Patents by Inventor Masami Yamashita

Masami Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11491517
    Abstract: The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 ?g/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 M?·cm.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: November 8, 2022
    Assignee: ORGANO CORPORATION
    Inventors: Daisaku Yano, Masami Murayama, Yukinari Yamashita, Koji Yamanaka
  • Patent number: 11407748
    Abstract: The present invention aims to provide a heterocyclic compound having an AMPA receptor potentiator effect, which is expected to be useful as an agent for the prophylaxis or treatment of depression, Alzheimer's disease, schizophrenia, attention deficit hyperactivity disorder (ADHD) and the like. The present invention relates to a compound represented by the formula (I): wherein each symbol is as described in the specification, or a salt thereof.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: August 9, 2022
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Shinji Nakamura, Satoshi Mikami, Tomoaki Hasui, Tohru Yamashita, Shinji Morimoto, Hidekazu Tokuhara, Norio Oyabu, Masami Yamada, Atsuko Ochida, Kazuaki Takami, Xin Liu
  • Publication number: 20220230860
    Abstract: A photocathode including a substrate, a photoelectric conversion layer provided on the substrate and generating photoelectrons in response to incidence of light, and an underlayer provided between the substrate and the photoelectric conversion layer and containing beryllium, in which the underlayer has a first underlayer containing a nitride of beryllium.
    Type: Application
    Filed: May 12, 2020
    Publication date: July 21, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Terunori KAWAI, Yoshitaka TORII, Masami SHIBAYAMA, Hiroyuki WATANABE, Shinichi YAMASHITA
  • Publication number: 20220130690
    Abstract: A substrate processing apparatus configured to dry a substrate with a processing fluid in a supercritical state includes: a processing vessel; a substrate holder configured to hold the substrate horizontally within the processing vessel; a first supply line connected to a first fluid supply provided at the processing vessel and configured to supply the processing fluid into the processing vessel; a drain line connected to a drain unit provided at the processing vessel and configured to drain the processing fluid from the processing vessel; a bypass line branched off from the first supply line and connected to the drain line, the bypass line being configured to allow at least a part of the processing fluid flowing in the first supply line to be drained into the drain line without passing through the processing vessel; and a bypass opening/closing valve configured to open or close the bypass line.
    Type: Application
    Filed: October 22, 2021
    Publication date: April 28, 2022
    Inventors: Toru Ihara, Satoru Tanaka, Gentaro Goshi, Masami Yamashita, Reijiro Yamanaka, Hideaki Kumashiro
  • Publication number: 20210159095
    Abstract: A substrate processing apparatus performs increasing a pressure within a processing vessel up to a processing pressure higher than a threshold pressure of a processing fluid by supplying the processing fluid into the processing vessel in which a substrate having thereon a liquid is accommodated; and supplying the processing fluid into the processing vessel and draining the processing fluid while maintaining the pressure within the processing vessel at a level allowing the processing fluid to be maintained in a supercritical state. The increasing of the pressure includes: increasing the pressure to a first pressure; and increasing the pressure to the processing pressure from the first pressure. A temperature of the substrate is controlled to a first temperature in the increasing of the pressure to the first pressure, and is controlled to a second temperature higher than the first temperature in the increasing of the pressure to the processing pressure.
    Type: Application
    Filed: November 24, 2020
    Publication date: May 27, 2021
    Inventors: Toru Ihara, Gentaro Goshi, Masami Yamashita
  • Patent number: 10998183
    Abstract: A method for cleaning a substrate includes setting a substrate inside a cleaning chamber, supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film, vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate, and supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: May 4, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Miyako Kaneko, Takehiko Orii, Satoru Shimura, Masami Yamashita, Itaru Kanno
  • Patent number: 10867814
    Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: December 15, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
  • Patent number: 10792711
    Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 6, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
  • Patent number: 10272478
    Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: April 30, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
  • Publication number: 20190118227
    Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 25, 2019
    Applicant: Tokyo Electron Limited
    Inventors: Meitoku AIBARA, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
  • Patent number: 10256163
    Abstract: Embodiments of the invention provide a method for treating a microelectronic substrate with dilute TMAH. In the method, a microelectronic substrate is received into a process chamber, the microelectronic substrate having a layer, feature or structure of silicon. A treatment solution is applied to the microelectronic substrate to etch the silicon, where the treatment solution includes a dilution solution and TMAH. A controlled oxygen content is provided in the treatment solution or in an environment in the process chamber to achieve a target etch selectivity of the silicon, or a target etch uniformity across the layer, feature or structure of silicon, or both by the treatment solution.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: April 9, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Wallace P. Printz, Shuhei Takahashi, Naoyuki Okamura, Masami Yamashita, Derek W. Bassett, Antonio Luis Pacheco Rotondaro
  • Publication number: 20180240684
    Abstract: A gas discharge hole 74 (205) configured to discharge a gas is provided at a position outside an edge of a substrate W held by a substrate holding unit 89 (204) within a processing chamber 81 (201). The gas discharged from the gas discharge hole 74 (205) forms a flow of the gas flowing in a direction along a first surface (front surface) of the substrate held by the substrate holding unit. A gas of a sublimation substance which is sublimated and a foreign substance included in the gas are flown along the flow of the gas to be removed from a vicinity of the substrate. The gas serves as a heat transfer medium for heat transfer from a heating unit 88 (203) to the substrate.
    Type: Application
    Filed: September 29, 2016
    Publication date: August 23, 2018
    Inventors: Koji Egashira, Masami Yamashita, Yoshiyuki Honda, Yuki Yoshida, Yosuke Kawabuchi
  • Patent number: 9818598
    Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: November 14, 2017
    Assignees: Tokyo Electron Limited, JSR Corporation
    Inventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
  • Publication number: 20170236729
    Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.
    Type: Application
    Filed: February 14, 2017
    Publication date: August 17, 2017
    Inventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
  • Patent number: 9700105
    Abstract: A surface fastener which includes a hook surface fastener (A) and a loop surface fastener (B), or a mixed surface fastener (C). The hook surface fastener (A) has hook fastener elements made of monofilaments on a surface of a base fabric. The loop surface fastener (B) has loop fastener elements made of multifilaments and capable of engaging with the hook fastener elements on a surface of a base fabric. The mixed surface fastener (C) has hook fastener elements made of monofilaments and loop fastener elements made of multifilaments on the same surface of a base fabric. The monofilaments are made from a polyethylene terephthalate-based polyester resin, and the multifilaments are made of a polybutylene terephthalate-based polyester resin.
    Type: Grant
    Filed: September 3, 2012
    Date of Patent: July 11, 2017
    Assignee: KURARAY FASTENING CO., LTD.
    Inventors: Takayoshi Kaikou, Masami Yamashita
  • Publication number: 20170141005
    Abstract: Embodiments of the invention provide a method for treating a microelectronic substrate with dilute TMAH. In the method, a microelectronic substrate is received into a process chamber, the microelectronic substrate having a layer, feature or structure of silicon. A treatment solution is applied to the microelectronic substrate to etch the silicon, where the treatment solution includes a dilution solution and TMAH. A controlled oxygen content is provided in the treatment solution or in an environment in the process chamber to achieve a target etch selectivity of the silicon, or a target etch uniformity across the layer, feature or structure of silicon, or both by the treatment solution.
    Type: Application
    Filed: November 14, 2016
    Publication date: May 18, 2017
    Inventors: Wallace P. Printz, Shuhei Takahashi, Naoyuki Okamura, Masami Yamashita, Derek W. Bassett, Antonio Luis Pacheco Rotondaro
  • Patent number: 9629421
    Abstract: A double-sided engagement type fabric surface fastener, which includes a base fabric, hook-like engagement elements that exist on the top surface of the base fabric, and loop-like engagement elements that exist on the bottom surface of the base fabric, where a ground warp yarn and a ground weft yarn constituting the base fabric, the hook-like engagement elements, and the loop-like engagement elements are all yarns made of polyester resin, the ground weft yarn contains core-sheath type thermal adhesive polyester fibers, and the hook-like engagement elements and the loop-like engagement elements are both fixed to the base fabric by the thermal adhesive fibers constituting the base fabric.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: April 25, 2017
    Assignee: Kuraray Fastening Co., Ltd.
    Inventors: Takayoshi Kaikou, Masami Yamashita, Kazuya Maeda
  • Publication number: 20160163534
    Abstract: A method for cleaning a substrate includes setting a substrate inside a cleaning chamber, supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film, vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate, and supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.
    Type: Application
    Filed: February 11, 2016
    Publication date: June 9, 2016
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Miyako KANEKO, Takehiko Orii, Satoru Shimura, Masami Yamashita, Itaru Kanno
  • Publication number: 20160035564
    Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.
    Type: Application
    Filed: July 27, 2015
    Publication date: February 4, 2016
    Inventors: Meitoku AIBARA, Yuki YOSHIDA, Hisashi KAWANO, Masami YAMASHITA, Itaru KANNO, Kenji MOCHIDA, Motoyuki SHIMA
  • Publication number: 20160035561
    Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.
    Type: Application
    Filed: July 27, 2015
    Publication date: February 4, 2016
    Inventors: Meitoku AIBARA, Yuki YOSHIDA, Hisashi KAWANO, Masami YAMASHITA, Itaru KANNO, Kenji MOCHIDA, Motoyuki SHIMA