Patents by Inventor Masafumi Morisue
Masafumi Morisue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11260666Abstract: A liquid ejection head comprises a plurality of ejection orifices for ejecting liquid, a liquid supply flow path for supplying liquid to the plurality of ejection orifices and a plurality of branch flow paths branched from the liquid supply flow path each being held in communication with corresponding one of the plurality of ejection orifices. The plurality of ejection orifices form a first row and a second row each extending in parallel with each other. The first and second rows of ejection orifices are partially overlapping with each other as viewed in the direction orthogonal relative to the extending direction. The flow rate in the branch flow paths held in communication with the ejection orifices located in the overlapping part is made greater than the flow rate in the branch flow paths held in communication with the ejection orifices located in the non-overlapping part.Type: GrantFiled: October 12, 2020Date of Patent: March 1, 2022Assignee: Canon Kabushiki KaishaInventor: Masafumi Morisue
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Patent number: 11135841Abstract: A liquid discharge head includes a discharge port member including a discharge port, a flow path member including a pressure chamber and a liquid flow path, a substrate, and a structure that is arranged on the substrate on an upstream side of a center of the discharge port and that is configured to generate a flow of the liquid toward the discharge port. The liquid in the pressure chamber circulates. A position corresponding to a portion of the structure having a greatest height from a surface of the substrate is located on the upstream side of the center of the discharge port in a flow direction of the liquid. A thickness of the structure in a discharge direction of the liquid is 0.1 times or greater than a thickness of the liquid flow path in the discharge direction of the liquid.Type: GrantFiled: April 1, 2020Date of Patent: October 5, 2021Assignee: Canon Kabushiki KaishaInventors: Masataka Nagai, Masafumi Morisue, Koji Sasaki, Seiichiro Yaginuma, Shinji Kishikawa
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Patent number: 11110719Abstract: In a liquid discharge head, a first pump and a second pump are arranged inside a channel, the channel includes a pressure chamber including an energy generating element, and liquid inside the pressure chamber is circulatable between inside and outside of the pressure chamber by the first pump or the second pump. The first pump is arranged on one side relative to a midpoint of the channel in an extending direction of the channel, and the second pump is arranged on another side relative to the midpoint of the channel in the extending direction of the channel.Type: GrantFiled: March 24, 2020Date of Patent: September 7, 2021Assignee: Canon Kabushiki KaishaInventors: Koji Sasaki, Masafumi Morisue, Seiichiro Yaginuma, Shinji Kishikawa, Masataka Nagai
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Publication number: 20210213765Abstract: A liquid ejection apparatus includes a liquid ejection head for ejecting liquid and a mounting section for receiving a waste liquid container to be attached thereto. The waste liquid container is capable of receiving and containing the waste liquid discharged from a discharge port arranged in the mounting section. The liquid ejection apparatus has a blocking member for shielding the discharge port in accordance with an operation of removing the waste liquid container from the mounting section. The liquid ejection apparatus minimizes the risk of staining one or both of the user's hands handling the waste liquid container and the user's clothes with the waste liquid remaining on the discharge port of the liquid ejection apparatus.Type: ApplicationFiled: January 13, 2021Publication date: July 15, 2021Inventors: Kenji Tamamori, Tetsushi Ishikawa, Takashi Sugawara, Keiji Watanabe, Masafumi Morisue, Seiichiro Yaginuma
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Patent number: 11001071Abstract: A liquid ejection head includes a pair of electrodes disposed on a first surface of a substrate forming part of a flow path for a liquid. The electrodes of the pair of electrodes are adjacent to each other in a transverse direction of the electrodes, and the liquid moves in the transverse direction upon application of a voltage across the electrodes. The electrodes each include a ridge portion disposed on the first surface and an electrode wiring line connected to a power source for applying the voltage. The electrode wiring line covers an upper surface of the ridge portion and side surfaces of the ridge portion and extends from parts covering the side surfaces of the ridge portion to a downstream side and an upstream side with respect to a direction in which the liquid moves, so as to cover the first surface.Type: GrantFiled: November 1, 2019Date of Patent: May 11, 2021Assignee: Canon Kabushiki KaishaInventors: Takashi Sugawara, Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo
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Publication number: 20210114378Abstract: A liquid ejection head comprises a plurality of ejection orifices for ejecting liquid, a liquid supply flow path for supplying liquid to the plurality of ejection orifices and a plurality of branch flow paths branched from the liquid supply flow path each being held in communication with corresponding one of the plurality of ejection orifices. The plurality of ejection orifices form a first row and a second row each extending in parallel with each other. The first and second rows of ejection orifices are partially overlapping with each other as viewed in the direction orthogonal relative to the extending direction. The flow rate in the branch flow paths held in communication with the ejection orifices located in the overlapping part is made greater than the flow rate in the branch flow paths held in communication with the ejection orifices located in the non-overlapping part.Type: ApplicationFiled: October 12, 2020Publication date: April 22, 2021Inventor: Masafumi Morisue
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Patent number: 10906310Abstract: A liquid ejection head including: a substrate; an energy generating element, which is provided on the substrate and is utilized to eject liquid; a first film provided on the energy generating element; a flow path forming member, which has an ejection orifice from which the liquid is ejected and forms a flow path of the liquid between the substrate and the flow path forming member; and an electrode, which generates a flow of the liquid, wherein the electrode includes the first film.Type: GrantFiled: September 20, 2018Date of Patent: February 2, 2021Assignee: CANON KABUSHIKI KAISHAInventors: Tomoko Kudo, Ryo Kasai, Masafumi Morisue, Yoshiyuki Nakagawa, Takuro Yamazaki, Takashi Sugawara, Kazuhiro Yamada
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Patent number: 10836168Abstract: A liquid ejection head is manufactured by forming on a substrate an energy generating element for ejecting a liquid, an integrated circuit for driving the energy generating element, a supply port for the liquid so as to penetrate through the substrate, an electrode for generating a liquid flow, and a flow path forming member having an ejection orifice for ejecting the liquid such that a flow path for the liquid is formed between the substrate and the flow path forming member. The electrode is formed over high and low of a stepped shape formed on the substrate in at least one step selected from the steps of forming the energy generating element, forming the integrated circuit and forming the supply port.Type: GrantFiled: September 20, 2018Date of Patent: November 17, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Ryo Kasai, Takashi Sugawara, Masafumi Morisue, Takuro Yamazaki, Yoshiyuki Nakagawa, Kazuhiro Yamada, Tomoko Kudo
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Patent number: 10828893Abstract: A liquid ejecting head includes an element substrate including a common liquid chamber connected to a liquid supply source, a pressure chamber connected to the common liquid chamber and including inside an element to generate energy used for ejecting liquid, a bubble generating chamber connected to the common liquid chamber and including inside a pump to cause a flow of the liquid, and a connection flow path connecting the pressure chamber and the bubble generating chamber. The liquid ejecting head includes a first anti-cavitation film over the element to generate the energy and a second anti-cavitation film over the pump, and the first anti-cavitation film and the second anti-cavitation film have different film thicknesses.Type: GrantFiled: June 12, 2019Date of Patent: November 10, 2020Assignee: Canon Kabushiki KaishaInventors: Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo, Takashi Sugawara
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Patent number: 10818703Abstract: A method for manufacturing a semiconductor device includes: forming a photocatalytic layer and an organic compound layer in contact with the photocatalytic layer over a substrate having a light transmitting property; forming an element forming layer over the substrate having the light transmitting property with the photocatalytic layer and the organic compound layer in contact with the photocatalytic layer interposed therebetween; and separating the element forming layer from the substrate having the light transmitting property after the photocatalytic layer is irradiated with light through the substrate having the light transmitting property.Type: GrantFiled: July 20, 2016Date of Patent: October 27, 2020Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Masafumi Morisue, Yasuhiro Jinbo, Gen Fujii, Hajime Kimura
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Publication number: 20200331266Abstract: A liquid discharge head includes a discharge port member including a discharge port, a flow path member including a pressure chamber and a liquid flow path, a substrate, and a structure that is arranged on the substrate on an upstream side of a center of the discharge port and that is configured to generate a flow of the liquid toward the discharge port. The liquid in the pressure chamber circulates. A position corresponding to a portion of the structure having a greatest height from a surface of the substrate is located on the upstream side of the center of the discharge port in a flow direction of the liquid. A thickness of the structure in a discharge direction of the liquid is 0.1 times or greater than a thickness of the liquid flow path in the discharge direction of the liquid.Type: ApplicationFiled: April 1, 2020Publication date: October 22, 2020Inventors: Masataka Nagai, Masafumi Morisue, Koji Sasaki, Seiichiro Yaginuma, Shinji Kishikawa
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Publication number: 20200316956Abstract: In a liquid discharge head, a first pump and a second pump are arranged inside a channel, the channel includes a pressure chamber including an energy generating element, and liquid inside the pressure chamber is circulatable between inside and outside of the pressure chamber by the first pump or the second pump. The first pump is arranged on one side relative to a midpoint of the channel in an extending direction of the channel, and the second pump is arranged on another side relative to the midpoint of the channel in the extending direction of the channel.Type: ApplicationFiled: March 24, 2020Publication date: October 8, 2020Inventors: Koji Sasaki, Masafumi Morisue, Seiichiro Yaginuma, Shinji Kishikawa, Masataka Nagai
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Patent number: 10717273Abstract: A liquid ejection head includes an ejection orifice through which a liquid is ejected, a first liquid flow path which is in communication with the ejection orifice and through which the liquid flows, a second liquid flow path which is in communication with the ejection orifice on the opposite side of the first liquid flow path with respect to the ejection orifice 12 and through which the liquid flows, a first electrode positioned in the first liquid flow path 13, and a second electrode which is positioned in the second liquid flow path and generates an electro-osmotic flow in the liquid together with the first electrode.Type: GrantFiled: September 25, 2018Date of Patent: July 21, 2020Assignee: Canon Kabushiki KaishaInventors: Yoshiyuki Nakagawa, Kazuhiro Yamada, Noriyasu Nagai, Takuro Yamazaki, Toru Nakakubo, Akira Yamamoto, Masafumi Morisue, Ryo Kasai
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Patent number: 10703100Abstract: Provided is a liquid ejection head including: a substrate; an energy-generating element, which is arranged on the substrate, and is used for ejecting a liquid; a flow path forming member, which has an ejection orifice for ejecting the liquid, and is configured to form a flow path of the liquid between the flow path forming member and the substrate; an electrode configured to generate a flow of the liquid; and a wiring, which is arranged so as to be brought into contact with the flow path forming member, and is configured to supply electric power to the electrode, in which the flow path forming member contains an organic material, and in which the electrode and the wiring are each formed of a conductive adhesive layer containing at least one of conductive diamond-like carbon or tin-doped indium oxide.Type: GrantFiled: September 19, 2018Date of Patent: July 7, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo, Takashi Sugawara
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Patent number: 10703105Abstract: A liquid ejection head is provided with an ejection orifice array having multiple ejection orifices in order to eject a liquid; multiple energy-generating elements for generating energy in order to eject the liquid; a substrate provided with the energy-generating elements; a through-port array having multiple through-ports penetrating the substrate; multiple linear liquid flow paths positioned between the through-port array and the ejection orifice array and connected to respective ejection orifices of the ejection orifice array and respective through-ports of the through-port array; and first and second electrodes arranged in each of the multiple liquid flow paths for generating an electroosmotic flow in the liquid.Type: GrantFiled: September 25, 2018Date of Patent: July 7, 2020Assignee: Canon Kabushiki KaishaInventors: Yoshiyuki Nakagawa, Kazuhiro Yamada, Noriyasu Nagai, Takuro Yamazaki, Toru Nakakubo, Akira Yamamoto, Masafumi Morisue, Ryo Kasai
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Publication number: 20200139703Abstract: A liquid ejection head includes a pair of electrodes disposed on a first surface of a substrate forming part of a flow path for a liquid. The pair of electrodes are adjacent to each other in a transverse direction of the electrodes, and the liquid moves in the transverse direction upon application of a voltage across the electrodes. The electrodes each include a ridge portion disposed on the first surface and an electrode wiring line connected to a power source for applying the voltage. The electrode wiring line covers an upper surface of the ridge portion and side surfaces of the ridge portion and extends from parts covering the side surfaces of the ridge portion to a downstream side and an upstream side in a direction in which the liquid moves, so as to cover the first surface.Type: ApplicationFiled: November 1, 2019Publication date: May 7, 2020Inventors: Takashi Sugawara, Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo
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Patent number: 10639888Abstract: A liquid ejection head including a substrate, an energy generating element which is provided on the substrate and is used for ejecting a liquid, a flow passage forming member which includes an ejection orifice, which ejects the liquid, and which forms a flow passage of the liquid between the flow passage forming member and the substrate, and an electrode which is provided on a surface of the flow passage forming member which adjoins the flow passage and which generates a flow of the liquid, in which at least a portion of the electrode is covered within the flow passage forming member.Type: GrantFiled: September 18, 2018Date of Patent: May 5, 2020Assignee: Canon Kabushiki KaishaInventors: Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo, Takashi Sugawara
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Publication number: 20200009864Abstract: Provided is a liquid ejecting head including an element substrate including: a common liquid chamber connected to a liquid supply source; a pressure chamber connected to the common liquid chamber and including inside an element to generate energy used for ejecting liquid; a bubble generating chamber connected to the common liquid chamber and including inside a pump to cause a flow of the liquid; and a connection flow path connecting the pressure chamber and the bubble generating chamber, in which the liquid ejecting head includes a first anti-cavitation film over the element to generate the energy and a second anti-cavitation film over the pump, and the first anti-cavitation film and the second anti-cavitation film have different film thicknesses.Type: ApplicationFiled: June 12, 2019Publication date: January 9, 2020Inventors: Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo, Takashi Sugawara
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Patent number: 10364142Abstract: A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.Type: GrantFiled: July 27, 2017Date of Patent: July 30, 2019Assignee: Canon Kabushiki KaishaInventors: Masafumi Morisue, Tamaki Sato, Akihiko Okano, Tetsushi Ishikawa
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Patent number: 10279590Abstract: A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.Type: GrantFiled: February 28, 2018Date of Patent: May 7, 2019Assignee: Canon Kabushiki KaishaInventors: Masafumi Morisue, Shinji Kishikawa, Tamaki Sato