Abstract: An industrial vehicle has a body frame and an axle, which supports wheels and is pivotally supported by the body frame. A potentiometer is supported on the body frame and is spaced apart from the pivot axis of the axle by a predetermined distance. The potentiometer detects the pivot angle of the axle. A link mechanism amplifies motion of axle pivot and converts the axle motion into rotational or linear motion. The link mechanism then actuates the potentiometer in accordance with the converted motion.

Abstract: An apparatus for controlling pivoting of a forklift rear axle. A hydraulic damper is arranged between a rear axle and a forklift body. The damper includes two oil chambers. The oil chambers are connected to a first passage and a second passage. A two-way switch valve is arranged between the oil chambers. The valve permits the flow of oil between the oil chambers and allows pivoting of the rear axle when opened. The valve restricts the flow of oil between the oil chambers and prohibits pivoting of the rear axle, thereby locking the rear axle when closed. When the rear axle is released from a locked state, the valve repeats a valve cycle, which includes opening and closing the valve, to regulate the amount of fluid that flows between the chambers. The valve is then kept in an opened state. This prevents shock that may be produced by sudden tilting of the body when the rear axle is released from a locked state.

Abstract: Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.

Abstract: An apparatus for controlling pivoting the rear axle of a forklift. The forklift includes forks, which are lifted and lowered relative to a body frame. A locking mechanism, which includes a hydraulic damper and an electromagnetic valve, locks the rear axle to stabilize the body frame. A controller controls the locking mechanism to lock the rear axle when the fork height is at least as great as a predetermined height threshold value and the weight of a load on the fork is at least as great as a predetermined weight threshold value. The controller also controls the locking mechanism to lock the rear axle when the lateral acceleration is at least as great as a predetermined threshold value. Further, the controller changes the threshold value of the lateral acceleration in accordance with the fork height.

Abstract: Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) covering the circuit board, wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly.

Abstract: An axle tilt control apparatus for forklifts is disclosed. The forklift includes a rear axle pivotally supported by a body frame and a front axle rigidly fixed to the body frame. A mast is supported at the front portion of the body frame to tilt forward and backward. Forks are supported by the mast to be lifted and lowered. The center of gravity of the forklift in the fore-and-aft direction approaches the front axle as the mast is tilted forward. Pivoting of the rear axle is restricted by the hydraulic cylinder when the height of the forks is higher than a predetermined height determination value and the weight of a load on the forks is heavier than a predetermined weight determination value to improve the vehicle's stability. The weight determination value increases as the mast is tilted forward. When a load on the forks is being unloaded, tilting of the rear axle is permitted regardless of the height of the forks and the weight of the load on the forks. Therefore, the rear axle is not unnecessarily locked.

Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.

Abstract: A fastening element is constructed from a first bar-shaped member (12), wherein a second bar-shaped member (14a ) and a third bar-shaped member (14b ) extend in parallel along a direction normal to the axial direction of the first bar-shaped member (12). The first bar-shaped member (12) has respective ends in which flat or bent slanted portions (18a, 18b ) are formed. The first bar-shaped member is formed additionally with first and second ribs (20a, 20b ) which extend outwardly beyond respective connecting positions between the first bar-shaped member and the second and third bar-shaped members (14a, 14b.

Abstract: A flexible printed-circuit board covered with a coverlay is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.

Abstract: A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

Abstract: A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.