Patents by Inventor Masaaki Yamaya

Masaaki Yamaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5108971
    Abstract: The platinum catalyst composition comprises a diolefin component represented by the following general formula:CH.sub.2 .dbd.CH--R--CH.dbd.CH.sub.2wherein R is a divalent saturated hydrocarbon radical, and a platinum compound component. The platinum catalyst composition is extremely useful for hydrosilylation of an organosilicon compound having a .tbd.SiH radical with an olefin. When used for the hydrosilylation reaction, it inhibits effectively the isomerization of the starting material olefin, thereby enabling the intended organosilicon compound to be obtained in a high yield.
    Type: Grant
    Filed: November 14, 1990
    Date of Patent: April 28, 1992
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Yamazaki, Masaaki Yamaya, Hideyoshi Yanagisawa, Masayuki Takahashi
  • Patent number: 5081200
    Abstract: A primer composition comprising a product of the reaction between an organosilane compound of the following general formula (A) and a phenyl group-free organic diisocyanate compound to acquire a high curing speed and excellent adhesiveness to both inorganic and organic materials and to resist generation of stain after curing: ##STR1## wherein R.sup.1 represents a monovalent hydrocarbon residue containing 1 to 4 carbon atoms; R.sup.2 represents a divalent hydrocarbon residue containing 1 to 4 carbon atoms; and n represents 0, 1 or 2.
    Type: Grant
    Filed: October 12, 1990
    Date of Patent: January 14, 1992
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masaaki Yamaya, Hideyoshi Yanagisawa, Toshio Yamazaki, Masayuki Takahashi
  • Patent number: 5022922
    Abstract: A novel silane coupling agent is proposed for the pretreatment of a glass fiber-based or mica flake-based inorganic reinforcing material prior to compounding with an epoxy resin or a polyimide resin as the matrix to give a composite material such as laminates having excellent heat resistance against molten solder alloy and resistance against heat shock. The principal ingredient of the treatment solution is a trialkoxysilylalkyl-substituted polymethylene diamine compound of the general formula (R.sup.1 O).sub.3 SiR.sup.2 NH(CH.sub.2).sub.n NHCH.sub.2 C.sub.6 H.sub.5, in which R.sup.1 is a methyl or ethyl group, R.sup.2 is a diavalent hydrocarbon group having 1 to 6 carbon atoms, e.g., methylene and propylene, and n is an integer of 4 to 8, or a hydrochloride thereof. This diamine compound is soluble in water, in particular, acidified with acetic acid and the aqueous solution is advantageously stable in storage as compared with conventional silane coupling agents.
    Type: Grant
    Filed: May 29, 1990
    Date of Patent: June 11, 1991
    Assignees: Shin-Etsu Chemical Co., Ltd., Nitto Boseki Co., Ltd.
    Inventors: Akinari Itagaki, Masaaki Yamaya, Hiroshi Yoshioka, Akihiko Watanabe, Keita Miyazato
  • Patent number: 5021266
    Abstract: The primer composition of the invention is particularly useful as an undercoating composition for a protective overcoating formed with a silicone-based coating composition containing a colloidal silica powder in respect of the excellent adhesion, heat resistance, resistance against hot water and weatherability of the overcoating layer.
    Type: Grant
    Filed: June 13, 1990
    Date of Patent: June 4, 1991
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masaaki Yamaya, Kazuharu Sato, Masayuki Takahashi
  • Patent number: 5017668
    Abstract: A room temperature curable resin composition comprising a copolymer of (A) with (B) shown below:(A) An acrylic group-containing silane compound represented by the following Formula (I): ##STR1## wherein R.sup.1 represents a monovalent hydrocarbon group; R.sub.2 represents an alkylene group having not less than 2 carbon atoms; R.sup.3 and R.sup.4 each represent a hydrogen atom or a methyl group; m represents 0, 1 or 2; and n represents an integer of not less than 1.(B) A compound having an unsaturated group copolymerizable with said component (A) acrylic group-containing silane compound. This composition can be cured at an accelerated rate not only at the surface but also at the depths thereof, and may crack with difficulty after cured.
    Type: Grant
    Filed: May 18, 1989
    Date of Patent: May 21, 1991
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroshi Yoshihoka, Masaaki Yamaya, Hideyoshi Yanagisawa
  • Patent number: 4981986
    Abstract: Disclosed herein is a new organosilicon compound having a .beta.-diketone or .beta.-ketoester structures and a hydrolyzable group. The new organosilicon compound can be effectively used for the production of an immobilized catalyst, an adsorbent for metal recovery, a curing catalyst for organosiloxane and epoxy resins, and an adhesion promoter.
    Type: Grant
    Filed: April 6, 1988
    Date of Patent: January 1, 1991
    Assignee: Shin-Etsu Chemical Co.
    Inventors: Hiroshi Yoshioka, Masaaki Yamaya, Kazuharu Sato, Akinari Itagaki
  • Patent number: 4960809
    Abstract: The primer composition of the invention is particularly useful as an undercoating composition for a protective overcoating formed with a silicone-based coating composition containing a colloidal silica powder in respect of the excellent adhesion, heat resistance, resistance against hot water and weatherability of the overcoating layer.
    Type: Grant
    Filed: December 1, 1988
    Date of Patent: October 2, 1990
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masaaki Yamaya, Kazuharu Sato, Masayuki Takahashi
  • Patent number: 4958040
    Abstract: A process for preparing diorganohalogenosilanes wherein diorganodihalogenosilanes are reacted with at least one organosilicon compound having at least one .tbd.Si--H bond in the molecule and selected from polysilanes, polycarbosilanes and polysilphenylenes is described. This reaction proceeds in the presence of a Lewis acid.
    Type: Grant
    Filed: September 21, 1989
    Date of Patent: September 18, 1990
    Assignee: Shin-Etsu Chemical
    Inventors: Hiroshi Yoshioka, Masaaki Yamaya, Hiromi Ohsaki, Akira Hayashida
  • Patent number: 4943452
    Abstract: A novel silane coupling agent is proposed for the pretreatment of a glass fiber-based or mica flake-based inorganic reinforcing material prior to compounding with an epoxy resin or a polyimide resin as the matrix to give a composite material such as laminates having excellent heat resistance against molten solder alloy and resistance against heat shock. The principal ingredient of the treatment solution is a trialkoxysilylalkyl-substituted polymethylene diamine compound of the general formula (R.sup.1 O).sub.3 SiR.sup.2 NH(CH.sub.2).sub.n NHCH.sub.2 C.sub.6 H.sub.5, in which R.sup.1 is a methyl or ethyl group, R.sup.2 is a diavalent hydrocarbon group having 1 to 6 carbon atoms, e.g., methylene and propylene, and n is a integer of 4 to 8, or a hydrochloride thereof. This diamine compound is soluble in water, in particular, acidified with acetic acid and the aqueous solution is advantageouly stable in storage as compared with conventional silane coupling agents.
    Type: Grant
    Filed: August 15, 1988
    Date of Patent: July 24, 1990
    Assignees: Shin-Etsu Chemical Co., Ltd., Nitto Roseki Co., Ltd.
    Inventors: Akinari Itagaki, Masaaki Yamaya, Hiroshi Yoshioka, Akihiko Watanabe, Keita Miyazato
  • Patent number: 4690713
    Abstract: The antifoam composition provided by the invention comprises (a) 100 parts by weight of a hydrocarbon oil, e.g. spindle oil, or a silicone fluid, e.g. polydimethylsiloxane fluid, having a viscosity of 20 to 1,000,000 centistokes at 25.degree. C., (b) 0.1 to 40 parts by weight of an organosilane compound having 1 to 3 hydroxy groups or hydrolyzable groups, e.g. alkoxy, acyloxy and alkenyloxy groups, (c) 1 to 40 parts by weight of a finely divided silica powder and, optionally, (d) up to 5 parts by weight of a catalyst. The antifoam composition can exhibit excellent and durable defoaming activity even under vigorous agitation or in an alkaline condition of the foaming liquid.
    Type: Grant
    Filed: January 24, 1985
    Date of Patent: September 1, 1987
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuyuki Terae, Masaaki Yamaya, Fumio Okada