Abstract: A backlight apparatus comprises a light source that is composed of a combination of a blue light emitting device, a green light emitting phosphor, and a red light emitting phosphor. The blue light emitting device has a peak intensity of a light emitting spectrum 3 to 19 times as high as the green light emitting phosphor.

Abstract: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.

Abstract: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.

Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.

Abstract: A control apparatus for a continuously variable transmission includes a clamping force increase portion. The continuously variable transmission includes a pair of a primary pulley and a secondary pulley on which a transmission belt is wound. A shift of the continuously variable transmission is performed by changing effective diameters of the primary pulley and the secondary pulley. The clamping force increase portion increases a belt clamping force when it is determined that a torque capacity is decreased by determining that drive power input to the primary pulley is decreased by an amount equal to or larger than a predetermined amount while the secondary pulley is in a stopped state or a substantially stopped state, as compared to when it is determined that the torque capacity is not decreased.

Abstract: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.

Abstract: An LED lamp according to the present invention includes: at least one LED chip 12 that is mounted on a substrate 11; a phosphor resin portion 13 that covers the LED chip 12; a lens 22 to act on the outgoing light of the phosphor resin portion 13; and an optical diffusion layer (light-transmissive resin portion 20), which is arranged between the phosphor resin portion 13 and the lens 22 and in which particles to scatter the light are dispersed.

Abstract: An LED lamp includes at least one LED chip mounted on the principal surface of a substrate and an optical wavelength converting portion, which includes a phosphor for converting the emission of the LED chip into light having a longer wavelength than that of the emission and which covers at least a portion of the LED chip. The side surface of the optical wavelength converting portion has at least one concave curved surface portion.

Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED lamp according to the present invention includes: at least one LED chip 12 that is mounted on a substrate 11; a phosphor resin portion 13 that covers the LED chip 12; a lens 22 to act on the outgoing light of the phosphor resin portion 13; and an optical diffusion layer (light-transmissive resin portion 20), which is arranged between the phosphor resin portion 13 and the lens 22 and in which particles to scatter the light are dispersed.

Abstract: A socket fixed to a heat sink holds a card-type LED module formed by integrating LED elements. The socket (6) includes: a frame structure for holding the LED module (1000) with its light source unit exposed through the frame opening; and a pressing member positioned around the opening for pressing the back surface of the LED module against the heat sink (2122). The socket may include a structure including a lower member (61) placed on a heat sink and an upper frame member (62) holding the LED module with its light source unit (1002) exposed through the frame opening. The upper member supported by the lower member via a hinge can open/close, and includes a pressing unit pressing the LED module set in the open state, against the lower member (61). The lower member (61) includes, in its main part, a lock unit (63) directly or indirectly lock the upper member (62) when the upper member is closed.

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract: In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.

Abstract: A luminescent light source includes: a light-emitting element (1); a substrate (2) including a conductor pattern (4); and a phosphor layer material (3) containing a phosphor and a light-transmitting base material. In the luminescent light source, the light-emitting element (1) is connected to a conductor pattern (4b), and the phosphor layer material (3) covers the light-emitting element (1). Further, at least the light-transmitting base material in the phosphor layer material (3) is disposed between the light-emitting element (1) and the substrate (2). Thus, a luminescent light source can be provided that allows a gap between a light-emitting element such as a LED bare chip or the like and a substrate to be eliminated, thereby obtaining output light with even chromaticity and achieving high luminous efficiency.

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The optical reflector is provided on the surface of the substrate on which the LED bare chips are mounted. A resin encapsulates the entire optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.