Abstract: Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.

Abstract: A chip mounting apparatus is provided with a base, a support member securely held on the base, a tray detachably mounted in the support member and provided with a plurality of substantially square concaves each for accommodating one of the chips, and an oscillating device for oscillating the tray. The concaves of the tray are regularly spaced from one another by a plurality of partition walls formed on the tray. The support member is capable of inclining the tray so that one corner of each concave may become lower than any other corners. In such a chip mounting apparatus, the chips are rearranged in order in the same corners of respective concaves upon oscillation of the tray.

Abstract: In a chip mounting apparatus, a plurality of chips bonded on an adhesive expand tape are mounted one by one onto a package or a printed board. The apparatus is provided with a vacuum pickup member movable in any desired direction for picking up each chip by drawing the vacuum through a suction port formed in it, a plurality of push members movable up and down for pushing up the chip from a lower surface of the tape towards the vacuum pickup member, a tape driving portion for drawing the tape downwards from a peripheral portion of the chip, and an optical sensor for detecting whether or not the tape has been separated from the peripheral portion of the chip in a state in which the chip is being pushed upwards by the push members. The push members are so controlled as to move downwards by virtue of a signal outputted from the optical sensor. The optical sensor may be replaced by a load detecting monitor for detecting a load exerting upon the push rods or tension of the tape.

Abstract: A process of die-bonding a semiconductor chip. The semiconductor chip is sucked by a collet and fixed on a preform which is formed on a die pad. A load is applied to the chip and a gas is blown around the semiconductor chip. so as to flatten any of the preform that has gone beyond the interface between the chip and die pad. The entire assembly is heated thereby curing the preform. In a preferred embodiment the semiconductor chip is sucked with the collet via a vacuum pump and an inert gas is blown around the semiconductor chip.

Abstract: A method of measuring a semiconductor pressure sensor comprises the steps of mounting a wafer formed with diaphragm type semiconductor pressure sensors on a wafer stage, evacuating air existing between the back surface side of said diaphragm type semiconductor pressure sensors and said wafer stage through at least one hole provided in said wafer stage to deform diaphragms of said semiconductor pressure sensors, and measuring the pressure sensitivity of each of said semiconductor pressure sensors from the surface side of said semiconductor pressure sensors.

Abstract: A catheter type sensor, which is inserted into a living body in order to directly measure within the living body biological data such as blood pressure, has at least one base in its distal end or intermediate portion, at least one sensor element supported on the base to detect biological data, and lead wires for electrically connecting together the sensor element and an external measuring device. The base, the sensor element and the lead wires are buried in a resin material which has excellent compatibility with living bodies and which is shaped in the form of a catheter. Accordingly, the whole of the cross-sectional area of the sensor can be utilized as a space for mounting the assembly constituted by the base, the sensor element and the lead wires.

Abstract: A method of adjusting a bridge circuit of a semiconductor pressure sensor comprises the steps of providing conductive lines connected to at least one of diffused resistors at predetermined intervals during the wiring process, the diffused resistors being provided to connect strain gauge resistors constituting the bridge circuit; adjusting the resistance value of at least the one of the diffused resistors; making vacuum suction to the back surface of a diaphragm of the semiconductor pressure sensor in the testing process to make a state wherein pressure is virtually applied to the diaphragm from the surface side thereof; measuring the pressure sensitivity of the semiconductor pressure sensor from the surface side of the diaphragm by making use of the bridge circuit; and adjusting the resistance value of at least the one of the diffused resistors based on the pressure sensitivity thus measured to adjust the balance of the bridge circuit.