Abstract: Provided is a solid state imaging device including a plurality of pixels, a signal line on which a pixel signal is transmitted, a load transistor having a drain connected to the signal line, a readout circuit that reads out the pixel signal from the signal line, and a control unit that controls a current flowing in the load transistor in accordance with a potential of a control terminal. When a reference potential of the pixel fluctuates relatively to a reference potential of the readout circuit, a potential of the control terminal relative to a potential of a source of the load transistor is changed in a same phase with a fluctuation of the reference potential of the pixel.

Abstract: The imaging device performs a global electronic shutter operation in which exposure periods of a plurality of pixels coincide with each other. In a first period during which a photoelectric conversion portion of at least one of the pixels accumulates an electric charge, signals based on electric charges held in holding portions of the plurality of pixels are sequentially output to an output line. During a second period after the output of the signals from the plurality of pixels is finished, the holding unit of each of the plurality of pixels holds an electric charge.

Abstract: An image device transfers charges of a previous frame from the holding units to the amplification units, during a read-out period of each frame, the read-out period includes a period in which a plurality of overflow transistors are in an on-state and a first period in which a plurality of photoelectric conversion units accumulate charges, and, during a second period following the first period, the plurality of photoelectric conversion units of the plurality of pixels accumulate charges while the plurality of holding units of the plurality of pixels hold the charges accumulated during the first period. During the first and second periods, each of the plurality of pixels performs a plurality of times of charge transfers from the photoelectric conversion unit to the holding unit. The plurality of times of charge transfers including a charge transfer performed at the end of the second period.

Abstract: Provided is a solid-state image pickup element including: a plurality of pixels arranged in a pixel well region; a readout circuit arranged in a peripheral well region, having a first input terminal for receiving the pixel signals from the plurality of pixels and a second input terminal for receiving a reference signal; and a reference signal circuit arranged in the peripheral well region, having a first electrode to which a ground voltage is supplied, and being configured to output the reference signal to the second input terminal of the readout circuit, wherein a resistance value R1 of an electrical path from one of a plurality of pixel well contacts to the first electrode and a resistance value R2 of an electrical path from one of a plurality of peripheral well contacts closest to the first electrode to the first electrode satisfy a relationship of R1<R2.

Abstract: A solid-state imaging device includes a plurality of pixels each including a photoelectric conversion unit, a charge accumulating portion accumulating signal charges transferred from the photoelectric conversion unit, a floating diffusion portion accumulating signal charges transferred from the charge accumulating portion, and a read-out unit transferring signal charges from the charge accumulating portion to the floating diffusion portion and output a signal corresponding to the signal charges, and a control unit controlling the read-out unit to start, after starting read-out of signals of one frame from the charge accumulating portions, an accumulation of signal charges for a next frame at the photoelectric conversion units simultaneously, and to start, before completing the read-out of the signal of the one frame, an accumulation of signal charges at the charge accumulating portion of a pixel among the plurality of pixels from which the signal of the one frame is already read out.

Abstract: An image sensor includes a semiconductor substrate having first and second faces. The sensor includes a plurality of pixel groups each including pixels, each pixel having a photoelectric converter and a wiring pattern, the converter including a region whose major carriers are the same with charges to be accumulated in the photoelectric converter. The sensor also includes a microlenses which are located so that one microlens is arranged for each pixel group. The wiring patterns are located at a side of the first face, and the plurality of microlenses are located at a side of the second face. Light-incidence faces of the regions of the photoelectric converters of each pixel group are arranged along the second face such that the light-incidence faces are apart from each other in a direction along the second face.

Abstract: Provided is an imaging apparatus, including a pixel region in which a plurality of pixels are arranged, the plurality of pixels each including: a plurality of photoelectric converters configured to generate charges corresponding to an amount of incident light; a plurality of charge holding portions arranged correspondingly to the plurality of photoelectric converters and configured to hold charges generated by the plurality of photoelectric converters respectively; and a light condensing portion arranged so as to be shared by the plurality of photoelectric converters and configured to guide the incident light to the plurality of photoelectric converters. In the imaging apparatus, a height (Vb) of a first potential barrier between two charge holding portions included in the a pixel is lower than a height (Va) of a second potential barrier between two charge holding portions included in different pixels.

Abstract: An image sensor includes a semiconductor substrate having first and second faces. The sensor includes a plurality of pixel groups each including pixels, each pixel having a photoelectric converter and a wiring pattern, the converter including a region whose major carriers are the same with charges to be accumulated in the photoelectric converter. The sensor also includes a microlenses which are located so that one microlens is arranged for each pixel group. The wiring patterns are located at a side of the first face, and the plurality of microlenses are located at a side of the second face. Light-incidence faces of the regions of the photoelectric converters of each pixel group are arranged along the second face such that the light-incidence faces are apart from each other in a direction along the second face.

Abstract: A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.

Abstract: An image sensor includes a pixel unit having first and second photoelectric converters, an amplifier provided commonly for the first and second photoelectric converters, first and second transfer transistors configured to respectively transfer charges generated in the first and second electric converters to an input portion of the amplifier. The signal read out by the readout portion includes a first optical signal read out in a state in which charges are transferred from the first photoelectric converter to the input portion by the first transfer transistor, and a second optical signal read out, after the readout of the first optical signal, in a state in which charges are transferred from the second photoelectric converter to the input portion by the second transfer transistor.

Abstract: It is disclosed that, as an embodiment, a test circuit includes a test signal supply unit configured to supply a test signal via a signal line to signal receiving units provided in a plurality of columns, wherein the test signal supply unit is a voltage buffer or a current buffer, and the test circuit has a plurality of test signal supply units and a plurality of signal lines, and wherein at least one test signal supply unit is electrically connected to one signal line different from a signal line to which another test signal supply unit is electrically connected.

Abstract: A method of manufacturing a semiconductor device, the method, comprising a first etching step of etching a substrate on which a silicon member and a compound member containing nitrogen and silicon are exposed, by using a first etching gas containing XeF2 and H2, and a second etching step of etching the substrate by using a second etching gas containing XeF2, wherein the second etching gas satisfies at least one of (i) a condition that the second etching gas is lower in a partial pressure of H2 than the first etching gas, and (ii) a condition that the second etching gas is smaller in a quantity of flow of H2 than the first etching gas.

Abstract: It is disclosed that, as an embodiment, a test circuit includes a test signal supply unit configured to supply a test signal via a signal line to signal receiving units provided in a plurality of columns, wherein the test signal supply unit is a voltage buffer or a current buffer, and the test circuit has a plurality of test signal supply units and a plurality of signal lines, and wherein at least one test signal supply unit is electrically connected to one signal line different from a signal line to which another test signal supply unit is electrically connected.

Abstract: A signal for focus detection is generated by a first operation, in which a signal of at least one photoelectric conversion element included in a photoelectric conversion unit is read to an input node of an amplification unit and the signal is supplied to a common output line by the amplification unit and signals for forming an image are generated by a second operation, in which a signal of another photoelectric conversion element included in the same photoelectric conversion unit as that including the at least one photoelectric conversion element from which the signal has been read in the first operation is read to the input node of the amplification unit while holding the signal read in the first operation using the amplification unit and the signals are supplied to the common output line by the amplification unit.

Abstract: It is disclosed that, as an embodiment, a test circuit includes a test signal supply unit configured to supply a test signal via a signal line to signal receiving units provided in a plurality of columns, wherein the test signal supply unit is a voltage buffer or a current buffer, and the test circuit has a plurality of test signal supply units and a plurality of signal lines, and wherein at least one test signal supply unit is electrically connected to one signal line different from a signal line to which another test signal supply unit is electrically connected.

Abstract: A signal for focus detection is generated by a first operation, in which a signal of at least one photoelectric conversion element included in a photoelectric conversion unit is read to an input node of an amplification unit and the signal is supplied to a common output line by the amplification unit and signals for forming an image are generated by a second operation, in which a signal of another photoelectric conversion element included in the same photoelectric conversion unit as that including the at least one photoelectric conversion element from which the signal has been read in the first operation is read to the input node of the amplification unit while holding the signal read in the first operation using the amplification unit and the signals are supplied to the common output line by the amplification unit.

Abstract: An amplification-type solid-state imaging device supplies a voltage of VRESL1 to a gate of a reset transistor when a signal of a vertical output line is read out and supplies a voltage of VRESL2, which is greater than VRESL1, when the signal charge accumulated in a photodiode is transferred to an FD so that, via a capacitor provided between the gate of the reset transistor and the FD, good linearity is obtained by decreasing the voltage of the FD when the signal is read out and the maximum amount of charge which can be transferred is increased by increasing the voltage of the FD when the charge is transferred.

Abstract: A signal for focus detection is generated by a first operation, in which a signal of at least one photoelectric conversion element included in a photoelectric conversion unit is read to an input node of an amplification unit and the signal is supplied to a common output line by the amplification unit and signals for forming an image are generated by a second operation, in which a signal of another photoelectric conversion element included in the same photoelectric conversion unit as that including the at least one photoelectric conversion element from which the signal has been read in the first operation is read to the input node of the amplification unit while holding the signal read in the first operation using the amplification unit and the signals are supplied to the common output line by the amplification unit.

Abstract: In a driving method of device having plural pixels, each pixel comprises photoelectric converter, floating diffusion, transfer transistor to transfer charge of the photoelectric converter to the floating diffusion, amplifying transistor to amplify signal based on the transferred charge, and reset transistor to reset voltage of the floating diffusion, the method comprises first step of, after putting the transfer transistor into conduction state, resetting the charge of the photoelectric converter by putting the transfer transistor into non-conduction state in non-conduction state of the reset transistor, and second step of, after the first step and after putting the transfer transistor into the conduction state, transferring the charge of the photoelectric converter to the floating diffusion by putting the transfer transistor into the non-conduction state in the non-conduction state of the reset transistor, and the signal based on the charge transferred in the second step is amplified by the amplifying transi

Abstract: An image sensor includes a pixel unit having first and second photoelectric converters, an amplifier provided commonly for the first and second photoelectric converters, first and second transfer transistors configured to respectively transfer charges generated in the first and second electric converters to an input portion of the amplifier. The signal read out by the readout portion includes a first optical signal read out in a state in which charges are transferred from the first photoelectric converter to the input portion by the first transfer transistor, and a second optical signal read out, after the readout of the first optical signal, in a state in which charges are transferred from the second photoelectric converter to the input portion by the second transfer transistor.