Electrical contact for use in a plating apparatus

- Ebara Corporation
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Description

FIG. 1 is a top perspective view of an electrical contact for use in a plating apparatus showing our new design;

FIG. 2 is a bottom perspective view thereof.

FIG. 3 is a front elevation view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a rear elevation view thereof; and,

FIG. 7 is a right side elevation view thereof, a left side elevation view being a mirror image thereto.

Claims

The ornamental design for an electrical contact for use in a plating apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
5043528 August 27, 1991 Mohr
6500012 December 31, 2002 Billenstein et al.
D519931 May 2, 2006 Van Haaster
D556692 December 4, 2007 Yahagi et al.
D624025 September 21, 2010 Luo et al.
D651178 December 27, 2011 Fujikata et al.
D669439 October 23, 2012 Fujikata et al.
Patent History
Patent number: D706224
Type: Grant
Filed: Aug 1, 2013
Date of Patent: Jun 3, 2014
Assignee: Ebara Corporation (Tokyo)
Inventors: Masaaki Kimura (Tokyo), Mitsutoshi Yahagi (Tokyo), Toshikazu Yajima (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/462,320
Classifications
Current U.S. Class: Element Or Attachment (D13/154)