Abstract: A resistance circuit is configured such that a P-type resistance section and an N-type resistance section are electrically connected in series, the P-type resistance section is configured with P-type diffusion layer resistance elements that are disposed to form a right angle with respect to each other and that are electrically connected in series, and the N-type resistance section is configured with N-type diffusion layer resistance elements that are disposed to form the right angle with respect to each other and that are electrically connected in series. Furthermore, the P-type diffusion layer resistance element is disposed along a <100> orientation direction of a semiconductor substrate, and the N-type diffusion layer resistance element is disposed along a <110> orientation direction of the semiconductor substrate. It is thereby possible to provide the resistance circuit, an oscillation circuit, and an in-vehicle sensor apparatus that reduce stress-induced characteristic fluctuations.

Abstract: In configurations in which a circuit element is connected in parallel with a resistor, it is difficult to detect a break in the two wires. A thermal flow meter includes a heating element and a temperature controlling bridge circuit that is formed of a plurality of resistors and controls the temperature of the heating element. The thermal flow meter includes: a circuit element connected in parallel with at least one resistor configuring the temperature controlling bridge circuit through two wires drawn from both ends of the resistor; a voltage detection circuit that detects that the magnitude of voltage produced between the two wires has become smaller than a first predetermined value; and a fault signal output circuit that, when it is detected at the voltage detection circuit that the. magnitude of the voltage has become smaller than the first predetermined value, outputs a signal indicating a fault.

Abstract: A substrate processing device includes a housing connected to ground, a cathode stage that supports a substrate, an anode unit, and a gas feeding unit that feeds gas toward the first plate. The cathode stage is applied with voltage for generating plasma. The anode unit includes a first plate including first through holes and a second plate including second through holes that are larger than the first through holes. The second plate is located between the first plate and the cathode stage. The first plate produces a flow of the gas through the first through holes. The gas that has passed through the first through holes flows through the second through holes into an area between the second plate and the cathode stage. A distance between the first plate and the second plate is 10 mm or greater and 50 mm or less.

Abstract: In a protective circuit of a conventional electronic device, surge resistance is low and it is difficult to connect an external connection terminal of an integrated circuit directly to an external connection terminal of the electronic device or the like.

Abstract: Provided is a sensor device wherein malfunction due to a negative surge is suppressed. This sensor device is provided with: a sensor element wherein electrical characteristics change corresponding to physical quantities; a signal processing circuit that processes output signals of the sensor element; a first transistor element that supplies currents to the sensor element and the signal processing circuit; a control circuit that controls a base current of the first transistor element; a power supply terminal; and a ground terminal. The sensor device is characterized in that the control circuit is provided with a limiting section that limits a current flowing from the ground terminal toward a base terminal of the first transistor element.

Abstract: A touch panel of the present invention includes a touch panel substrate, a cover substrate provided to overlap the touch panel, and a connection part including a scattering layer laminated from the cover substrate side toward the touch panel substrate side and is provided between the touch panel substrate and the cover substrate in an area other than a display area.

Abstract: To provide a cell culture container and a cell culture system that can perform cell sorting, culturing, cell processing, and the like in one space and a volume of the space can be varied to suit respective steps. A cell culture container includes first molecules each bondable to target cells to be cultured, being immobilized to the container via a stimulus degradable linker, the container having a variable volume.

Abstract: In order to provide a thermal flow sensor having high measurement accuracy, the thermal type air flow sensor includes a flow detecting unit, a sub passage on which the flow detecting unit is disposed, and an LSI to which a signal obtained by the flow detecting unit is input and which outputs a signal to the outside. A side wall of the sub passage is disposed between the flow detecting unit and the LSI, or on the LSI. A diffusion resistor provided inside the LSI has its longitudinal direction in parallel with a <100> orientation of single-crystal Si.

Abstract: A thin substrate processing device include a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.

Abstract: The purpose of the present invention is to provide a thermal flow-rate sensor that is capable of self-diagnosis. Provided is a thermal flow-rate sensor provided with a semiconductor element that detects a flow rate and that is equipped with electrode pads for electrical conduction with the outside, wherein at least two of the electrode pads are provided, and other electrode pads proximate to the electrode pads are arranged and have an electric potential beyond the scope of output to be used at the time of flow rate detection.

Abstract: A sensor device includes a detection resistor having a resistance value changing according to a physical quantity and a reference resistor compared with the detection resistor, the reference resistor is configured by electrically connecting a first resistance circuit and a second resistance circuit. The first resistance circuit includes a first and a second resistive element having positive and negative resistance temperature coefficients, respectively, which are electrically connected. The second resistance circuit includes a third and a fourth resistive elements having a positive and a negative resistance temperature coefficient, respectively, which are electrically connected. The first resistance circuit is configured to generate a first deviation to either the positive or negative side with respect to a temperature change, and the second resistance circuit is configured to generate a second deviation to the side opposite to the positive or negative side where the first deviation is generated.

Abstract: A radioprotective unwoven fabric is a sheet in which metal fibers are three-dimensionally and randomly stacked, the metal fibers each comprising a metal material having a specific gravity higher than a specific gravity of lead. The metal fibers may comprise a tungsten wire.

Abstract: Provided is an electronic device which can easily measure a standby current of an internal circuit of an electronic device after burn-in. The electronic device includes: a power source terminal; a regulator that generates a predetermined voltage from a voltage of the power source terminal; an internal circuit that is operated by an output voltage of the regulator; and a standby terminal through which the regulator and the internal circuit are set to a low power consumption state.

Abstract: Provided are simplified and miniaturized cell analysis device and cell culture vessel for capturing a biological material such as a DNA or a cell two-dimensionally and further analyzing the biological material at high throughput with high sensitivity in a short time. A biological material analysis device or the cell culture vessel includes: a solid-state image sensor; and a molecule capable of bonding to a biological material, immobilized on a light-receiving surface of the solid-state image sensor via a stimulus-degradable linker.

Abstract: According to some aspects, a sample isolation kit is provided. The sample isolation kit includes a housing configured to detachably couple to a sample fluid channel of a microchip and provide a sample to the microchip. The housing and the microchip are coupled using a hermetic seal. The sample isolation kit further includes a storage housing configured to detachably couple to an isolation channel of the microchip and receive a target biological sample isolated from the sample by the microchip. The storage housing and the microchip are coupled using a hermetic seal.

Abstract: A microchip is provided and configured to contain a sample solution for analysis. The microchip including a channel that is maintained at a pressure level less than atmospheric pressure so as to allow flow of the sample solution thru the channel; and a pressure indication section configured to detect a change in the pressure level. A microchip apparatus and a method of manufacturing a microchip are also provided.

Abstract: A bonding pad of a semiconductor chip in a QFP includes, in its exposed portion, a via disposition area comprising: a first segment that connects a corner and a first point; a second segment that connects the corner and a second point; and an arc that connects the first point and the second point and forms a convex shape toward the corner. Further, in a plan view of the bonding pad, at least a part of a via is disposed so as to overlap with the via disposition area.

Abstract: A thermal flow sensor with improved measurement accuracy is provided. The thermal flow sensor includes: an air flow rate detection element with a diaphragm having a thin-film portion in a semiconductor substrate; at least one heat generating resistor on the diaphragm; at least one temperature measuring resistor that detects temperature on each of an upstream side and a downstream side of the heat generating resistor; and a correction circuit portion that processes an output signal of the air flow rate detection element on the basis of temperature difference information of at least the two temperature measuring resistors on the upstream side and the downstream side, wherein a waveform of the output signal processed by the correction circuit portion is a waveform obtained by cutting a part of a mountain part or a valley part constituting a peak value by outputting of an arbitrary predetermined value when the peak value of the waveform exceeds the arbitrary predetermined value.

Abstract: The present invention makes it possible to improve the reliability of a semiconductor device. The semiconductor device has, over a semiconductor substrate, a pad electrode formed at the uppermost layer of a plurality of wiring layers, a surface protective film having an opening over the pad electrode, a redistribution line being formed over the surface protective film and having an upper surface and a side surface, a sidewall barrier film comprising an insulating film covering the side surface and exposing the upper surface of the redistribution line, and a cap metallic film covering the upper surface of the redistribution line. Then the upper surface and side surface of the redistribution line are covered with the cap metallic film or the sidewall barrier film and the cap metallic film and the sidewall barrier film have an overlapping section.

Abstract: According to some aspects, a method for analyzing a cell is provided. The method includes trapping the cell by binding a first molecule to the cell. The method further includes binding a second molecule to the cell. The second molecule includes a binding portion capable of specific binding to a cell-surface molecule of the cell. The second molecule further includes an identifying portion, a labeling portion coupled to the identifying portion, and a stimulus-degradable linker between the binding portion and the identification portion. The method further includes detaching the identifying portion from the binding portion by stimulating the stimulus-degradable linker where the detached identifying portion is coupled to the labeling portion. The method further includes binding the detached identifying portion through specific binding to an identifying portion recognizing molecule and detecting the labeling portion.