Patents by Inventor Masahiko Shimizu

Masahiko Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237409
    Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a semiconductor member, a first conductive member, first and second insulating members, and a first nitride member. A position of the third electrode in a first direction from the first to second electrodes is between positions of the first and second electrodes in the first direction. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first to fifth partial regions. The second semiconductor region includes first and second semiconductor portions. The second semiconductor portion includes first and second portions, and a third portion between the first and second portions. The first conductive member includes first and second conductive regions. The first insulating member includes a first insulating region. The second insulating member includes first and second insulating portions. The first nitride member includes a first nitride region.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: February 25, 2025
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Daimotsu Kato, Yosuke Kajiwara, Hiroshi Ono, Aya Shindome, Akira Mukai, Po-Chin Huang, Masahiko Kuraguchi, Tatsuo Shimizu
  • Publication number: 20250063752
    Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a third electrode, a first semiconductor member, a second semiconductor member, a first compound member, and a first insulating member. The third electrode includes a first electrode portion. The first semiconductor member includes Alx1Ga1-x1N (0?x1<1). The first semiconductor member includes first to seventh partial regions. The second semiconductor member includes Alx2Ga1-x2N (0<x2?1, x1<x2). The second semiconductor member includes first and second semiconductor portions. The first compound member includes Alz1Ga1-z1N (0<z1?1, x2<z1). The first compound member includes first to fifth regions. The first insulating member includes first and second insulating portions. At least a part of the first insulating portion and at least a part of the second insulating portion is amorphous.
    Type: Application
    Filed: January 26, 2024
    Publication date: February 20, 2025
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Ikuo FUJIWARA, Tatsuo SHIMIZU, Masahiko KURAGUCHI, Aya SHINDOME, Daimotsu KATO
  • Patent number: 12218232
    Abstract: A semiconductor device includes first to third electrodes, a semiconductor member, first and second insulating members, a compound member, and a nitride member. The third electrode is between the first and second electrodes. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first to fifth partial regions. The second semiconductor region includes first and second semiconductor portions. The first insulating member includes first and second insulating portions. The first semiconductor portion is between the fourth partial region and the first insulating portion. The second semiconductor portion is between the fifth partial region and the second insulating portion. The compound member includes first to third compound portions. The nitride member includes first to third nitride portions. The second insulating member includes first and second insulating regions.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: February 4, 2025
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Daimotsu Kato, Hiroshi Ono, Yosuke Kajiwara, Aya Shindome, Akira Mukai, Po-Chin Huang, Masahiko Kuraguchi, Tatsuo Shimizu
  • Patent number: 12214577
    Abstract: A composite structure manufacturing method comprising: a lamination step in which a plurality of fiber-reinforced resin sheets are laminated to form a plate-shaped laminate; a pressing deformation step in which a third roller or similar, which rolls along a plate surface of the laminate, is used to press the plate surface of the laminate, thereby forming a recessed section or a protruding section in a prescribed section of the laminate; a short direction deformation step in which, after the pressing deformation step, the laminate is deformed in the short direction to make the long direction cross-section into a prescribed shape; and a long direction deformation step in which, after the pressing deformation step, the laminate is deformed in the long direction to make the short direction cross-section into a prescribed shape.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: February 4, 2025
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Homare Yamato, Masahiko Shimizu, Toshiki Kitazawa, Shoya Mano, Akihiro Terasaka
  • Patent number: 12128639
    Abstract: A forming device includes: a forming jig extending along an axial direction; a forming die having a shape corresponding to a top part region and a wall part region of the forming jig; and a movement mechanism that moves the forming die so as to approach a bottom part region along a height direction HD. The forming die includes: a body part; a plate-shaped forming part that is attached to the body part so as to be swingable around a swing shaft; and a pressurization part that generates a pressurization force which causes a distal end part of the forming part to push a layered body against the wall part region when the forming die is moved by the movement mechanism so as to approach the bottom part region. In accordance with the distal end part, the part causes a contact surface to contact a region of the layered body.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: October 29, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Homare Yamato, Masahiko Shimizu, Shoya Mano, Toshiki Kitazawa, Hideki Horizono
  • Patent number: 12122085
    Abstract: A forming method according to the present disclosure includes a laminating step for forming an intermediate formed article by supplying and laminating a fibrous sheet onto forming surfaces of a forming die for forming the intermediate formed article; and a bending process step for performing a bending process on the intermediate formed article, which is laminated on the forming surfaces and has a shape that corresponds to the forming die, to yield a formed article. The forming surfaces have shapes that correspond to the intermediate formed article to be formed. The second forming surface is bent with respect to the first forming surface among the forming surfaces, and the angle formed by the first forming surface and the second forming surface is greater than the bending angle of the cross-section of the formed article to be formed and less than 180 degrees.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: October 22, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Toshiki Kitazawa, Masahiko Shimizu, Shoya Mano
  • Patent number: 12060322
    Abstract: A method for producing acetic acid includes an absorption step that suppresses corrosion inside a distillation column when a solution after that has absorbed a target component is subjected to distillation. The method for producing acetic acid also includes an absorption step of supplying, to an absorption column, at least a portion of offgas generated in an acetic acid production process, bringing the offgas into contact with an absorbent containing one or more liquids selected from a hydrocarbon, an ester of a carboxylic acid having 3 or more carbon atoms, an ester of a carboxylic acid and an alcohol having 2 or more carbon atoms, and an ether, to allow the absorbent to absorb an iodine compound in the offgas, and separating into a gas component having a lower iodine compound concentration than the offgas and a solution containing the absorbent and the iodine compound.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: August 13, 2024
    Assignee: DAICEL CORPORATION
    Inventor: Masahiko Shimizu
  • Patent number: 12059852
    Abstract: A composite material molding method includes a first disposition step for disposing a prepreg on a jig molding surface of a molding jig; a first sealing step for airtightly sealing the prepreg by covering the prepreg with a first resin bag; a second disposition step for disposing a breather so as to cover the first resin bag; a second sealing step for airtightly sealing the breather so as to cover the breather with a second resin bag; a first depressurization step for depressurizing a first space sealed by the first resin bag; a second depressurization step for depressurizing a second space sealed by the second resin bag; and a heat-curing step for heat-curing the prepreg by supplying the internal space of a pressure vessel with a steam with a predetermined temperature and a predetermined pressure.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: August 13, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yuichi Yui, Akihisa Okuda, Masahiko Shimizu, Yuki Kani, Akihiro Terasaka
  • Patent number: 12049047
    Abstract: A block is configured such that, when a composite material having a curved part in a cross-sectional shape cut by a plane orthogonal to an X-axis is deformed into a shape corresponding to a mold through pressure application while being kept in the mold, the block is brought into contact with the curved part of the composite material. The block includes: a first contact part which extends along the X-axis direction so as to be in contact with the curved part of the composite material; and a second contact part which is partially disposed along the X-axis direction, is in contact with the curved part of the composite material, and is of higher rigidity than the first contact part.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: July 30, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Toshiki Kitazawa, Hiroaki Nakamura, Masahiko Shimizu
  • Patent number: 12010791
    Abstract: A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: June 11, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Hiroshi Kawai, Taizo Nishimura, Masahiko Shimizu, Takayuki Tanaka, Naohiro Takahashi
  • Patent number: 11993030
    Abstract: A method includes laminating a plurality of fiber reinforced sheets to create a charge; and shaping, by pressing, the charge created in the lamination step into a shaping mold. The charge has a predetermined angle layer including the plurality of fiber reinforced sheets, the fiber direction of which is aligned in a single direction. The predetermined angle layer has n-number of constitutional layers (n?2) ranging from a first constitutional layer to an n-th constitutional layer each including the plurality of fiber reinforced sheets, wherein the n-th constitutional layer is laminated on an (n?1)-th constitutional layer, the plurality of fiber reinforced sheets in each of the constitutional layers have dividing portions which are along the fiber direction and which are disposed one by one at respective positions within a predetermined range along the fiber direction in the predetermined angle layer.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: May 28, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masahiko Shimizu, Shoya Mano, Toshiki Kitazawa, Homare Yamato, Kenichi Kawamura, Yoko Taguchi
  • Patent number: 11945179
    Abstract: The preset invention is to mold a laminate at a high accuracy by appropriately generating slippage between fiber sheets of the laminate at bending. A method for molding a laminate includes a step in which a plurality of gripping parts, which are arranged apart from each other, grip an area, wherein slippage between fiber sheets is prevented, in a plate-shaped laminate including a plurality of fiber sheets laminated each other; a step in which the plurality of gripping parts grip the area wherein slippage between the fiber sheets is prevented, while maintaining the state wherein relative moving of the area of the laminate and the gripping parts is prevented; and a step in which the gripping parts move so as to subject the laminate to bending.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: April 2, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Toshiki Kitazawa, Homare Yamato, Masahiko Shimizu, Hiromichi Akiyama, Akihiro Terasaka
  • Publication number: 20240034010
    Abstract: A shaping method includes suturing, with a linear suture material, first end regions in a first predetermined direction of a plurality of sheet materials. The method includes fixing a second end region in the first predetermined direction of a laminated body to a first shaping method having a curved portion including at least one of a concave shape and a convex shape along a second predetermined direction in a state where the first predetermined direction coincides with the second predetermined direction. The method includes pressing a second shaping mold against the laminated body, which has been fixed to the first shaping mold in the fixing step, to shape the laminated body along the surface shape of the first shaping mold. The laminated body is shaped by applying a tension in the direction of pulling the first end region away from the second end region.
    Type: Application
    Filed: March 11, 2021
    Publication date: February 1, 2024
    Inventors: Toshiki KITAZAWA, Masahiko SHIMIZU, Tomoya MURATA
  • Patent number: 11884617
    Abstract: Provided is an acetic acid production method that enables smooth reduction and/or increase of acetic acid production with easy operation and can industrially efficiently, stably produce acetic acid with maintained quality even when the acetic acid production volume is changed. The acetic acid production method includes a carbonylation step in which methanol is reacted with carbon monoxide in a continuous system in the presence of a catalytic system, acetic acid, methyl acetate, and water, where the catalytic system includes a metal catalyst and methyl iodide. The carbonylation step employs two or more reactors disposed in parallel.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: January 30, 2024
    Assignee: DAICEL CORPORATION
    Inventor: Masahiko Shimizu
  • Publication number: 20230398751
    Abstract: A manufacturing device manufactures a composite material structure by impregnating resin into a preform formed in a predetermined shape. The manufacturing device includes: a caul plate defining a space inside and covering the preform in the space; a supply part that supplies resin to the preform; a discharge part that discharges a gas from the space through a discharge hole in the caul plate; and a pressure intensifier that is provided in the space and between the caul plate and the preform and pressurizes the preform by a gas being discharged through the discharge part. The pressure intensifier has a web part facing surface facing the preform and a caul plate facing surface facing the caul plate, and through holes between the web part facing surface and the caul plate facing surface are in the pressure intensifier.
    Type: Application
    Filed: January 17, 2023
    Publication date: December 14, 2023
    Inventors: Hiroshi TOKUTOMI, Masahiko SHIMIZU, Shoya MANO, Kentaro SHINDO, Takeshi FUJITA
  • Patent number: 11812392
    Abstract: A wireless communication apparatus outputs first and second beams, based on a weighting vector representing gain and/or phase weighting. The apparatus derives a weighting vector corresponding to a maximum eigen value of a matrix obtained by subtracting, from a first matrix representing a main lobe output power of the first beam, a matrix obtained by multiplying a second matrix representing a side lobe output power of the first beam to a reduction ratio for reducing the side lobe output power of the first beam interfering with a main lobe of the second beam. The apparatus determines whether or not a power ratio of the main lobe output power of the first beam with respect to the side lobe output power of the first beam is greater than a maximum SIRmax, and extracts the weighting vector when the power ratio is not larger than the maximum SIRmax.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: November 7, 2023
    Assignee: FUJITSU LIMITED
    Inventor: Masahiko Shimizu
  • Publication number: 20230338248
    Abstract: To yield a high-purity 1,3-butylene glycol product that is colorless and odorless (or almost colorless and odorless) and unlikely to cause or increase coloration and odor over time. A 1,3-butylene glycol product containing 1,3-butylene glycol, wherein a sum of contents of acetaldehyde, crotonaldehyde, methyl vinyl ketone, acetone, formaldehyde, butylaldehyde, acetaldol, 1-hydroxy-3-butanone, 2-butanol and compounds represented by Formulas (1) to (10) below is less than 65 ppm.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 26, 2023
    Applicant: DAICEL CORPORATION
    Inventors: Katsuya MARUO, Satoshi KUSAKABE, Hirotoshi KITAMURA, Tomoko NISHIMURA, Masahiko SHIMIZU, Youji SUZUKI
  • Publication number: 20230330913
    Abstract: A laminated body reference surface curved relative to the X-axis direction and overlapped on a shaping die reference surface and a laminated body bend surface intersecting the laminated body reference surface along the X-axis direction and overlapped on a shaping die bend surface are provided, the angle between the laminated body reference surface and the laminated body bend surface is larger than the angle between the shaping die reference surface and the shaping die bend surface. When a ridge where the shaping die reference surface and the shaping die bend surface intersect defines a shaping die edge, and a ridge where the laminated body reference surface and the laminated body bend surface intersect defines a laminated body edge, the laminated body edge is displaced from the shaping die edge on the shaping die reference surface with the laminated body reference surface being overlapped on the shaping die reference surface.
    Type: Application
    Filed: December 14, 2022
    Publication date: October 19, 2023
    Inventors: Toshiki KITAZAWA, Masahiko SHIMIZU
  • Patent number: 11773044
    Abstract: A method for producing acetic acid can improve the life of a silver-substituted ion exchange resin for removing organic iodine compounds in acetic acid. In a carbonylation process of a methanol method, an acetic acid distillation step has at least one distillation step of carrying out the purification of an acetic acid stream under conditions of a column bottom temperature of a distillation column of less than 175° C., a nickel base alloy or zirconium is used as a material of the distillation column in the distillation step, and as metal ion concentrations in a charging mixture of the distillation column in the distillation step, an iron ion concentration is less than 10,000 ppb by mass, a chromium ion concentration is less than 5,000 ppb by mass, a nickel ion concentration is less than 3,000 ppb by mass, and a molybdenum ion concentration is less than 2,000 ppb by mass.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: October 3, 2023
    Assignee: DAICEL CORPORATION
    Inventor: Masahiko Shimizu
  • Patent number: RE50062
    Abstract: A process for producing acetic acid by: a reaction step for continuously allowing methanol to react with carbon monoxide in the presence of a catalyst system comprising a metal catalyst, an ionic iodide, and methyl iodide in a carbonylation reactor, a flash distillation step for continuously feeding a flasher with a reaction mixture from the reactor and evaporating a volatile component at least containing product acetic acid, methyl acetate, and methyl iodide by flash distillation to separate the volatile component and a liquid catalyst mixture at least containing the metal catalyst and the ionic iodide, and an acetic acid collection step for separating a stream containing acetic acid from the volatile component to collect acetic acid; wherein, in the flash distillation step, the flash distillation is conducted under the condition that the concentration of methyl acetate in the liquid catalyst mixture is not less than 0.6% by weight.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: July 30, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Masahiko Shimizu, Ryuji Saito, Hiroyuki Miura, Takashi Ueno, Hidehiko Nakajima