Patents by Inventor Masaki Minami

Masaki Minami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200339739
    Abstract: A prepreg comprising: carbon fibers; and a resin composition containing an epoxy resin having a biphenyl structure, a curing agent, and melamine cyanurate.
    Type: Application
    Filed: November 13, 2018
    Publication date: October 29, 2020
    Applicant: JXTG Nippon Oil & Energy Corporation
    Inventors: Masaki MINAMI, Takayuki MATSUMOTO, Ayumu KOMATA
  • Publication number: 20200325270
    Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
    Type: Application
    Filed: October 26, 2018
    Publication date: October 15, 2020
    Applicant: JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Yoshinori NISHITANI, Masaki MINAMI, Tatsuki SATO
  • Publication number: 20200308340
    Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
    Type: Application
    Filed: October 26, 2018
    Publication date: October 1, 2020
    Applicant: JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Yoshinori NISHITANI, Masaki MINAMI, Tatsuki SATO
  • Publication number: 20200299441
    Abstract: Provided is a surface treatment agent which does not use fluorine-containing monomers, particularly fluoroalkyl group-containing monomers. Additionally, provided is a copolymer which includes a first polymer formed from first monomers, and a second polymer formed from second monomers. The copolymer does not include fluorine. The second polymer is polymerized in the presence of the first polymer. The first monomers include a long-chain acrylate ester monomer (a) represented by the formula CH2=CA11-C(?O)—O-A12 (in the formula, A11 represents hydrogen, a monovalent organic group, or a halogen, and A12 represents a C18-30 straight-chain or branched hydrocarbon group). The first monomers and the second monomers both include a halogenated olefin monomer (b).
    Type: Application
    Filed: March 15, 2017
    Publication date: September 24, 2020
    Applicants: DAIKIN INDUSTRIES, LTD., NISSIN CHEMICAL INDUSTRY CO., LTD
    Inventors: Rumi KAWABE, Masaki FUKUMORI, Ryosuke HARA, Masahiro MIYAHARA, Shinichi MINAMI, Ikuo YAMAMOTO, Yasuhiro MITTA, Akifumi MITAKE
  • Publication number: 20200291173
    Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
    Type: Application
    Filed: October 26, 2018
    Publication date: September 17, 2020
    Applicant: JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Yoshinori NISHITANI, Masaki MINAMI, Tatsuki SATO
  • Patent number: 10640594
    Abstract: Disclosed is a fluorine-containing composition which contains a fluorine-containing polymer that has repeating units respectively derived from (A) a fluorine-containing monomer that is an alpha-chloroacrylate having a fluoroalkyl group, (B) a monomer that has a linear or branched hydrocarbon group but does not have a fluoroalkyl group, and (C) a monomer that has a cyclic hydrocarbon group but does not have a fluoroalkyl group. This fluorine-containing composition is capable of providing a base such as a fiber product with excellent water repellency, especially strong water repellency.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: May 5, 2020
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Shinichi Minami, Masaki Fukumori, Tetsuya Uehara, Hisako Nakamura, Ikuo Yamamoto
  • Publication number: 20200095422
    Abstract: There are provided a curable resin composition capable of having a rapid curing property and forming a cured product with an excellent property such as a high heat resistance, a cured product obtained from the curable resin composition, and a method for hardening the curable resin composition. There is further provided a semiconductor device using the curable resin composition as a sealant. The curable resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings, (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a phosphorus-containing curing accelerator, and optionally further contains (E) an inorganic filler. The semiconductor device contains a cured product obtained by hardening the curable resin composition containing the components (A) to (E), and further contains a semiconductor element placed in the cured product.
    Type: Application
    Filed: December 8, 2017
    Publication date: March 26, 2020
    Applicant: JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Yoshinori NISHITANI, Masaki MINAMI
  • Publication number: 20200091500
    Abstract: A positive electrode, a negative electrode, and a non-aqueous electrolyte. The negative electrode includes a negative electrode material, a binder, and a thickener, and the negative electrode material includes a lithium silicate phase, and Si particles dispersed in the lithium silicate phase. The ratio of the Si particles in the negative electrode material is 30 mass % or more. The binder includes a poly(meth)acrylic acid, the thickener includes a carboxyalkyl cellulose, and the amount of the poly(meth)acrylic acid relative to 100 parts by mass of the negative electrode material is 0.1 parts by mass or more and 5 parts by mass or less. The non-aqueous electrolyte includes a lithium salt, a non-aqueous solvent, and an acid that exhibits a pKa of 1 to 30 in water at 25° C. The non-aqueous electrolyte secondary battery can suppress the generation of gas during high-temperature storage, and secure excellent cycle characteristics.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Satoshi Nishitani, Hiroshi Minami, Masaki Deguchi
  • Patent number: 10577470
    Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and surface layers 6a and 6b provided on the surfaces of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles 4 include the polyamide 1010 resin particle.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: March 3, 2020
    Assignees: SUBARU CORPORATION, JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Yoshihiro Fukuda, Takayuki Matsumoto, Masaki Minami, Naoyuki Sekine, Masanori Nakajima
  • Publication number: 20200055970
    Abstract: Provided is a fluorinated polymer that can impart excellent washing durability and water- and oil-repellency to fibers, said fluorinated polymer having a repeating unit derived from a fluorinated monomer (a) that comprises a first fluorinated monomer (a1) represented by the formula: CH2?C(—X1)—C(?O)—Y1—Z1—Rf1 [wherein X1 represents a halogen atom; Y1 represents —O— or —NH—; Z1 represents a direct bond or a bivalent organic group; and Rf1 represents a fluoroalkyl group having 1 to 20 carbon atoms] and a second fluorinated monomer (a2) represented by the formula: CH2?C(—X2)—C(?O)—Y2—Z2—Rf2 [wherein X2 represents a monovalent organic group or a hydrogen atom; Y2 represents —O— or —NH—; Z2 represents a direct bond or a bivalent organic group; and Rf2 represents a fluoroalkyl group having 1 to 20 carbon atoms].
    Type: Application
    Filed: October 31, 2017
    Publication date: February 20, 2020
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Shinichi MINAMI, Masaki FUKUMORI, Takashi ENOMOTO, Takuya YOSHIOKA, Ikuo YAMAMOTO, Bin ZHOU, Min ZHU
  • Publication number: 20200024426
    Abstract: Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
    Type: Application
    Filed: March 30, 2018
    Publication date: January 23, 2020
    Inventors: Yoshinori NISHITANI, Masaki MINAMI
  • Patent number: 10316158
    Abstract: A production method for a fiber-reinforced composite material comprises: a step of stacking a prepreg plurally to obtain a prepreg-stacked body; and a step of heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: June 11, 2019
    Assignees: JXTG NIPPON OIL & ENERGY CORPORATION, SUBARU CORPORATION
    Inventors: Masaki Minami, Takayuki Matsumoto, Yoshihiro Fukuda, Naoyuki Sekine, Masanori Nakajima
  • Publication number: 20190119447
    Abstract: There are provided a benzoxazine compound-containing curable resin composition and a cured product obtained from the curable resin composition. The cured product can have a high strength and a high heat resistance, and therefore can be used under a severer condition in the fields of adhesive, sealant, paint, matrix resin for composite material, and the like. The curable resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings and (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups. The polyfunctional benzoxazine compound of (A) is a first benzoxazine compound or a second benzoxazine compound. The first benzoxazine compound is a compound having at least two benzoxazine ring structures represented by the following formula (1), and the second benzoxazine compound is represented by the following formula (2).
    Type: Application
    Filed: April 28, 2017
    Publication date: April 25, 2019
    Applicant: JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Masaki MINAMI, Atsushi KAMEYAMA, Ryuichi UENO
  • Patent number: 10081157
    Abstract: A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: (R1: C1-C12 chain alkyl group or the like; H is bonded to at least one of the carbon atoms of the aromatic ring at ortho- or para-position with respect to C to which the oxygen atom is bonded).
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: September 25, 2018
    Assignees: JX NIPPON OIL & ENERGY CORPORATION, SUBARU CORPORATION
    Inventors: Yoshihiro Fukuda, Takayuki Matsumoto, Masaki Minami, Naoyuki Sekine, Masanori Nakajima
  • Patent number: 9745471
    Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers 1 is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer 6a or 6b provided on at least one surface of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles 4 include a particle made of a polyamide 11.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: August 29, 2017
    Assignees: JX NIPPON OIL & ENERGY CORPORATION, FUJI JUKOGYO KABUSHIKI KAISHA
    Inventors: Yoshihiro Fukuda, Takayuki Matsumoto, Masaki Minami, Naoyuki Sekine, Masanori Nakajima
  • Patent number: 9548290
    Abstract: A semiconductor device includes a semiconductor element, a connection electrode formed on the semiconductor element, and alignment marks formed on the semiconductor element. At least one of the alignment marks is made of a magnetic material.
    Type: Grant
    Filed: June 2, 2012
    Date of Patent: January 17, 2017
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Minami
  • Publication number: 20160297942
    Abstract: A production method for a fiber-reinforced composite material comprises: a step of stacking a prepreg plurally to obtain a prepreg-stacked body; and a step of heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m.
    Type: Application
    Filed: October 28, 2014
    Publication date: October 13, 2016
    Applicants: JX NIPPON OIL & ENERGY CORPORATION, FUJI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masaki MINAMI, Takayuki MATSUMOTO, Yoshihiro FUKUDA, Naoyuki SEKINE, Masanori NAKAJIMA
  • Publication number: 20160289404
    Abstract: The prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on a surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles include polyamide resin particles made of copolymers in which caprolactam and laurolactam are copolymerized at a molar ratio of 1:9 to 3:7 and at a molar ratio of 9:1 to 7:3, respectively.
    Type: Application
    Filed: October 28, 2014
    Publication date: October 6, 2016
    Applicants: JX NIPPON OIL & ENERGY CORPORATION, FUJI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masaki MINAMI, Takayuki MATSUMOTO, Yoshihiro FUKUDA, Naoyuki SEKINE, Masanori NAKAJIMA
  • Publication number: 20160289405
    Abstract: The prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on a surface of the reinforcing fiber layer and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles include a polyamide 12 resin particle and a polyamide 1010 resin particle.
    Type: Application
    Filed: October 28, 2014
    Publication date: October 6, 2016
    Applicants: JX NIPPON OIL & ENERGY CORPORATION, FUJI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masaki MINAMI, Takayuki MATSUMOTO, Yoshihiro FUKUDA, Naoyuki SEKINE, Masanori NAKAJIMA
  • Publication number: 20160289403
    Abstract: The prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on a surface of the reinforcing fiber layer and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles include a polyamide resin particle made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 1:9 to 3:7 and a polyamide 1010 resin particle.
    Type: Application
    Filed: October 28, 2014
    Publication date: October 6, 2016
    Applicants: JX NIPPON OIL & ENERGY CORPORATION, FUJI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masaki MINAMI, Takayuki MATSUMOTO, Yoshihiro FUKUDA, Naoyuki SEKINE, Masanori NAKAJIMA