the receiving component is integrated in the carrier substrate, the receiving component and the transmitting component are arranged behind one another in relation to the direction of the emitted or received light, the receiving component is optically transparent to the light of the first wavelength, and light emitted by the transmitting component is transmitted through the carrier substrate and the receiving component. A second module complements such a module, in that it detects light of the first wavelength and emits light of the second wavelength.

Abstract: A process for producing a sputtering target from a silicon-based alloy with an aluminum content of 5-50 wt. %. The target material is produced by a casting technique in which the material is melted and vacuum-cast, such that the casting is carried out in a hollow cylindrical casting mold.

Abstract: An optoelectronic transceiver for a bidirectional optical signal transmission including a housing having a width of at most 13.5 mm, a first bidirectional optical subassembly arranged in the housing and serving for the simultaneous emission and reception of optical signals, a second bidirectional optical subassembly arranged in the housing and serving for the simultaneous emission and reception of optical signals, and an optical interface for the coupling of two optical waveguides, it being possible for a respective optical waveguide to be optically coupled to a subassembly. The invention enables a simultaneous bidirectional data transmission on both ports of the transceiver and thus an increase in the transmission capacity of the transceiver.

Abstract: An arrangement for connecting the terminal contacts of an optoelectronic component to electrical contacts of a printed circuit board using a flexible conductor arrangement. The flexible conductor arrangement has a planar form and includes a plurality of interconnects that are arranged to provide an electrical connection between the terminal contacts of the optoelectronic component and the electrical contacts of the printed circuit board. The flexible conductor arrangement is bent in such a way that, starting from the printed circuit board, it is led around the optoelectronic component and contacts the latter on a side facing away from the printed circuit board.

Abstract: An optoelectronic component with an optoelectronic transducer device and an electrical circuit electrically connected to the transducer device mounted on a carrier substrate which is optically transparent for specific wavelengths. The transducer device is arranged on the front side of the carrier substrate, and light coupling takes place through the back side. The electrical circuit is formed as a circuit integrated into the carrier substrate or is formed on the carrier substrate using hybrid technology, the terminal contacts of the circuit being arranged on the front side of the carrier substrate. An optoelectronic arrangement with an optoelectronic component includes an at least partly planar-formed mounting element, which is connected by its one side to an outer side of the component or is integrated in the latter and extends at least as far as an outer edge of the component, and includes a mechanical interface for the mechanical connection of the component.