Abstract: A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.

Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.

Abstract: A semiconductor device includes first semiconductor elements, a control terminal, a first conductive member, and first circuit components. The first semiconductor elements are connected in parallel, and a switching operation of each first semiconductor element is controlled according to a first drive signal inputted to a third electrode of each first semiconductor element. The first conductive member is electrically connected to the control terminal to which the first drive signal is inputted, and is electrically interposed between the third electrodes. The first conductive member includes connecting members and a portion of a signal wiring section. Each of the first circuit components increases an impedance in a first frequency band. The first frequency band includes a resonance frequency of a resonance circuit that is formed by including a parasitic inductance of the first conductive member.

Abstract: A semiconductor device includes: a plurality of first semiconductor elements that each have a first electrode, a second electrode, and a third electrode, a switching operation of each of the first semiconductor elements being controlled according to a first drive signal inputted to the third electrode; a plurality of first connecting members respectively bonded to the second electrodes of the first semiconductor elements; a first detection terminal electrically connected to the second electrodes of the first semiconductor elements; and a first signal wiring section electrically interposed between the first detection terminal and the first connecting members. The first semiconductor elements are aligned in a first direction perpendicular to a thickness direction of each of the first semiconductor elements, and are electrically connected to each other in parallel.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, a mounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A microneedle array to be used instead of a syringe has, at a tip side of each microneedle, two or four puncture portions disposed facing each other. The puncture portions each have a part of a side surface of each microneedle as outer surfaces, respectively, and one of the puncture portions is shorter than the other(s). A housing section capable of holding a drug is formed by inner surfaces of the puncture portions of each microneedle. The housing section opens toward the tip side and lateral directions orthogonal to an axis core of each microneedle, and has a central bottom surface at a bottom end. The inner surfaces facing each other and forming the housing section of each microneedle each have a downward slope, with a width between the inner surfaces getting narrower as it goes down from tips of the respective puncture portions toward the central bottom surface.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.

Abstract: Semiconductor device A1 includes: semiconductor element 1 turning on and off connection between drain electrode 11 and source electrode 12; semiconductor element 2 turning on and off connection between drain electrode 21 and source electrode 22; metal component 31 with semiconductor element 1 mounted; metal component 32 with semiconductor element 2 mounted; and conductive substrate 4 including wiring layers 411, 412 with insulating layer 421 between them. Wiring layer 411 includes power terminal section 401 connected to drain electrode 11. Wiring layer 412 includes power terminal section 402 connected to source electrode 22. Power terminal sections 401, 402 and insulating layer 421 overlap with each other as viewed in z direction. Conductive substrate 4 surrounds semiconductor elements 1, 2 as viewed in z direction, while overlapping with a portion between metal components 31, 32 as viewed in z direction.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.

Abstract: The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A microneedle array with a performance adequate to be used instead of a syringe has at a tip side of each microneedle 10 two puncture portions 14 and 15 disposed facing each other. The puncture portions 14 and 15 each have a part of a side surface of the microneedle 10 as outer surfaces 12 and 13, respectively, and one of the puncture portions 14 and 15 is shorter than the other. Surrounded by inner surfaces 16 and 17 of the puncture portions 14 and 15 facing each other, a housing section 19 capable of holding a drug is formed. The housing section 19 opens toward the tip side and both lateral directions along an axis core of the microneedle 10, and has a central bottom surface 18 at a bottom end.

Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.

Abstract: The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers.

Abstract: A method of manufacturing a polishing pad mold for a polishing pad including a micro pattern ? having micro protrusions arranged therein includes steps of manufacturing a mother mold where a mother mold including a substrate, on one side of which a micro pattern ? having an inverted protrusion-depression shape with respect to the micro pattern ? is formed, is manufactured, manufacturing a positive daughter mold where a positive daughter mold having a micro pattern ? formed on a surface is manufactured by the mold, and manufacturing a negative daughter mold where a negative daughter mold having a micro pattern ? formed on a surface is manufactured by the mold, and an assembly step where the mold is configured by arranging and fixing the molds on a basis with the surfaces having the micro pattern ? faced up. Thereby, highly precise and efficient planarization is provided.