Patents by Inventor Masahiko Shimizu
Masahiko Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12128639Abstract: A forming device includes: a forming jig extending along an axial direction; a forming die having a shape corresponding to a top part region and a wall part region of the forming jig; and a movement mechanism that moves the forming die so as to approach a bottom part region along a height direction HD. The forming die includes: a body part; a plate-shaped forming part that is attached to the body part so as to be swingable around a swing shaft; and a pressurization part that generates a pressurization force which causes a distal end part of the forming part to push a layered body against the wall part region when the forming die is moved by the movement mechanism so as to approach the bottom part region. In accordance with the distal end part, the part causes a contact surface to contact a region of the layered body.Type: GrantFiled: July 31, 2020Date of Patent: October 29, 2024Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Homare Yamato, Masahiko Shimizu, Shoya Mano, Toshiki Kitazawa, Hideki Horizono
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Publication number: 20240356620Abstract: A communication device includes a communication unit and a control unit. The communication unit performs wireless communication using at least one of a plurality of beams. The control unit acquires service communication quality corresponding to quality requested on a service. The control unit obtains, by estimation, an estimated communication quality achievable by the communication unit, based on a radio wave propagation environment. Even in a case where a beam quality of a non-currently working beam, a beam which is not being used for wireless communication, is higher than the beam quality of a currently working beam, which is being used for wireless communication, the control unit maintains the communication by the currently working beam in a case where the estimated communication quality is the service communication quality or more. Where the estimated communication quality is below the service communication quality, the control unit determines switching of the beam.Type: ApplicationFiled: March 10, 2022Publication date: October 24, 2024Applicant: Sony Group CorporationInventors: Masahiko IKEDA, Naoyuki TOYODA, Takuma TAKADA, Yojiro SHIMIZU, Yoshio KONNO
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Patent number: 12122085Abstract: A forming method according to the present disclosure includes a laminating step for forming an intermediate formed article by supplying and laminating a fibrous sheet onto forming surfaces of a forming die for forming the intermediate formed article; and a bending process step for performing a bending process on the intermediate formed article, which is laminated on the forming surfaces and has a shape that corresponds to the forming die, to yield a formed article. The forming surfaces have shapes that correspond to the intermediate formed article to be formed. The second forming surface is bent with respect to the first forming surface among the forming surfaces, and the angle formed by the first forming surface and the second forming surface is greater than the bending angle of the cross-section of the formed article to be formed and less than 180 degrees.Type: GrantFiled: November 26, 2019Date of Patent: October 22, 2024Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Toshiki Kitazawa, Masahiko Shimizu, Shoya Mano
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Publication number: 20240313100Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a third electrode, a first semiconductor region, a second semiconductor region, a first nitride region, and a first insulating member. The first semiconductor region includes Alx1Ga1-x1N (0?x1<1). The second semiconductor region including Alx2Ga1-x2N (0<x2<1, x1<x2). The first nitride region includes Alz1Ga1-z1N (0<z1?1, x2<z1). The first nitride region includes a first nitride portion. The first nitride portion includes a first position. The first position is a center of the first nitride portion. The third partial region of the first semiconductor region includes a first face facing the first nitride portion. A chlorine concentration at the first position is lower than a chlorine concentration at the first face.Type: ApplicationFiled: July 28, 2023Publication date: September 19, 2024Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Daimotsu KATO, Yosuke KAJIWARA, Hiroshi ONO, Aya SHINDOME, Ikuo FUJIWARA, Masahiko KURAGUCHI, Tatsuo SHIMIZU
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Patent number: 12060322Abstract: A method for producing acetic acid includes an absorption step that suppresses corrosion inside a distillation column when a solution after that has absorbed a target component is subjected to distillation. The method for producing acetic acid also includes an absorption step of supplying, to an absorption column, at least a portion of offgas generated in an acetic acid production process, bringing the offgas into contact with an absorbent containing one or more liquids selected from a hydrocarbon, an ester of a carboxylic acid having 3 or more carbon atoms, an ester of a carboxylic acid and an alcohol having 2 or more carbon atoms, and an ether, to allow the absorbent to absorb an iodine compound in the offgas, and separating into a gas component having a lower iodine compound concentration than the offgas and a solution containing the absorbent and the iodine compound.Type: GrantFiled: July 2, 2018Date of Patent: August 13, 2024Assignee: DAICEL CORPORATIONInventor: Masahiko Shimizu
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Patent number: 12059852Abstract: A composite material molding method includes a first disposition step for disposing a prepreg on a jig molding surface of a molding jig; a first sealing step for airtightly sealing the prepreg by covering the prepreg with a first resin bag; a second disposition step for disposing a breather so as to cover the first resin bag; a second sealing step for airtightly sealing the breather so as to cover the breather with a second resin bag; a first depressurization step for depressurizing a first space sealed by the first resin bag; a second depressurization step for depressurizing a second space sealed by the second resin bag; and a heat-curing step for heat-curing the prepreg by supplying the internal space of a pressure vessel with a steam with a predetermined temperature and a predetermined pressure.Type: GrantFiled: June 6, 2019Date of Patent: August 13, 2024Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Yuichi Yui, Akihisa Okuda, Masahiko Shimizu, Yuki Kani, Akihiro Terasaka
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Patent number: 12049047Abstract: A block is configured such that, when a composite material having a curved part in a cross-sectional shape cut by a plane orthogonal to an X-axis is deformed into a shape corresponding to a mold through pressure application while being kept in the mold, the block is brought into contact with the curved part of the composite material. The block includes: a first contact part which extends along the X-axis direction so as to be in contact with the curved part of the composite material; and a second contact part which is partially disposed along the X-axis direction, is in contact with the curved part of the composite material, and is of higher rigidity than the first contact part.Type: GrantFiled: June 17, 2020Date of Patent: July 30, 2024Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Toshiki Kitazawa, Hiroaki Nakamura, Masahiko Shimizu
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Patent number: 12010791Abstract: A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.Type: GrantFiled: October 13, 2020Date of Patent: June 11, 2024Assignee: SONY GROUP CORPORATIONInventors: Hiroshi Kawai, Taizo Nishimura, Masahiko Shimizu, Takayuki Tanaka, Naohiro Takahashi
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Patent number: 11993030Abstract: A method includes laminating a plurality of fiber reinforced sheets to create a charge; and shaping, by pressing, the charge created in the lamination step into a shaping mold. The charge has a predetermined angle layer including the plurality of fiber reinforced sheets, the fiber direction of which is aligned in a single direction. The predetermined angle layer has n-number of constitutional layers (n?2) ranging from a first constitutional layer to an n-th constitutional layer each including the plurality of fiber reinforced sheets, wherein the n-th constitutional layer is laminated on an (n?1)-th constitutional layer, the plurality of fiber reinforced sheets in each of the constitutional layers have dividing portions which are along the fiber direction and which are disposed one by one at respective positions within a predetermined range along the fiber direction in the predetermined angle layer.Type: GrantFiled: September 26, 2019Date of Patent: May 28, 2024Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Masahiko Shimizu, Shoya Mano, Toshiki Kitazawa, Homare Yamato, Kenichi Kawamura, Yoko Taguchi
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Patent number: 11945179Abstract: The preset invention is to mold a laminate at a high accuracy by appropriately generating slippage between fiber sheets of the laminate at bending. A method for molding a laminate includes a step in which a plurality of gripping parts, which are arranged apart from each other, grip an area, wherein slippage between fiber sheets is prevented, in a plate-shaped laminate including a plurality of fiber sheets laminated each other; a step in which the plurality of gripping parts grip the area wherein slippage between the fiber sheets is prevented, while maintaining the state wherein relative moving of the area of the laminate and the gripping parts is prevented; and a step in which the gripping parts move so as to subject the laminate to bending.Type: GrantFiled: December 26, 2019Date of Patent: April 2, 2024Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Toshiki Kitazawa, Homare Yamato, Masahiko Shimizu, Hiromichi Akiyama, Akihiro Terasaka
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Publication number: 20240034010Abstract: A shaping method includes suturing, with a linear suture material, first end regions in a first predetermined direction of a plurality of sheet materials. The method includes fixing a second end region in the first predetermined direction of a laminated body to a first shaping method having a curved portion including at least one of a concave shape and a convex shape along a second predetermined direction in a state where the first predetermined direction coincides with the second predetermined direction. The method includes pressing a second shaping mold against the laminated body, which has been fixed to the first shaping mold in the fixing step, to shape the laminated body along the surface shape of the first shaping mold. The laminated body is shaped by applying a tension in the direction of pulling the first end region away from the second end region.Type: ApplicationFiled: March 11, 2021Publication date: February 1, 2024Inventors: Toshiki KITAZAWA, Masahiko SHIMIZU, Tomoya MURATA
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Patent number: 11884617Abstract: Provided is an acetic acid production method that enables smooth reduction and/or increase of acetic acid production with easy operation and can industrially efficiently, stably produce acetic acid with maintained quality even when the acetic acid production volume is changed. The acetic acid production method includes a carbonylation step in which methanol is reacted with carbon monoxide in a continuous system in the presence of a catalytic system, acetic acid, methyl acetate, and water, where the catalytic system includes a metal catalyst and methyl iodide. The carbonylation step employs two or more reactors disposed in parallel.Type: GrantFiled: July 2, 2018Date of Patent: January 30, 2024Assignee: DAICEL CORPORATIONInventor: Masahiko Shimizu
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Publication number: 20230398751Abstract: A manufacturing device manufactures a composite material structure by impregnating resin into a preform formed in a predetermined shape. The manufacturing device includes: a caul plate defining a space inside and covering the preform in the space; a supply part that supplies resin to the preform; a discharge part that discharges a gas from the space through a discharge hole in the caul plate; and a pressure intensifier that is provided in the space and between the caul plate and the preform and pressurizes the preform by a gas being discharged through the discharge part. The pressure intensifier has a web part facing surface facing the preform and a caul plate facing surface facing the caul plate, and through holes between the web part facing surface and the caul plate facing surface are in the pressure intensifier.Type: ApplicationFiled: January 17, 2023Publication date: December 14, 2023Inventors: Hiroshi TOKUTOMI, Masahiko SHIMIZU, Shoya MANO, Kentaro SHINDO, Takeshi FUJITA
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Patent number: 11812392Abstract: A wireless communication apparatus outputs first and second beams, based on a weighting vector representing gain and/or phase weighting. The apparatus derives a weighting vector corresponding to a maximum eigen value of a matrix obtained by subtracting, from a first matrix representing a main lobe output power of the first beam, a matrix obtained by multiplying a second matrix representing a side lobe output power of the first beam to a reduction ratio for reducing the side lobe output power of the first beam interfering with a main lobe of the second beam. The apparatus determines whether or not a power ratio of the main lobe output power of the first beam with respect to the side lobe output power of the first beam is greater than a maximum SIRmax, and extracts the weighting vector when the power ratio is not larger than the maximum SIRmax.Type: GrantFiled: November 18, 2021Date of Patent: November 7, 2023Assignee: FUJITSU LIMITEDInventor: Masahiko Shimizu
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Publication number: 20230338248Abstract: To yield a high-purity 1,3-butylene glycol product that is colorless and odorless (or almost colorless and odorless) and unlikely to cause or increase coloration and odor over time. A 1,3-butylene glycol product containing 1,3-butylene glycol, wherein a sum of contents of acetaldehyde, crotonaldehyde, methyl vinyl ketone, acetone, formaldehyde, butylaldehyde, acetaldol, 1-hydroxy-3-butanone, 2-butanol and compounds represented by Formulas (1) to (10) below is less than 65 ppm.Type: ApplicationFiled: December 23, 2020Publication date: October 26, 2023Applicant: DAICEL CORPORATIONInventors: Katsuya MARUO, Satoshi KUSAKABE, Hirotoshi KITAMURA, Tomoko NISHIMURA, Masahiko SHIMIZU, Youji SUZUKI
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Publication number: 20230330913Abstract: A laminated body reference surface curved relative to the X-axis direction and overlapped on a shaping die reference surface and a laminated body bend surface intersecting the laminated body reference surface along the X-axis direction and overlapped on a shaping die bend surface are provided, the angle between the laminated body reference surface and the laminated body bend surface is larger than the angle between the shaping die reference surface and the shaping die bend surface. When a ridge where the shaping die reference surface and the shaping die bend surface intersect defines a shaping die edge, and a ridge where the laminated body reference surface and the laminated body bend surface intersect defines a laminated body edge, the laminated body edge is displaced from the shaping die edge on the shaping die reference surface with the laminated body reference surface being overlapped on the shaping die reference surface.Type: ApplicationFiled: December 14, 2022Publication date: October 19, 2023Inventors: Toshiki KITAZAWA, Masahiko SHIMIZU
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Patent number: 11773044Abstract: A method for producing acetic acid can improve the life of a silver-substituted ion exchange resin for removing organic iodine compounds in acetic acid. In a carbonylation process of a methanol method, an acetic acid distillation step has at least one distillation step of carrying out the purification of an acetic acid stream under conditions of a column bottom temperature of a distillation column of less than 175° C., a nickel base alloy or zirconium is used as a material of the distillation column in the distillation step, and as metal ion concentrations in a charging mixture of the distillation column in the distillation step, an iron ion concentration is less than 10,000 ppb by mass, a chromium ion concentration is less than 5,000 ppb by mass, a nickel ion concentration is less than 3,000 ppb by mass, and a molybdenum ion concentration is less than 2,000 ppb by mass.Type: GrantFiled: May 2, 2018Date of Patent: October 3, 2023Assignee: DAICEL CORPORATIONInventor: Masahiko Shimizu
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Publication number: 20230302767Abstract: A charge is formed of a plurality of layers of fiber-reinforced sheets. The charge includes an outermost-layer multi-stack member disposed at each end section in a layering direction; and an intermediate-layer multi-stack member disposed in an intermediate section in the layering direction. The outermost-layer multi-stack member includes a fiber-reinforced sheet in which fibers extend in an X-axis direction in which compression force or tensile force acts when the charge is subjected to bending processing; and has formed therein a plurality of incisions that penetrate in the layering direction and extend in a Y-axis direction. The plurality of incisions are disposed side by side at prescribed intervals in the Y-axis direction and the X-axis direction. An incision that penetrates in the layering direction and extends in the Y-axis direction is formed in the intermediate-layer multi-stack member. The incision extends roughly the entire region affected by compression force or tensile force.Type: ApplicationFiled: December 28, 2020Publication date: September 28, 2023Inventors: Toshiki KITAZAWA, Masahiko SHIMIZU
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Publication number: 20230294371Abstract: A composite material molding method for molding a composite material by integrating a first fiber base material which is formed in a plate shape and a second fiber base material. The method includes installing; in a recess in a first molding surface of a molding tool, the second fiber base material formed in a shape corresponding to the recess; fixing a first fiber-reinforced portion which is a part of a plurality of fiber reinforced sheets included in the first fiber base material to the first molding surface to cover the recess in which the second fiber base material is installed by the installation step; laying up a second fiber-reinforced portion on the first fiber-reinforced portion fixed by the fixing step; and molding the composite material by integrating and curing the first fiber base material and the second fiber base material installed in the recess using a resin material.Type: ApplicationFiled: March 10, 2021Publication date: September 21, 2023Inventors: Toshiki KITAZAWA, Masahiko SHIMIZU
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Patent number: RE50062Abstract: A process for producing acetic acid by: a reaction step for continuously allowing methanol to react with carbon monoxide in the presence of a catalyst system comprising a metal catalyst, an ionic iodide, and methyl iodide in a carbonylation reactor, a flash distillation step for continuously feeding a flasher with a reaction mixture from the reactor and evaporating a volatile component at least containing product acetic acid, methyl acetate, and methyl iodide by flash distillation to separate the volatile component and a liquid catalyst mixture at least containing the metal catalyst and the ionic iodide, and an acetic acid collection step for separating a stream containing acetic acid from the volatile component to collect acetic acid; wherein, in the flash distillation step, the flash distillation is conducted under the condition that the concentration of methyl acetate in the liquid catalyst mixture is not less than 0.6% by weight.Type: GrantFiled: December 12, 2019Date of Patent: July 30, 2024Assignee: DAICEL CORPORATIONInventors: Masahiko Shimizu, Ryuji Saito, Hiroyuki Miura, Takashi Ueno, Hidehiko Nakajima