Patents by Inventor Masami Shibagaki
Masami Shibagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110121317Abstract: In an atmosphere in which a silicon carbide (SiC) substrate implanted with impurities is annealed to activate the impurities, by setting a partial pressure of H2O to be not larger than 10?2 Pa, preferably not larger than 10?3 Pa, surface irregularity of the silicon carbide (SiC) substrate is controlled to be not greater than 2 nm, more preferably not greater than 1 nm in RMS value.Type: ApplicationFiled: January 19, 2011Publication date: May 26, 2011Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Akihiro Egami
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Publication number: 20110117753Abstract: A heat treatment apparatus including a vacuum vessel, a substrate stage which holds a substrate mounted on it, a heating unit for heating the substrate, and an exhaust unit for evacuating the vacuum vessel includes a first reflector which covers the upper portion of the exhaust port of the exhaust unit while being spaced apart from the exhaust port, and a second reflector which surrounds the exhaust port. At least one of reflector members which form the second reflector faces a direction defined from the heating unit to the exhaust port.Type: ApplicationFiled: January 21, 2011Publication date: May 19, 2011Applicant: C/O CANON ANELVA CORPORATIONInventors: Hiroshi Doi, Masami Shibagaki, Yuichi Sasuga
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Patent number: 7897523Abstract: A substrate heating apparatus having a conductive heater which heats a substrate includes a filament arranged in the conductive heater and connected to a filament power supply to generate thermoelectrons, and an acceleration power supply which accelerates the thermoelectrons between the filament and conductive heater. The filament has inner peripheral portions formed at a predetermined interval along an inner circle concentric with the substrate, outer peripheral portions formed at a predetermined interval on an outer circle concentric with the inner circle and having a diameter larger than that of the inner circle, and a region formed by connecting the end point of each inner peripheral portions and the end point of a corresponding one of the outer peripheral portions.Type: GrantFiled: January 27, 2009Date of Patent: March 1, 2011Assignees: Canon Anelva Engineering Corporation, Canon Anelva CorporationInventors: Masami Shibagaki, Hiroshi Doi, Akihiro Egami, Toshiaki Sasaki, Shinya Hasegawa
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Patent number: 7807553Abstract: A substrate heating apparatus having a heating unit for heating a substrate placed in a process chamber which can be evacuated includes a suscepter which is installed between the heating unit and a substrate, and on which the substrate is mounted, and a heat receiving member which is installed to oppose the suscepter with the substrate being sandwiched between them, and receives heat from the heating unit via the suscepter. A ventilating portion which allows a space formed between the heat receiving member and substrate to communicate with a space in the process chamber is formed.Type: GrantFiled: December 6, 2007Date of Patent: October 5, 2010Assignee: Canon Anelva CorporationInventors: Masami Shibagaki, Kenji Numajiri, Akihiro Egami, Akira Kumagai, Susumu Akiyama
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Publication number: 20100243618Abstract: A temperature control method for a heating apparatus including a chamber which can be evacuated and has a conductive portion, a filament which is positioned in the chamber, a first power supply which supplies a current to the filament, a second power supply which applies, to the filament, a voltage for acceleration to the chamber, an ammeter which measures a current of the filament, and a voltmeter which measures the acceleration voltage, the method comprises a first step of evacuating an interior of the chamber; a second step of supplying the filament current from the first power supply to the filament after the first step; a third step of applying the acceleration voltage to the filament after the second step; and a fourth step of controlling the acceleration voltage to keep a surface temperature of the chamber to be lower than a temperature of the filament after the third step while keeping constant the filament current from the first power supply.Type: ApplicationFiled: March 18, 2010Publication date: September 30, 2010Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Kaori Mashimo, Hiroshi Doi
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Publication number: 20100226630Abstract: In a substrate annealing apparatus, a substrate holder unit including a substrate stage made of carbon with a high emissivity or a material coated with carbon is accommodated in a vacuum chamber to be liftable. Also, a heating unit having a heat radiating surface facing the substrate stage is disposed above the substrate holder unit within the vacuum chamber. The substrate annealing apparatus brings the substrate stage close to the heat radiating surface so that a substrate mounted on the substrate stage can be heated by radiant heat from the heat radiating surface while the heat radiating surface is not in contact with the substrate. The substrate holder unit includes a radiating plate and a reflecting plate made of one of a metal carbide, a metal nitride, and a nickel alloy.Type: ApplicationFiled: March 2, 2010Publication date: September 9, 2010Applicant: CANON ANELVA CORPORATIONInventor: Masami Shibagaki
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Patent number: 7780440Abstract: To provide a substrate supporting/transferring tray, which can be placed on a substrate supporting part arranged in a treatment chamber in which the heat treatment is performed to a substrate, especially on a substrate supporting part having a built-in heating means for heating the substrate, and on an upper side of which, the substrate is placed. At the time of heat-treating the substrate, the substrate can be more uniformly heated, and when the heat treatment is completed, the tray can be easily removed from the substrate supporting part without waiting for the temperature of the substrate to be reduced, and can transfer the substrate to other parts from the treatment chamber in which the heat treatment is performed.Type: GrantFiled: October 18, 2005Date of Patent: August 24, 2010Assignee: Canon Anelva CorporationInventors: Masami Shibagaki, Yasumi Kurematsu
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Publication number: 20100151695Abstract: A substrate processing apparatus includes a chamber capable of being evacuated, a substrate stage adapted to mount a substrate, a heating unit adapted to be set above the substrate mounting surface of the substrate stage, face the substrate mounted on at least the substrate mounting surface, and heat the substrate by radiant heat without being in contact with the substrate, a shutter adapted to be retractably inserted in the space between the heating unit and the substrate mounted on the substrate mounting surface, and a shutter driving unit adapted to extend/retract the shutter into/from the space. The substrate is mounted on the substrate stage to face the heating unit, the substrate is annealed by heating the substrate by radiant heat from the heating unit, and the shutter is extended into the space between the heating unit and the substrate stage.Type: ApplicationFiled: December 14, 2009Publication date: June 17, 2010Applicants: CANON ANELVA CORPORATION, CANON ANELVA ENGINEERING CORPORATIONInventors: Nobuyuki Masaki, Yuichi Sasuga, Masami Shibagaki, Hiroshi Doi
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Patent number: 7732739Abstract: A degassing from a susceptor heated at a high temperature in a vacuum atmosphere is suppressed. The susceptor is disposed between a heater and a substrate and partitions a space in the chamber into a first chamber space where the heater is placed and a second chambers space where the substrate is placed, and the surface of the susceptor facing the second chamber space is coated with a pyrolytic carbon layer (15) of thickness of 10 ?m to 50 ?m.Type: GrantFiled: October 18, 2005Date of Patent: June 8, 2010Assignee: Canon Anelva CorporationInventors: Masami Shibagaki, Yasumi Kurematsu
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Publication number: 20100111512Abstract: An object of the present invention is to provide a heating process apparatus capable of being controlled to a constant temperature and to temperatures in a high-temperature range higher than or equal to a 1850 degrees.Type: ApplicationFiled: November 5, 2009Publication date: May 6, 2010Applicant: CANON ANELVA CORPORATIONInventors: Akira Kumagai, Masami Shibagaki, Kenji Numajiri, Akihiro Egami
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Publication number: 20100084392Abstract: To provide a substrate supporting/transferring tray, which can be placed on a substrate supporting part arranged in a treatment chamber in which the heat treatment is performed to a substrate, especially on a substrate supporting part having a built-in heating means for heating the substrate, and on an upper side of which, the substrate is placed. At the time of heat-treating the substrate, the substrate can be more uniformly heated, and when the heat treatment is completed, the tray can be easily removed from the substrate supporting part without waiting for the temperature of the substrate to be reduced, and can transfer the substrate to other parts from the treatment chamber in which the heat treatment is performed.Type: ApplicationFiled: December 7, 2009Publication date: April 8, 2010Applicant: CANON ANELVA CORPORATIONInventors: Masami SHIBAGAKI, Yasumi Kurematsu
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Publication number: 20100025695Abstract: In an atmosphere in which a silicon carbide (SiC) substrate implanted with impurities is annealed to activate the impurities, by setting a partial pressure of H2O to be not larger than 10?2 Pa, preferably not larger than 10?3 Pa, surface irregularity of the silicon carbide (SiC) substrate is controlled to be not greater than 2 nm, more preferably not greater than 1 nm in RMS value.Type: ApplicationFiled: April 20, 2007Publication date: February 4, 2010Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Akihiro Egami
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Publication number: 20090321412Abstract: Deterioration of an O ring due to radiation heating in a vacuum heating apparatus is prevented to allow heat treatment of a substrate with good annealing properties. The vacuum heating apparatus 1 includes a vacuum chamber 2 constituted by flanges 11 and 12 having an opening portion 9 and joined together, a turbo molecular pump 17 for exhausting gas from the vacuum chamber 2, and a heater base 3 for heating a substrate 5 placed in the vacuum chamber 2. Joint surfaces of the flanges 11 and 12 are sealed by an O ring 10. Further, bonding steps 13 are formed between the heater base 3 and the O ring 10 on the joint surfaces of the flanges 11 and 12, thereby preventing thermo-radiation from the heater base 3 from reaching the O ring 10 through the joint surfaces of the flanges 11 and 12.Type: ApplicationFiled: June 12, 2009Publication date: December 31, 2009Applicant: CANON ANELVA CORPORATIONInventors: Nobuyuki Masaki, Yuichi Sasuga, Masami Shibagaki, Hiroshi Doi
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Publication number: 20090218579Abstract: In a substrate heating apparatus, thermoelectrons generated by a filament (132) in a vacuum heating vessel (103) are accelerated to collide against a conductive heater (131) which forms one surface of the vacuum heating vessel (103), thus generating heat. The conductive heater (131) is made of carbon. At least one of the inner and outer surfaces of the conductive heater (131) is coated with tantalum carbide (TaC).Type: ApplicationFiled: February 24, 2009Publication date: September 3, 2009Applicant: CANON ANELVA ENGINEERING CORPORATIONInventor: Masami Shibagaki
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Publication number: 20090202231Abstract: A heating apparatus including a filament arranged in a vacuum heating vessel comprises a base plate arranged in the vacuum heating vessel to fix the filament at a predetermined position with respect to a conductive heater forming one surface of the vacuum heating vessel. The base plate comprises a plate body having a carbon fiber.Type: ApplicationFiled: February 10, 2009Publication date: August 13, 2009Applicants: CANON ANELVA ENGINEERING CORPORATION, CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Hiroshi Doi
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Publication number: 20090190908Abstract: In an apparatus for heat-treating a substrate, a substrate holder unit including a substrate stage which is made of carbon or a carbon-covered material having high radiation ratio is arranged in a vacuum chamber to be vertically movable. A heating unit including a heat dissipation surface which opposes the substrate stage is provided above the substrate stage in the vacuum chamber. The substrate stage is moved close to the heat dissipation surface to heat the substrate in noncontact with it with radiation heat from the heat dissipation surface. The substrate holder unit includes a radiation plate and a reflection plate.Type: ApplicationFiled: April 3, 2009Publication date: July 30, 2009Applicant: CANON ANELVA CORPORATIONInventor: Masami Shibagaki
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Publication number: 20090191724Abstract: A substrate heating apparatus having a conductive heater which heats a substrate includes a filament arranged in the conductive heater and connected to a filament power supply to generate thermoelectrons, and an acceleration power supply which accelerates the thermoelectrons between the filament and conductive heater. The filament has inner peripheral portions formed at a predetermined interval along an inner circle concentric with the substrate, outer peripheral portions formed at a predetermined interval on an outer circle concentric with the inner circle and having a diameter larger than that of the inner circle, and a region formed by connecting the end point of each inner peripheral portions and the end point of a corresponding one of the outer peripheral portions.Type: ApplicationFiled: January 27, 2009Publication date: July 30, 2009Applicants: CANON ANELVA ENGINEERING CORPORATION, CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Hiroshi Doi, Akihiro Egami, Toshiaki Sasaki, Shinya Hasegawa
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Publication number: 20080213988Abstract: A substrate heating apparatus having a heating unit for heating a substrate placed in a process chamber which can be evacuated includes a suscepter which is installed between the heating unit and a substrate, and on which the substrate is mounted, and a heat receiving member which is installed to oppose the suscepter with the substrate being sandwiched between them, and receives heat from the heating unit via the suscepter. A ventilating portion which allows a space formed between the heat receiving member and substrate to communicate with a space in the process chamber is formed.Type: ApplicationFiled: December 6, 2007Publication date: September 4, 2008Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Kenji Numajiri, Akihiro Egami, Akira Kumagai, Susumu Akiyama
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Publication number: 20080128969Abstract: [PROBLEMS] To provide a substrate supporting/transferring tray, which can be placed on a substrate supporting part arranged in a treatment chamber in which the heat treatment is performed to a substrate, especially on a substrate supporting part having a built-in heating means for heating the substrate, and on an upper side of which, the substrate is placed. At the time of heat-treating the substrate, the substrate can be more uniformly heated, and when the heat treatment is completed, the tray can be easily removed from the substrate supporting part without waiting for the temperature of the substrate to be reduced, and can transfer the substrate to other parts from the treatment chamber in which the heat treatment is performed.Type: ApplicationFiled: October 18, 2005Publication date: June 5, 2008Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Yasumi Kurematsu
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Publication number: 20070194001Abstract: [PROBLEMS] To provide a substrate heat treatment apparatus that can suppress generation of the surface roughening of a substrate to which heat treatment is performed. [MEANS FOR SOLVING PROBLEMS] The substrate heat treatment apparatus is provided with a heating means for performing heat treatment to a substrate arranged in a treatment chamber which can be evacuated, and the apparatus performs heat treatment to the substrate arranged in the treatment chamber by the heating means. A susceptor is arranged between the heating means and the substrate, and susceptor surface on a side whereupon the substrate is arranged is covered with a member which does not degas while the substrate heat treatment is performed.Type: ApplicationFiled: October 18, 2005Publication date: August 23, 2007Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Yasumi Kurematsu