Abstract: A magnetic film plating apparatus employs a dip method that allows relatively good escape of bubbles and does not require a wide footprint and, even when a ferromagnetic material is used for an anode, can form a magnetic film on a substrate surface while minimizing the influence of the anode on the uniformity of magnetic anisotropy in the magnetic film. The magnetic film plating apparatus includes a plating tank for holding a plating solution, an anode vertically disposed in the plating tank at a position to be immersed in the plating solution, a substrate holder for holding a substrate W and positioning the substrate W opposite the anode, and a magnetic field generator, disposed outside the plating tank, for generating a magnetic field around the substrate W held by the substrate holder and positioned opposite the anode.

Abstract: A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid; an inner shell disposed in the cleaning bath and configured to house the substrate holder holding the substrate therein; and a cleaning liquid supply conduit configured to supply a cleaning liquid into the inner shell to clean the substrate, together with the substrate holder, with the cleaning liquid. The inner shell has an inner surface having an uneven configuration that follows an uneven exterior configuration of the substrate holder holding the substrate.

Abstract: A substrate holder includes a fixed holding member and a movable holding member for detachably holding a substrate by gripping a peripheral portion of the substrate therebetween, and an inner seal member and an outer seal member which are fixed to the movable holding member. When the substrate is held by the movable holding member and the fixed holding member, the inner and outer seal members seal the connection between the movable holding member and a peripheral portion of the substrate and the connection between the movable holding member and the fixed holding member, respectively. The movable holding member includes a seal holder, and the inner seal member and the outer seal member are fixed between the seal holder and a fixing ring secured to the seal holder.

Abstract: Conventionally, in a system where devices for handling multiple media data such as audio and video are present, there is a problem that the number of audio channels that can be processed at the gateway is limited. In light of this problem, this invention offers a gateway having distributed processing function for a telephone or a data processing system featuring the capability to request address conversion to another terminal within the system to replace the address of stream-type packet data such as audio and video meant for itself, and if the aforementioned terminal to which the request was sent responds that it can handle the requested processing, to notify the address of the terminal processing the address conversion to the terminal transmitting the stream-type packet data.

Abstract: A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.

Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.

Abstract: In a brush holder accommodating part 26d of a gear housing 26, paired flat surface parts 26c and paired curved parts 26b are alternately disposed so as to be formed into an elliptical shape, one of the paired flat surface parts is formed with first heat sinks 26i, and two brushes 20 and 20 mounted on a brush holder unit 19 accommodated in the brush holder accommodating part 26d are disposed near the first heat sinks 26i.

Abstract: A substrate holder enables easy maintenance, especially easy replacement of seal members. The substrate holder includes a fixed holding member and a movable holding member for detachably holding a substrate by gripping a peripheral portion of the substrate therebetween, and an inner seal member and an outer seal member which are fixed to the movable holding member and which, when the substrate is held by the movable holding member and the fixed holding member, seal the connection between the movable holding member and a peripheral portion of the substrate and the connection between the movable holding member and the fixed holding member, respectively. The movable holding member includes a seal holder, and the inner seal member and the outer seal member are fixed between the seal holder and a fixing ring secured to the seal holder.

Abstract: Conventionally, in a system where devices for handling multiple media data such as audio and video are present, there is a problem that the number of audio channels that can be processed at the gateway is limited. In light of this problem, this invention offers a gateway having distributed processing function for a telephone or a data processing system featuring the capability to request address conversion to another terminal within the system to replace the address of stream-type packet data such as audio and video meant for itself, and if the aforementioned terminal to which the request was sent responds that it can handle the requested processing, to notify the address of the terminal processing the address conversion to the terminal transmitting the stream-type packet data.

Abstract: To prevent a network response to a game server from deteriorating, a flag information management unit of a game server is provided. The flag information management unit manages flags indicating information on player characters (PC) in response to requests from client systems (or communication terminals)s occurring during network game progress. A flag information transmission unit transmits only the information linked to the managed flags to the client systems (or communication terminals). Then, on the sides of the client systems (or communication terminals), a control unit controls a CD-ROM drive in accordance with the information, and the necessary information is reproduced from a CD-ROM.

Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.

Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.

Abstract: A rotating electric machine includes a shaft and an armature with a core that includes a shaft hole. The core includes a plurality of core materials that are laminated. When pressing in and fixing the shaft to the shaft hole, the shaft hole is applied with an ironing process in advance in order to rectify a cylindrical hole shape of the shaft hole.

Abstract: The present invention relates to novel benzodiazepine compounds exhibiting RXR-antagonist efficacy, to the manufacture and to the use thereof.