Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.

Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.

Abstract: In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ?M indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value ?(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.

Abstract: In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

Abstract: To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure. In the electronic component mounting method for mounting an electronic component on a multi-substrate in which a plurality of unit substrates are formed on the same substrate, the quality of a print state of a solder printed on electrodes formed on the plurality of unit substrates is determined by the test of the print state of the solder and a determination result is output to an electronic component placing device as solder test data in every unit substrate. In a component placing steps, a component placing mechanism is controlled based on the solder test data such that a component placing operation is performed only on the unit substrate in which the print state of the solder is determined to be good.

Abstract: A substrate for use in a liquid crystal display, including an insulating substrate cooperating with an oppositely arranged opposite substrate to hold a liquid crystal. A plurality of pixel regions are arranged on the insulating substrate in a matrix form, in each of which a switching element is formed. At least one resin color filter layer is formed on the pixel regions to cover the switching element. Additionally, at least one layer of the resin color filter layers of the plural colors has a cruciform-shaped pattern protruding to cover the switching elements of neighboring pixels when viewed in a direction of a normal of a substrate surface.

Abstract: The present invention is a water processing method comprising the steps of separating boron-containing water in a reverse osmosis membrane module to provide a permeated water and subjecting a part of the obtained permeated water to boron removal using an adsorbent, wherein the water subjected to the boron removal is mixed with the water not subjected to the boron removal of the permeated water to provide a mixed water. The present invention provides economic water processing method and apparatus that remove the boron from boron-containing water.

Abstract: The invention relates to a liquid crystal display device, and an object is to provide a liquid crystal display device capable of providing high display quality. A liquid crystal display device has first and second TFTs disposed in the vicinity of the crossing point of an nth gate bus line and a drain bus line, a first pixel electrode electrically connected to the first TFT, a second pixel electrode electrically connected to the second TFT and separated from the first pixel electrode, a third TFT whose source electrode is electrically connected to the second pixel electrode, and a buffer capacitance portion. The buffer capacitance portion is provided with a square first buffer capacitance electrode electrically connected to the drain electrode of the third TFT and a square second buffer capacitance electrode opposed to the first buffer capacitance electrode via an insulating film and electrically connected to a storage capacitance bus line.

Abstract: The invention relates to a substrate for use in a liquid crystal display of a CF-on-TFT structure in which a color filter is formed on the side of an array substrate in which a switching element is formed, and has an object to provide a substrate for use in a liquid crystal display, which enables simplification of a manufacturing process typified by a photolithography process and has high reliability. The substrate for use in the liquid crystal display is constructed to include external connection terminals which include first terminal electrodes electrically connected to gate bus lines led out from a plurality of pixel regions arranged on a glass substrate in a matrix form, second terminal electrodes formed of forming material of a pixel electrode and directly on the glass substrate, and electrode coupling regions for electrically connecting the first and the second terminal electrodes, and which electrically connect an external circuit and the gate bus lines.

Abstract: The invention relates to a substrate for use in a liquid crystal display of a CF-on-TFT structure in which a color filter is formed on the side of an array substrate in which a switching element is formed, and has an object to provide a substrate for use in a liquid crystal display, which enables simplification of a manufacturing process typified by a photolithography process and has high reliability. The substrate for use in the liquid crystal display is constructed to include external connection terminals which include first terminal electrodes electrically connected to gate bus lines led out from a plurality of pixel regions arranged on a glass substrate in a matrix form, second terminal electrodes formed of forming material of a pixel electrode and directly on the glass substrate, and electrode coupling regions for electrically connecting the first and the second terminal electrodes, and which electrically connect an external circuit and the gate bus lines.

Abstract: The invention relates to a substrate for use in a liquid crystal display of a CF-on-TFT structure in which a color filter is formed on the side of an array substrate in which a switching element is formed, and has an object to provide a substrate for use in a liquid crystal display, which enables simplification of a manufacturing process typified by a photolithography process and has high reliability. The substrate for use in the liquid crystal display is constructed to include external connection terminals which include first terminal electrodes electrically connected to gate bus lines led out from a plurality of pixel regions arranged on a glass substrate in a matrix form, second terminal electrodes formed of forming material of a pixel electrode and directly on the glass substrate, and electrode coupling regions for electrically connecting the first and the second terminal electrodes, and which electrically connect an external circuit and the gate bus lines.

Abstract: A conductive film made of Al or alloy containing Al as a main component is formed on an underlying substrate. An upper conductive film is disposed on the conductive film. A first opening is formed through the upper conductive film. An insulating film is disposed on the upper conductive film. A second opening is formed through the insulating film. An inner wall of the second opening is retreated from an inner wall of the first opening. An ITO film is formed covering a partial upper surface of the insulating film and inner surfaces of the first and second openings, and contacting a partial upper surface of the upper conductive film at a region inside of the second opening. Good electrical contact between an Al or Al alloy film and an ITO film can be established and productivity can be improved.

Abstract: A conductive film made of Al or alloy containing Al as a main component is formed on an underlying substrate. An upper conductive film is disposed on the conductive film. A first opening is formed through the upper conductive film. An insulating film is disposed on the upper conductive film. A second opening is formed through the insulating film. An inner wall of the second opening is retreated from an inner wall of the first opening. An ITO film is formed covering a partial upper surface of the insulating film and inner surfaces of the first and second openings, and contacting a partial upper surface of the upper conductive film at a region inside of the second opening. Good electrical contact between an Al or Al alloy film and an ITO film can be established and productivity can be improved.

Abstract: A conductive film made of Al or alloy containing Al as a main component is formed on an underlying substrate. An upper conductive film is disposed on the conductive film. A first opening is formed through the upper conductive film. An insulating film is disposed on the upper conductive film. A second opening is formed through the insulating film. An inner wall of the second opening is retreated from an inner wall of the first opening. An ITO film is formed covering a partial upper surface of the insulating film and inner surfaces of the first and second openings, and contacting a partial upper surface of the upper conductive film at a region inside of the second opening. Good electrical contact between an Al or Al alloy film and an ITO film can be established and productivity can be improved.

Abstract: In an image recognition method, the image of a cream solder 9 printed on a rectangular electrode 16 having a solder leveler formed is picked up and recognized to identify the cream solder 9. An illuminating unit having white light source parts 35W arranged in the radial oblique directions of 45° is used to apply white color illumination lights from a light applying direction in which an angle of &thgr;1 formed by the light applying direction and a horizontal plane in a vertical plane is 45° or smaller and from a light applying direction in which an angle of &thgr;3 formed by the light applying direction and the boundary of the electrode 16 in a horizontal plane is 75° or smaller. Thus, regularly reflected lights from a solder leveler forming surface 16a with a glossiness are not received by an upper camera to identify a solder surface 9a and the solder leveler forming surface 16a with good accuracy.

Abstract: The present invention is a water processing method comprising the steps of separating boron-containing water in a reverse osmosis membrane module to provide a permeated water and subjecting a part of the obtained permeated water to boron removal using an adsorbent, wherein the water subjected to the boron removal is mixed with the water not subjected to the boron removal of the permeated water to provide a mixed water. The present invention provides economic water processing method and apparatus that remove the boron from boron-containing water.

Abstract: A spiral reverse osmosis membrane element of the present invention includes a plurality of bag-shaped reverse osmosis membranes, permeated liquid passage members arranged inside the reverse osmosis membranes, and a plurality of feed liquid passage members interposed between the reverse osmosis membranes, those membranes and passage members being wound around an outer surface of a hollow pipe in a manner that only the interiors of the reverse osmosis membranes communicate with through-holes formed in the surface of the hollow pipe. Each of the feed liquid passage members is a mesh member having series of quadrilateral meshes formed by a plurality of linear members crossing each other. Two opposite cross-points out of four cross-points of each of the quadrilateral meshes are in line in parallel with an axial direction of the hollow pipe. And relations 2 mm≦X≦5 mm and X≦Y≦1.

Abstract: A method and apparatus for desalinating water, especially sea water, having a plurality of membrane module units disposed at respective successive stages are disclosed. Permeated water from a first stage membrane module unit is supplied to a second stage membrane module unit to obtain permeated water. The apparatus contains at least first and second membrane module units at respective successive first and second stages for water permeation.

Abstract: A conductive film made of Al or alloy containing Al as a main component is formed on an underlying substrate. An upper conductive film is disposed on the conductive film. A first opening is formed through the upper conductive film. An insulating film is disposed on the upper conductive film. A second opening is formed through the insulating film. An inner wall of the second opening is retreated from an inner wall of the first opening. An ITO film is formed covering a partial upper surface of the insulating film and inner surfaces of the first and second openings, and contacting a partial upper surface of the upper conductive film at a region inside of the second opening. Good electrical contact between an Al or Al alloy film and an ITO film can be established and productivity can be improved.

Abstract: A conductive film made of Al or alloy containing Al as a main component is formed on an underlying substrate. An upper conductive film is disposed on the conductive film. A first opening is formed through the upper conductive film. An insulating film is disposed on the upper conductive film A second opening is formed through the insulating film. An inner wall of the second opening is retreated from an inner wall of the first opening. An ITO film is formed covering a partial upper surface of the insulating film and inner surfaces of the first and second openings, and contacting a partial upper surface of the upper conductive film at a region inside of the second opening. Good electrical contact between an Al or Al alloy film and an ITO film can be established and productivity can be improved.