Patents by Inventor Masami Yamashita
Masami Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096650Abstract: A substrate processing apparatus of processing a substrate by using a processing fluid in a supercritical state, the substrate processing apparatus includes: a processing container in which the substrate is accommodated; a supply line connecting the processing container to a fluid source configured to send out the processing fluid in the supercritical state; a discharge line configured to discharge the processing fluid from the processing container; a control valve interposed in the discharge line; and a controller configured to control a pressure in the processing container by adjusting an opening degree of the control valve. In a circulation process in which the processing fluid is supplied to the processing container from the supply line, the controller is configured to adjust the opening degree of the control valve such that each of a pressure-lowering step and a pressure-raising step.Type: ApplicationFiled: September 13, 2023Publication date: March 21, 2024Inventors: Shogo FUKUI, Masami YAMASHITA, Tomofumi EMURA
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Patent number: 11594427Abstract: A substrate processing apparatus performs increasing a pressure within a processing vessel up to a processing pressure higher than a threshold pressure of a processing fluid by supplying the processing fluid into the processing vessel in which a substrate having thereon a liquid is accommodated; and supplying the processing fluid into the processing vessel and draining the processing fluid while maintaining the pressure within the processing vessel at a level allowing the processing fluid to be maintained in a supercritical state. The increasing of the pressure includes: increasing the pressure to a first pressure; and increasing the pressure to the processing pressure from the first pressure. A temperature of the substrate is controlled to a first temperature in the increasing of the pressure to the first pressure, and is controlled to a second temperature higher than the first temperature in the increasing of the pressure to the processing pressure.Type: GrantFiled: November 24, 2020Date of Patent: February 28, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Toru Ihara, Gentaro Goshi, Masami Yamashita
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Publication number: 20220130690Abstract: A substrate processing apparatus configured to dry a substrate with a processing fluid in a supercritical state includes: a processing vessel; a substrate holder configured to hold the substrate horizontally within the processing vessel; a first supply line connected to a first fluid supply provided at the processing vessel and configured to supply the processing fluid into the processing vessel; a drain line connected to a drain unit provided at the processing vessel and configured to drain the processing fluid from the processing vessel; a bypass line branched off from the first supply line and connected to the drain line, the bypass line being configured to allow at least a part of the processing fluid flowing in the first supply line to be drained into the drain line without passing through the processing vessel; and a bypass opening/closing valve configured to open or close the bypass line.Type: ApplicationFiled: October 22, 2021Publication date: April 28, 2022Inventors: Toru Ihara, Satoru Tanaka, Gentaro Goshi, Masami Yamashita, Reijiro Yamanaka, Hideaki Kumashiro
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Publication number: 20210159095Abstract: A substrate processing apparatus performs increasing a pressure within a processing vessel up to a processing pressure higher than a threshold pressure of a processing fluid by supplying the processing fluid into the processing vessel in which a substrate having thereon a liquid is accommodated; and supplying the processing fluid into the processing vessel and draining the processing fluid while maintaining the pressure within the processing vessel at a level allowing the processing fluid to be maintained in a supercritical state. The increasing of the pressure includes: increasing the pressure to a first pressure; and increasing the pressure to the processing pressure from the first pressure. A temperature of the substrate is controlled to a first temperature in the increasing of the pressure to the first pressure, and is controlled to a second temperature higher than the first temperature in the increasing of the pressure to the processing pressure.Type: ApplicationFiled: November 24, 2020Publication date: May 27, 2021Inventors: Toru Ihara, Gentaro Goshi, Masami Yamashita
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Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method and memory medium
Patent number: 10998183Abstract: A method for cleaning a substrate includes setting a substrate inside a cleaning chamber, supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film, vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate, and supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.Type: GrantFiled: February 11, 2016Date of Patent: May 4, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Miyako Kaneko, Takehiko Orii, Satoru Shimura, Masami Yamashita, Itaru Kanno -
Patent number: 10867814Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.Type: GrantFiled: February 14, 2017Date of Patent: December 15, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
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Patent number: 10792711Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.Type: GrantFiled: December 11, 2018Date of Patent: October 6, 2020Assignee: Tokyo Electron LimitedInventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
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Patent number: 10272478Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.Type: GrantFiled: July 27, 2015Date of Patent: April 30, 2019Assignee: Tokyo Electron LimitedInventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
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Publication number: 20190118227Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.Type: ApplicationFiled: December 11, 2018Publication date: April 25, 2019Applicant: Tokyo Electron LimitedInventors: Meitoku AIBARA, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
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Patent number: 10256163Abstract: Embodiments of the invention provide a method for treating a microelectronic substrate with dilute TMAH. In the method, a microelectronic substrate is received into a process chamber, the microelectronic substrate having a layer, feature or structure of silicon. A treatment solution is applied to the microelectronic substrate to etch the silicon, where the treatment solution includes a dilution solution and TMAH. A controlled oxygen content is provided in the treatment solution or in an environment in the process chamber to achieve a target etch selectivity of the silicon, or a target etch uniformity across the layer, feature or structure of silicon, or both by the treatment solution.Type: GrantFiled: November 14, 2016Date of Patent: April 9, 2019Assignee: Tokyo Electron LimitedInventors: Wallace P. Printz, Shuhei Takahashi, Naoyuki Okamura, Masami Yamashita, Derek W. Bassett, Antonio Luis Pacheco Rotondaro
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Publication number: 20180240684Abstract: A gas discharge hole 74 (205) configured to discharge a gas is provided at a position outside an edge of a substrate W held by a substrate holding unit 89 (204) within a processing chamber 81 (201). The gas discharged from the gas discharge hole 74 (205) forms a flow of the gas flowing in a direction along a first surface (front surface) of the substrate held by the substrate holding unit. A gas of a sublimation substance which is sublimated and a foreign substance included in the gas are flown along the flow of the gas to be removed from a vicinity of the substrate. The gas serves as a heat transfer medium for heat transfer from a heating unit 88 (203) to the substrate.Type: ApplicationFiled: September 29, 2016Publication date: August 23, 2018Inventors: Koji Egashira, Masami Yamashita, Yoshiyuki Honda, Yuki Yoshida, Yosuke Kawabuchi
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Patent number: 9818598Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.Type: GrantFiled: July 27, 2015Date of Patent: November 14, 2017Assignees: Tokyo Electron Limited, JSR CorporationInventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
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Publication number: 20170236729Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.Type: ApplicationFiled: February 14, 2017Publication date: August 17, 2017Inventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
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Patent number: 9700105Abstract: A surface fastener which includes a hook surface fastener (A) and a loop surface fastener (B), or a mixed surface fastener (C). The hook surface fastener (A) has hook fastener elements made of monofilaments on a surface of a base fabric. The loop surface fastener (B) has loop fastener elements made of multifilaments and capable of engaging with the hook fastener elements on a surface of a base fabric. The mixed surface fastener (C) has hook fastener elements made of monofilaments and loop fastener elements made of multifilaments on the same surface of a base fabric. The monofilaments are made from a polyethylene terephthalate-based polyester resin, and the multifilaments are made of a polybutylene terephthalate-based polyester resin.Type: GrantFiled: September 3, 2012Date of Patent: July 11, 2017Assignee: KURARAY FASTENING CO., LTD.Inventors: Takayoshi Kaikou, Masami Yamashita
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Publication number: 20170141005Abstract: Embodiments of the invention provide a method for treating a microelectronic substrate with dilute TMAH. In the method, a microelectronic substrate is received into a process chamber, the microelectronic substrate having a layer, feature or structure of silicon. A treatment solution is applied to the microelectronic substrate to etch the silicon, where the treatment solution includes a dilution solution and TMAH. A controlled oxygen content is provided in the treatment solution or in an environment in the process chamber to achieve a target etch selectivity of the silicon, or a target etch uniformity across the layer, feature or structure of silicon, or both by the treatment solution.Type: ApplicationFiled: November 14, 2016Publication date: May 18, 2017Inventors: Wallace P. Printz, Shuhei Takahashi, Naoyuki Okamura, Masami Yamashita, Derek W. Bassett, Antonio Luis Pacheco Rotondaro
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Patent number: 9629421Abstract: A double-sided engagement type fabric surface fastener, which includes a base fabric, hook-like engagement elements that exist on the top surface of the base fabric, and loop-like engagement elements that exist on the bottom surface of the base fabric, where a ground warp yarn and a ground weft yarn constituting the base fabric, the hook-like engagement elements, and the loop-like engagement elements are all yarns made of polyester resin, the ground weft yarn contains core-sheath type thermal adhesive polyester fibers, and the hook-like engagement elements and the loop-like engagement elements are both fixed to the base fabric by the thermal adhesive fibers constituting the base fabric.Type: GrantFiled: August 16, 2013Date of Patent: April 25, 2017Assignee: Kuraray Fastening Co., Ltd.Inventors: Takayoshi Kaikou, Masami Yamashita, Kazuya Maeda
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SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING SYSTEM, SUBSTRATE CLEANING METHOD AND MEMORY MEDIUM
Publication number: 20160163534Abstract: A method for cleaning a substrate includes setting a substrate inside a cleaning chamber, supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film, vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate, and supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.Type: ApplicationFiled: February 11, 2016Publication date: June 9, 2016Applicant: TOKYO ELECTRON LIMITEDInventors: Miyako KANEKO, Takehiko Orii, Satoru Shimura, Masami Yamashita, Itaru Kanno -
Publication number: 20160035561Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.Type: ApplicationFiled: July 27, 2015Publication date: February 4, 2016Inventors: Meitoku AIBARA, Yuki YOSHIDA, Hisashi KAWANO, Masami YAMASHITA, Itaru KANNO, Kenji MOCHIDA, Motoyuki SHIMA
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Publication number: 20160035564Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.Type: ApplicationFiled: July 27, 2015Publication date: February 4, 2016Inventors: Meitoku AIBARA, Yuki YOSHIDA, Hisashi KAWANO, Masami YAMASHITA, Itaru KANNO, Kenji MOCHIDA, Motoyuki SHIMA
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Publication number: 20150196100Abstract: The present invention relates to a double-sided engagement type fabric surface fastener. The surface fastener includes a base fabric, hook-like engagement elements that exist on the top surface of the base fabric, and loop-like engagement elements that exist on the bottom surface of the base fabric, wherein a ground warp yarn and a ground weft yarn constituting the base fabric, the hook-like engagement elements, and the loop-like engagement elements are all yarns made of polyester resin, the ground weft yarn contains core-sheath type thermal adhesive polyester fibers, and the hook-like engagement elements and the loop-like engagement elements are both fixed to the base fabric by the thermal adhesive fibers constituting the base fabric.Type: ApplicationFiled: August 16, 2013Publication date: July 16, 2015Applicant: KURARAY FASTENING CO., LTD.Inventors: Takayoshi Kaikou, Masami Yamashita, Kazuya Maeda