Abstract: A quantum dot includes a core including Zn and Se, and a shell composed of ZnS and provided on a surface of the core, adjacently to the core. The quantum dot-emits blue light, is Cd free, and has a particle diameter within a range from 3 nm to 20 nm and a fluorescence lifetime in a thin film state of 50 ns or less.

Abstract: A method of manufacturing a semiconductor device includes accommodating a substrate in a process chamber; supplying a first gas containing oxygen into the process chamber; generating plasma in the process chamber by exciting the first gas; supplying a second gas containing hydrogen into the process chamber and adjusting a hydrogen concentration distribution in the process chamber according to a density distribution of the plasma in the process chamber; and processing the substrate with oxidizing species generated by the plasma.

Abstract: The present disclosure includes: a magnetic member configured to cause a large Barkhausen effect; a power generation coil disposed so as to be wound around the magnetic member; and soft magnetic members formed at both end portions of the magnetic member so as to be in contact with the magnetic member and so as to press the magnetic member. Consequently, evenness of a magnetic flux density inside the magnetic member is increased, and the large Barkhausen effect is stably caused, whereby a highly stable power generation element is obtained.

Abstract: There is provided an insertion/extraction mechanism for having one or multiple block members being inserted into or extracted from a frame member forming an intermediate connection member that is disposed between a first member having multiple first members and a second member having multiple second terminals and electrically connects the first terminals and the second terminals, the block member having multiple connection terminals for electrically connecting the first terminals and the second terminals. The insertion/extraction mechanism comprises a first engaging unit and a second engaging unit that are engaged with a first engaged portion and a second engaged portion of the block member, respectively, thereby holding the block member.

Abstract: The present disclosure is provided with a probe card and a transfer stage for transferring an inspection target toward the probe card. The transfer stage is provided with a chuck top on which the inspection target is mounted, an aligner configured to be contacted to or separated from the chuck top, and an aligning mechanism for aligning the chuck top with the aligner. The aligning mechanism has radially-expandable positioning pins at a plurality of positions on the upper surface of the aligner, and pin insertion members at positions on the lower surface of the chuck top corresponding to the positioning pins, the pin insertion members having pin insertion holes of which diameters are larger than those of the positioning pins that are not radially expanded. The chuck top is aligned with the aligner by inserting the positioning pins into the pin insertion holes and radially expanding the positioning pins.

Abstract: An inspection device includes a chuck top that holds a wafer, a probe card disposed to face the wafer held by the chuck top and having a plurality of contact probes on a surface facing the wafer, a pogo frame that holds the probe card, a bellows that surrounds the probe card and the contact probes and forms a sealed space when the wafer is close to or in contact with the contact probes, a gas exhaust path configured to depressurize the pressure in the sealed space, and a mechanical stopper that is provided between the pogo frame and the chuck top and restricts the vertical inclination of the chuck top when a predetermined contact is made between the wafer and the contact probes.

Abstract: An inspection device has an attachment part for attaching a probe card in an inspection operation but attaching a diagnosis substrate in a self-diagnosis operation. During the inspection operation, a tester of the inspection device applies electrical signals to devices formed on a substrate through the probe card and multiple connectors of a connection member to inspect electrical characteristics of the devices During the self-diagnosis operation, a diagnosis substrate is attached to the attachment part of the inspection device instead of the probe card and a stabilization process is performed for stabilizing a contact between the diagnosis substrate and the connectors of the connection member after the diagnosis substrate is attached. The diagnosis of the multiple connectors is performed after the stabilization process.

Abstract: Disclosed is a user interface 52 including an operation screen on which prescribed information of an apparatus is displayed and which is used for predetermined operation, and an operation section which performs an operation of the operation screen. The operation screen includes a maintenance mode for performing maintenance for the apparatus. In the maintenance mode, a maintenance screen 101 corresponding to the predetermined maintenance item among a plurality of maintenance items of which maintenance operations are stored in the storage unit 53 is displayed on the operation screen. In the maintenance screen 101, the contents of maintenance of the relevant maintenance item is displayed as the screen 101 for each procedure based on the information of the storage unit 53. In each screen 101 for each procedure, an image 106 illustrating the description 105 of the procedure and the maintenance location is displayed.

Abstract: An acoustic wave device includes: a support substrate; a single piezoelectric substrate that is located on the support substrate and is single-crystal; first electrodes located on a first surface of the piezoelectric substrate; second electrodes located on a second surface of the piezoelectric substrate; and an acoustic mirror that is bonded on the support substrate, is located between the support substrate and the first electrodes in resonance regions where the first electrodes and the second electrodes face each other across at least a part of the piezoelectric substrate, is not located between the support substrate and the first electrodes in at least a part of a region between the resonance regions, and reflects an acoustic wave propagating through the piezoelectric substrate.

Abstract: There is provided an insertion/extraction mechanism for having one or multiple block members being inserted into or extracted from a frame member forming an intermediate connection member that is disposed between a first member having multiple first members and a second member having multiple second terminals and electrically connects the first terminals and the second terminals, the block member having multiple connection terminals for electrically connecting the first terminals and the second terminals. The insertion/extraction mechanism comprises a first engaging unit and a second engaging unit that are engaged with a first engaged portion and a second engaged portion of the block member, respectively, thereby holding the block member.

Abstract: The present disclosure is provided with a probe card and a transfer stage for transferring an inspection target toward the probe card. The transfer stage is provided with a chuck top on which the inspection target is mounted, an aligner configured to be contacted to or separated from the chuck top, and an aligning mechanism for aligning the chuck top with the aligner. The aligning mechanism has radially-expandable positioning pins at a plurality of positions on the upper surface of the aligner, and pin insertion members at positions on the lower surface of the chuck top corresponding to the positioning pins, the pin insertion members having pin insertion holes of which diameters are larger than those of the positioning pins that are not radially expanded. The chuck top is aligned with the aligner by inserting the positioning pins into the pin insertion holes and radially expanding the positioning pins.

Abstract: An inspection device includes a chuck top that holds a wafer, a probe card disposed to face the wafer held by the chuck top and having a plurality of contact probes on a surface facing the wafer, a pogo frame that holds the probe card, a bellows that surrounds the probe card and the contact probes and forms a sealed space when the wafer is close to or in contact with the contact probes, a gas exhaust path configured to depressurize the pressure in the sealed space, and a mechanical stopper that is provided between the pogo frame and the chuck top and restricts the vertical inclination of the chuck top when a predetermined contact is made between the wafer and the contact probes.

Abstract: An inspection device includes a stage for mounting thereon a substrate, an attachment part to which a probe card that brings probes into contact with devices formed on the substrate is attached, a tester for applying electrical signals to the devices through the probe card to inspect electrical characteristics of the devices, and a connection member having multiple connectors to electrically connect the multiple connectors with the tester and the probe card while being disposed between the tester and the probe card. A diagnostic method for the inspection device performing a self-diagnosis of the multiple connectors includes attaching a diagnosis substrate instead of the probe card, performing a stabilization process for stabilizing a contact between the diagnosis substrate and the connectors of the connection member after the diagnosis substrate is attached, and diagnosing the connectors after the stabilization process.

Abstract: An acoustic wave device includes: a support substrate; a single piezoelectric substrate that is located on the support substrate and is single-crystal; first electrodes located on a first surface of the piezoelectric substrate; second electrodes located on a second surface of the piezoelectric substrate; and an acoustic mirror that is bonded on the support substrate, is located between the support substrate and the first electrodes in resonance regions where the first electrodes and the second electrodes face each other across at least a part of the piezoelectric substrate, is not located between the support substrate and the first electrodes in at least a part of a region between the resonance regions, and reflects an acoustic wave propagating through the piezoelectric substrate.

Abstract: Disclosed is a user interface 52 including an operation screen on which prescribed information of an apparatus is displayed and which is used for predetermined operation, and an operation section which performs an operation of the operation screen. The operation screen includes a maintenance mode for performing maintenance for the apparatus. In the maintenance mode, a maintenance screen 101 corresponding to the predetermined maintenance item among a plurality of maintenance items of which maintenance operations are stored in the storage unit 53 is displayed on the operation screen. In the maintenance screen 101, the contents of maintenance of the relevant maintenance item is displayed as the screen 101 for each procedure based on the information of the storage unit 53. In each screen 101 for each procedure, an image 106 illustrating the description 105 of the procedure and the maintenance location is displayed.

Abstract: In a filter, two parallel resonators that are adjacent to each other are connected, in parallel, to a first portion of the signal line that connects a pair of two adjacent series resonators, at least one parallel resonator is connected, in parallel, to a second portion of the signal line that connects a different pair of two adjacent series resonators, a first inductor is connected to one parallel resonator of said two parallel resonators in series, a second inductor is connected to one parallel resonator of said at least one parallel resonator in series, a third inductor is connected to said two parallel resonators and said at least one parallel resonator, the first and third inductors' total inductance is different from the second and third inductor's total inductance.

Abstract: A piezoelectric thin film resonator includes a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode, and an upper electrode provided on the piezoelectric film. At least a portion of the upper electrode and that of the lower electrode oppose each other through the piezoelectric film, and at least a portion of the periphery of the upper electrode is reversely tapered.

Abstract: The filter includes: a primary transducer connected to a primary terminal; a secondary transducer connected to a plurality of secondary terminals; and a coupling transducer for mechanically coupling the primary transducer and the secondary transducer.

Abstract: An acoustic wave device includes: a substrate; a lower electrode formed on the substrate; at least two piezoelectric films formed on the lower electrode; an insulating film located between the at least two piezoelectric films; and an upper electrode formed on the at least two piezoelectric films, wherein an outer periphery of an uppermost piezoelectric film out of the at least two piezoelectric films in a region in which the lower electrode and the upper electrode face each other is positioned further in than an outer periphery of the upper electrode.

Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode located to sandwich the piezoelectric film; a load film formed from patterns in a resonance region in which the lower electrode and the upper electrode face each other across the piezoelectric film, wherein the patterns are formed so as to surround a center of the resonance region and intersect with a pathway extending from the center to an outer periphery of the resonance region.