Electrical contact
Latest Ebara Corporation Patents:
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece
- Output signal processing device for eddy-current sensor
- Method of evaluating primary optical system of electron beam observation device, evaluation device used therefor, and method of manufacturing same
- Washing apparatus
- SUBSTRATE CLEANING APPARATUS AND SUBSTRATE POLISHING APPARATUS
Description
Claims
The ornamental design for an electrical contact, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
| D324204 | February 25, 1992 | Wright |
| D555595 | November 20, 2007 | Yahagi et al. |
| D556692 | December 4, 2007 | Yahagi et al. |
| D617740 | June 15, 2010 | Fennell |
| D617741 | June 15, 2010 | Fennell |
| D624025 | September 21, 2010 | Luo et al. |
| D631846 | February 1, 2011 | Truskett et al. |
| D635522 | April 5, 2011 | Hemmi et al. |
| D651178 | December 27, 2011 | Fujikata et al. |
| D661258 | June 5, 2012 | Huang |
- U.S. Appl. No. 29/356,550, filed Feb. 26, 2010, Ebara Corporation.
Patent History
Patent number: D669439
Type: Grant
Filed: Aug 24, 2011
Date of Patent: Oct 23, 2012
Assignee: Ebara Corporation (Tokyo)
Inventors: Jumpei Fujikata (Tokyo), Yuji Araki (Tokyo), Masaaki Kimura (Tokyo)
Primary Examiner: Thomas Johannes
Attorney: Sughrue Mion, PLLC
Application Number: 29/400,216
Type: Grant
Filed: Aug 24, 2011
Date of Patent: Oct 23, 2012
Assignee: Ebara Corporation (Tokyo)
Inventors: Jumpei Fujikata (Tokyo), Yuji Araki (Tokyo), Masaaki Kimura (Tokyo)
Primary Examiner: Thomas Johannes
Attorney: Sughrue Mion, PLLC
Application Number: 29/400,216
Classifications
Current U.S. Class:
Ring Or Spade Lug (D13/148)