Abstract: A non-transitory medium recording an information processing program causing a computer to execute procedures, the procedures includes receiving, as input, positional information that indicates a position of a part of the data file from the reference position, searching a second management information item corresponding to the input, searching a first management information item corresponding to the input and the searched second management information item, and accessing the part that is among the parts of the data file and stored at a position indicated by the searched first management information item; calculating, based on a frequency of access to the accessed part, a distribution of frequencies of access to the parts associated with the first management information items; and updating, based on the distribution of the frequencies, the positional information indicated by the second management information items and first management information items.

Abstract: A challenge to be met by the invention is to provide an electronic component mounting machine that makes up an electronic component mounting line and that standardizes an operation input method, to thus enable lessening of work load on an operator during performance of operation input action, and an operation instruction method for use with the electronic component mounting machine. In electronic component mounting machines that make it possible for a single machine to perform a plurality of types of works by replacement of a work head to be built into a common platform according to a type of work, a production start button to a model change button are provided as common individual input parts in a basic operation command input part of a display panel of an operation unit regardless of a work type.

Abstract: A liquid crystal display device includes a liquid crystal display panel, a functional panel, a photo curable adhesive, a transparent electrode, and a light blocking line. The liquid crystal panel includes a display area to display an image and a non-display area surrounding the display area. The functional panel is attached to the liquid crystal panel, and includes a display overlapping area overlapping with the display area and a display non-overlapping area overlapping with the non-display area in a plan view. The photo curable adhesive is arranged between the panels and cured by light applied thereto. The transparent electrode is arranged in the display overlapping area and made of light transmissive conductive material. The light blocking line is arranged in the display non-overlapping area and made of light shielding metal material. The light blocking line partially has a light-transmission cutout that is configured to allow the light to pass therethrough.

Abstract: An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item.

Abstract: The present invention relates to a cleaning method for a submerged membrane element used in a membrane bioreactor treatment in which organic wastewater containing 1 mg/L or more of manganese is subjected a biological treatment in a bioreactor treatment tank and then subjected to solid-liquid separation by a membrane filtration device provided in the bioreactor treatment tank, in which after a first liquid containing an oxidizing agent is injected from a secondary side of the submerged membrane element to a primary side thereof and maintained for a certain period of time, the first liquid containing an oxidizing agent is suction-discharged from the secondary side to the outside of the system, and then a second liquid containing an acid is injected from the secondary side of the submerged membrane element to the primary side thereof and maintained for a certain period of time, followed by conducting suction filtration operation.

Abstract: An information processing apparatus includes: a reception unit configured to receive a packet string in which packet groups including data on a plurality of video frames and having an identifier indicating a beginning of the video frame assigned to respective packets including each initial part of the plurality of video frames are arranged in a video reproduction order; a counting unit configured to count a number of received packets corresponding to each of the plurality of video frames based on respective initial packets in the packet string; and a generation unit configured to generate video quality estimation information for each of the plurality of video frames to estimate a quality of the video in which the plurality of video frames are decoded on a reception terminal based on the number of received packets corresponding to each of the plurality of video frames.

Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.

Abstract: A non-transitory medium recording an information processing program causing a computer to execute procedures, the procedures includes receiving, as input, positional information that indicates a position of a part of the data file from the reference position, searching a second management information item corresponding to the input, searching a first management information item corresponding to the input and the searched second management information item, and accessing the part that is among the parts of the data file and stored at a position indicated by the searched first management information item; calculating, based on a frequency of access to the accessed part, a distribution of frequencies of access to the parts associated with the first management information items; and updating, based on the distribution of the frequencies, the positional information indicated by the second management information items and first management information items.

Abstract: A method for encoding an image having a resolution that is not a multiple of a size of a block to be encoded, includes adding, by a processor, an extension image to the image to generate an image to be encoded, the extension image being an image to be added to the image and being an image in which a boundary pixel that is present at a boundary between the extension image and the image, and an adjacent pixel that is adjacent to the boundary pixel have a difference in pixel value therebetween that has an absolute value that is equal to or greater than a certain value; and disabling a deblocking filter process at the boundary between the extension image and the image in a locally decoded image that corresponds to the image to be encoded.

Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.

Abstract: An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item.

Abstract: In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ?M indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value ?(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.

Abstract: An information processing apparatus includes: a reception unit configured to receive a packet string in which packet groups including data on a plurality of video frames and having an identifier indicating a beginning of the video frame assigned to respective packets including each initial part of the plurality of video frames are arranged in a video reproduction order; a counting unit configured to count a number of received packets corresponding to each of the plurality of video frames based on respective initial packets in the packet string; and a generation unit configured to generate video quality estimation information for each of the plurality of video frames to estimate a quality of the video in which the plurality of video frames are decoded on a reception terminal based on the number of received packets corresponding to each of the plurality of video frames.

Abstract: One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data.

Abstract: A challenge to be met by the invention is to provide an electronic component mounting machine that makes up an electronic component mounting line and that standardizes an operation input method, to thus enable lessening of work load on an operator during performance of operation input action, and an operation instruction method for use with the electronic component mounting machine. In electronic component mounting machines that make it possible for a single machine to perform a plurality of types of works by replacement of a work head to be built into a common platform according to a type of work, a production start button (42a) to a model change button (42d) are provided as common individual input parts in a basic operation command input part (42) of a display panel (4a) of an operation unit regardless of a work type.

Abstract: In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated.

Abstract: The invention relates to a substrate for use in a liquid crystal display of a CF-on-TFT structure in which a color filter is formed on the side of an array substrate in which a switching element is formed, and has an object to provide a substrate for use in a liquid crystal display, which enables simplification of a manufacturing process typified by a photolithography process and has high reliability. The substrate for use in the liquid crystal display is constructed to include external connection terminals which include first terminal electrodes electrically connected to gate bus lines led out from a plurality of pixel regions arranged on a glass substrate in a matrix form, second terminal electrodes formed of forming material of a pixel electrode and directly on the glass substrate, and electrode coupling regions for electrically connecting the first and the second terminal electrodes, and which electrically connect an external circuit and the gate bus lines.

Abstract: One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data.

Abstract: In an image recognition method, the image of a cream solder 9 printed on a rectangular electrode 16 having a solder leveler formed is picked up and recognized to identify the cream solder 9. An illuminating unit having white light source parts 35W arranged in the radial oblique directions of 45° is used to apply white color illumination lights from a light applying direction in which an angle of ?1 formed by the light applying direction and a horizontal plane in a vertical plane is 45° or smaller and from a light applying direction in which an angle of ?3 formed by the light applying direction and the boundary of the electrode 16 in a horizontal plane is 75° or smaller. Thus, regularly reflected lights from a solder leveler forming surface 16a with a glossiness are not received by an upper camera to identify a solder surface 9a and the solder leveler forming surface 16a with good accuracy.