Patents by Inventor Masahiro Matsumoto

Masahiro Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE
    Publication number: 20170372996
    Abstract: A bonding pad of a semiconductor chip in a QFP includes, in its exposed portion, a via disposition area comprising: a first segment that connects a corner and a first point; a second segment that connects the corner and a second point; and an arc that connects the first point and the second point and forms a convex shape toward the corner. Further, in a plan view of the bonding pad, at least a part of a via is disposed so as to overlap with the via disposition area.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 28, 2017
    Inventors: Masahiro MATSUMOTO, Akira Yajima, Kazuyoshi Maekawa
  • FIBER PRODUCT AND METAL FIBER
    Publication number: 20170350044
    Abstract: A metal fiber included in a fiber product includes a tungsten wire having a diameter less than or equal to 22 ?m. The tungsten wire may have, for example, a diameter less than or equal to 18 ?m. The tungsten wire may have, for example, a diameter within a range from 20% less than 13 ?m to 20% greater than 13 ?m. In addition, the tungsten wire may have, for example, a diameter greater than or equal to 5 ?m. Further, the tungsten wire may include, for example, pure tungsten. Moreover, the metal fiber may be, for example, a metal thread including a false-twisted yarn which is made of a chemical fiber and is wound.
    Type: Application
    Filed: May 31, 2017
    Publication date: December 7, 2017
    Inventors: Kazushige SUGITA, Masahiro MATSUMOTO, Taisuke SHIMAZU, Tomohiro KANAZAWA
  • SENSOR DEVICE
    Publication number: 20170345987
    Abstract: The purpose of the present invention is to provide a highly accurate and highly reliable physical quantity sensor wherein an error due to stress applied to a sensor element of the physical quantity sensor is reduced. This physical quantity sensor device is provided with: a hollow section formed in a Si substrate; an insulating film covering the hollow section; and a heating section formed in the insulating film. The sensor device is also provided with a detection element that detects the temperature of the insulating film above the hollow section, the detection element is provided with a first silicon element and a second silicon element, and the first silicon element and the second silicon element are doped with different impurities, respectively.
    Type: Application
    Filed: July 1, 2015
    Publication date: November 30, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hiroshi NAKANO, Masahiro MATSUMOTO, Yoshimitsu YANAGAWA, Yasuo ONOSE
  • Electronic Device
    Publication number: 20170344040
    Abstract: Provided is an electronic device which can easily measure a standby current of an internal circuit of an electronic device after burn-in. The electronic device includes: a power source terminal; a regulator that generates a predetermined voltage from a voltage of the power source terminal; an internal circuit that is operated by an output voltage of the regulator; and a standby terminal through which the regulator and the internal circuit are set to a low power consumption state.
    Type: Application
    Filed: November 27, 2015
    Publication date: November 30, 2017
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Masahiro MATSUMOTO, Hiroshi NAKANO, Yoshimitsu YANAGAWA, Akira KOTABE
  • TARGET SUBSTANCE MEASUREMENT KIT, TARGET SUBSTANCE MEASUREMENT SYSTEM, IMMUNOCHROMATOGRAPHY MEASUREMENT KIT, AND IMMUNOCHROMATOGRAPHY MEASUREMENT SYSTEM
    Publication number: 20170285019
    Abstract: Provided is a target substance measurement kit for detecting a target substance sensitively in a convenient manner. Provided is a target substance measurement kit including a capturing unit that captures a target substance contained in a liquid and a flow rate control unit that controls the rate of flow of the liquid in the capturing unit. The flow rate control unit is provided downstream from the capturing unit in the flow direction of the liquid.
    Type: Application
    Filed: August 17, 2015
    Publication date: October 5, 2017
    Applicant: Sony Corporation
    Inventor: Masahiro Matsumoto
  • SENSOR DEVICE
    Publication number: 20170278838
    Abstract: In conventional sensor devices, it has been difficult to achieve both EMC resistance and ESD resistance, which are required at the output terminals of an automobile sensor device. A sensor device 1 of the present embodiment comprises: a power supply terminal 2 that supplies power; a ground terminal 3; a sensor element 4, the electrical characteristics of which change in accordance with a physical quantity; a signal processing integrated circuit 5 that processes an output signal output from the sensor element 4; and an output terminal that outputs the output signal processed by the signal processing integrated circuit 5.
    Type: Application
    Filed: September 16, 2014
    Publication date: September 28, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Masahiro MATSUMOTO, Hiroshi NAKANO, Yoshimitsu YANAGAWA, Akira KOTABE
  • Thermal type flowmeter with particle guide member
    Patent number: 9772208
    Abstract: Provided is a thermal type flowmeter in which contamination of a sensor element is reduced. The flowmeter includes a sensor element including a heating resistor formed in a thin film part, the thin film part being provided on a diaphragm formed on a substrate; a support member to locate the sensor element thereon; a secondary channel that includes part of the support member and takes in part of intake air flowing through an air intake pipeline; and a guide member provided on the support member or the sensor element that lies on a line L that extends along an air flow in the secondary channel and passing over the thin film part, the guide member allowing fine particles to be guided in a direction away from the line L, the fine particles coming together with an air flow along the surface of the support member or the sensor element.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: September 26, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroshi Nakano, Masahiro Matsumoto, Satoshi Asano, Keiji Hanzawa
  • Thermal Air Flow- Rate Sensor
    Publication number: 20170234710
    Abstract: The purpose of the present invention is to provide a thermal flow-rate sensor that is capable of self-diagnosis. Provided is a thermal flow-rate sensor provided with a semiconductor element that detects a flow rate and that is equipped with electrode pads for electrical conduction with the outside, wherein at least two of the electrode pads are provided, and other electrode pads proximate to the electrode pads are arranged and have an electric potential beyond the scope of output to be used at the time of flow rate detection.
    Type: Application
    Filed: July 24, 2015
    Publication date: August 17, 2017
    Inventors: Ryosuke DOI, Yasuo ONOSE, Masahiro MATSUMOTO, Hiroshi NAKANO
  • Sensor Device
    Publication number: 20170227378
    Abstract: Provided is a sensor device wherein malfunction due to a negative surge is suppressed. This sensor device is provided with: a sensor element wherein electrical characteristics change corresponding to physical quantities; a signal processing circuit that processes output signals of the sensor element; a first transistor element that supplies currents to the sensor element and the signal processing circuit; a control circuit that controls a base current of the first transistor element; a power supply terminal; and a ground terminal. The sensor device is characterized in that the control circuit is provided with a limiting section that limits a current flowing from the ground terminal toward a base terminal of the first transistor element.
    Type: Application
    Filed: September 16, 2014
    Publication date: August 10, 2017
    Inventors: Yoshimitsu YANAGAWA, Masahiro MATSUMOTO, Satoshi ASANO, Hiroshi NAKANO, Akira KOTABE
  • SUBSTRATE PROCESSING DEVICE
    Publication number: 20170204510
    Abstract: A substrate processing apparatus includes a sputter chamber, two targets located in the sputter chamber to form thin films on two film formation surfaces of a substrate through sputtering, and a transport mechanism that transports the substrate along a transport passage located in the sputter chamber. One of the two targets is located at one side of the transport passage opposed to one of the two film formation surfaces of the substrate at a front side with respect to a direction in which the substrate is transported. Another one of the two targets is located at another side of the transport passage opposed to another one of the two film formation surfaces of the substrate at a rear side with respect to the direction in which the substrate is transported.
    Type: Application
    Filed: July 23, 2015
    Publication date: July 20, 2017
    Inventors: Tetsushi FUJINAGA, Atsuhito IHORI, Masahiro MATSUMOTO, Noriaki TANI, Harunori IWAI
  • SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    Publication number: 20170204509
    Abstract: A substrate processing apparatus includes a plasma generation unit that generates a plasma from a process gas in a plasma generation space in which a substrate is placed. The substrate processing apparatus also includes a cooling unit opposed to the substrate with a cooling space located in between. The cooling unit includes a supply port that supplies the process gas to the cooling space. The substrate processing apparatus also includes a process gas supply unit that supplies the process gas to the cooling unit. The substrate processing apparatus further includes a communication portion that communicates the cooling space and the plasma generation space to supply the process gas, which has been supplied to the cooling space, to the plasma generation space.
    Type: Application
    Filed: July 28, 2015
    Publication date: July 20, 2017
    Inventors: Tetsushi FUJINAGA, Atsuhito IHORI, Masahiro MATSUMOTO, Noriaki TANI, Harunori IWAI
  • Pest control agent
    Patent number: 9688634
    Abstract: Objects of the present invention are to provide a compound which is highly active against pests, to provide a pest control agent comprising the compound, and to provide a method for controlling a pest by applying the compound. The present invention provides a 4-(arylethynyl)pyridine or a salt thereof, a pest control agent which comprises the 4-(arylethynyl)pyridine or salt thereof as an active ingredient, and a method for controlling a pest by applying the 4-(arylethynyl)pyridine or salt thereof in an effective amount.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: June 27, 2017
    Assignee: ISHIHARA SANGYO KAISHA, LTD.
    Inventors: Kazuhisa Kiriyama, Masahiro Matsumoto, Kotaro Yoshida, DamdinSuren Boldbaatar, Tatsuya Jukurogi, Nao Umemoto, Tatsuya Kani, Yoko Matsuda, Kumiko Tanaka, Michiko Kanuma, Tatsuya Shimada
  • Semiconductor device and method of manufacturing the same
    Patent number: 9607956
    Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: March 28, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Masahiro Matsumoto, Kazuyoshi Maekawa, Masahiko Fujisawa
  • Flow rate measuring device with first temperature sensor in a main passage and second temperature sensor in a sub-passage
    Patent number: 9599496
    Abstract: A flow rate measuring device with high precision is provided. The flow rate measuring device includes a sub-passage that takes a part of the fluid flowing in a main passage, first temperature measuring means for measuring a temperature of the fluid flowing in the passage, second temperature measuring means for measuring a temperature of a fluid flowing in the sub-passage, detecting means for detecting a flow rate of the fluid flowing in the sub-passage, and measuring means for measuring a flow rate of the fluid flowing within the main channel on the basis of an output of the first temperature measuring means, an output of the second temperature measuring means, and an output of the detecting means.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: March 21, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Asano, Masahiro Matsumoto, Hiroshi Nakano, Keiji Hanzawa, Ryosuke Doi
  • TOUCH PANEL, METHOD OF MANUFACTURING TOUCH PANEL, AND OPTICAL THIN FILM
    Publication number: 20170060284
    Abstract: A touch panel of the present invention includes a touch panel substrate, a cover substrate provided to overlap the touch panel, and a connection part including a scattering layer laminated from the cover substrate side toward the touch panel substrate side and is provided between the touch panel substrate and the cover substrate in an area other than a display area.
    Type: Application
    Filed: April 28, 2015
    Publication date: March 2, 2017
    Inventors: Manabu HARADA, Hidenori YANAGITSUBO, Atsuhito IHORI, Toshihiro SUZUKI, Masahiro MATSUMOTO, Noriaki TANI, Masashi KUBO
  • Fluid measurement device having a circuit for precise flow measurement
    Patent number: 9574925
    Abstract: A fluid measurement device includes a circuit unit into which a first signal output from a first detection element and a second signal output from a second detection element are input. The circuit unit includes a signal processing part, a state deciding part, and a controller. The controller controls an amount of change that a change of the first signal imparts to the third signal in accordance with a result of decision by the state deciding part that determines that the state of the first signal is not within the predetermined range. The predetermined range is based on the second signal.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: February 21, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Asano, Masahiro Matsumoto, Hiroshi Nakano, Keiji Hanzawa
  • Sensor device with series circuit of MOS switch and capacitor
    Patent number: 9551735
    Abstract: In a related art sensor device, an output voltage of the sensor device is fixed not to a power supply voltage or a ground potential but to an intermediate potential upon disconnection of a power supply line or a ground line. A sensor device 1 is composed of: a detection element 8 whose voltage Vsen changes depending on a detected physical quantity; an output circuit configured by MOS switches 4 to 6, 7, 9, 10 and 12 to 17, capacitors 2, 11 and 18, an operational amplifier 19, a reference voltage source 20, and output NMOS transistor 21; a series circuit of the MOS switch 4 and the capacitor 2, the series circuit being arranged in a negative feedback part of the output circuit; and a diode 3 that connects a well electrode of the MOS switch 4 and a power supply terminal Vcc.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: January 24, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masahiro Matsumoto, Hiroshi Nakano, Keiji Hanzawa, Satoshi Asano
  • Method for fabricating microchip for nucleic acid amplification reaction
    Patent number: 9545630
    Abstract: Provided is a method for fabricating a microchip for nucleic acid amplification reaction that is capable of simple and highly accurate analysis. Provided is a method for fabricating a microchip for nucleic acid amplification reaction, the method including a solidification step of drying a reagent solution including at least a part of substances required for a nucleic acid amplification reaction, and a containment step of arranging the reagent solution including the solidified substance in wells that serve as a reaction site for a nucleic acid amplification reaction. In the microchip for nucleic acid amplification reaction fabricated by the fabrication method, since substances required for the nucleic acid amplification reaction are contained by being solidified, non-specific amplification is suppressed in a nucleic acid amplification reaction, which enables highly accurate analysis.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: January 17, 2017
    Assignee: Sony Corporation
    Inventors: Masahiro Matsumoto, Masaki Sato, Hidetoshi Watanabe
  • THIN SUBSTRATE PROCESSING DEVICE
    Publication number: 20160376697
    Abstract: A thin substrate processing device includes a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.
    Type: Application
    Filed: January 28, 2014
    Publication date: December 29, 2016
    Applicant: ULVAC, INC.
    Inventors: Tetsushi Fujinaga, Masahiro Matsumoto, Makoto Arai, Eriko Mase, Harunori Iwai, Koji Takahashi, Atsuhito Ihori
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160268222
    Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.
    Type: Application
    Filed: May 26, 2016
    Publication date: September 15, 2016
    Inventors: Masahiro Matsumoto, Kazuyoshi Maekawa, Masahiko Fujisawa