Abstract: A method for manufacturing an acoustic wave device includes: bonding a piezoelectric substrate to a first surface of a first support substrate; thinning the piezoelectric substrate after the bonding to thus form a piezoelectric layer; forming a first electrode on a first surface of the piezoelectric layer; forming holes in the first support substrate located below the first electrode; and bonding a second support substrate to a second surface of the first support substrate opposite to the first surface after the forming of holes.

Abstract: A filter includes a plurality of primary resonators connected to a serial arm, a plurality of secondary resonators connected to a parallel arm, a primary inductor connected to at least one of the plurality of primary resonators and a secondary inductor connected to at least one of the plurality of secondary resonators. The primary inductor is arranged so as not to be connected to a path between the secondary resonator to which the secondary inductor is connected in parallel and the primary resonator that is connected to the secondary resonator to which the secondary inductor is connected in parallel.

Abstract: An electronic circuit includes a plurality of duplexers that are coupled to an antenna terminal and have a pass band different from each other and a plurality of acoustic wave filters that are respectively coupled between the antenna terminal and the plurality of the duplexers, wherein filter characteristics of a first acoustic wave filter of the plurality of the acoustic wave filters are set so as to allow passage of a signal in both a pass band for transmitting and a pass band for receiving of a first duplexer of the plurality of the duplexers that is coupled to the first acoustic wave filter and suppress passage of a signal in both a pass band for transmitting and a pass band for receiving of a second duplexer of the plurality of the duplexers that is different from the first duplexer.

Abstract: A piezoelectric thin-film resonator includes: a lower electrode provided on a substrate; a piezoelectric film that is provided on the lower electrode and includes at least two layers; an upper electrode that is provided on the piezoelectric film and has a region sandwiching the piezoelectric film with the lower electrode and facing the lower electrode; and an insulating film that is provided in a region in which the lower electrode and the upper electrode face each other and between each of the at least two layers, wherein an upper face of the insulating film is flatter than a lower face of the insulating film.

Abstract: An acoustic wave device includes a main resonator and a sub resonator each having a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode, and an upper electrode provided on an upper side of the piezoelectric film. A frequency control film is provided on an upper side of a resonance area in which the upper electrode and the lower electrode face each other in at least one of the main resonator and the sub resonator. The frequency control film has multiple convex patterns, and the convex patterns are arranged with a common pitch for spurious adjustment and with different areas in the main resonator and the sub resonator.

Abstract: A ladder type filter includes series resonators S1˜S4 connected in series between an input terminal In and an output terminal Out, parallel resonators P1˜P3 connected in parallel between the input terminal In and the output terminal Out, a resonator RP connected in series with the series resonators S1˜S4 between the input terminal and the output terminal, the resonator RP having a resonance frequency lower than resonance frequencies of the series resonators S1˜S4, and an inductor Lp connected in parallel with the resonator. According to the present ladder filter, signals having frequencies away from the pass band can be suppressed by an attenuation pole formed by the inductor. It is further possible to suppress the insertion loss in the pass band by the resonator.

Abstract: A method of manufacturing an elastic wave device is provided with a lamination step of forming, on a substrate (1), a plurality of elastic wave devices, each of which includes a lower electrode (2), a piezoelectric film (3), and an upper electrode (4); a measuring step for measuring the operation frequency distribution of the elastic wave devices on the substrate (1); and an adjusting step for forming an adjusting region, in which the thickness of the elastic wave device is different from the thicknesses of other portions in a resonance portion of each elastic wave device, corresponding with the distribution of the operation frequencies. The adjusting region is formed so that the size of the area of the adjusting region of the resonator portion of each elastic wave device is different in accordance with the operation frequency distribution that is measured. Thus, the frequency characteristics of the elastic wave devices are easily adjusted by a small number of steps.

Abstract: The filter includes one or more series resonators and one or more parallel resonators. An inductance is connected in series to at least a parallel resonator of the parallel resonators, and a antiresonance frequency of the parallel resonator to which the inductance is connected in series is equal to or higher than that of the series resonators. The duplexer, the communication module and the communication device are provided with the filter.

Abstract: A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode located to sandwich the piezoelectric film; a load film formed from patterns in a resonance region in which the lower electrode and the upper electrode face each other across the piezoelectric film, wherein the patterns are formed so as to surround a center of the resonance region and intersect with a pathway extending from the center to an outer periphery of the resonance region.

Abstract: A method of manufacturing a ladder filter including first and second resonators includes: forming a piezoelectric film on an entire surface of a substrate that has respective lower electrodes of the first and second resonator formed thereon, an conductive film on the piezoelectric film, and a second film on the conductive film; forming a pattern of the second film in a prescribed region in the second area; forming a first film on an entire surface of the substrate; etching the first film, forming a pattern of the first film, the second film and the conductive film in the second area, and forming a pattern of the first film and the conductive film in the first area, to form respective upper electrodes from the conductor film; and thereafter, etching the piezoelectric film to form respective patterns of the piezoelectric film in the first and second areas, respectively.

Abstract: An acoustic wave device includes piezoelectric thin-film resonators, each of which includes: a substrate; a piezoelectric thin-film on the substrate; an lower electrode provided on a first surface of the piezoelectric film; an upper electrode provided on a second surface of the piezoelectric film opposite to the first surface; and a first addition film that is provided in a resonance portion in which the lower electrode and the upper electrode face each other through the piezoelectric film and is located between the piezoelectric thin-film and the upper electrode, the first addition film having a shape different from that of the resonance portion.

Abstract: An acoustic wave device includes a substrate and a plurality of piezoelectric thin film resonators formed over the substrate. Each of the plurality of the piezoelectric thin film resonators includes lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode, and an upper electrode provided on the piezoelectric film and opposed to the lower electrode through the piezoelectric film. Each of the piezoelectric thin film resonators is partly supported by the substrate and extends above the substrate to form a cavity between the substrate and each lower electrodes. The cavity continuously extending under the plurality of the piezoelectric thin film resonators.

Abstract: According to an aspect of the invention, each of a filter, a duplexer and a communication module includes a plurality of series resonators connected to a signal line in series and a plurality of parallel resonators connected to the signal line in parallel. At least two of the plurality of parallel resonators are connected to the signal line between two of the plurality of series resonators in parallel, inductors are respectively connected to the at least two parallel resonators, and the inductors have different inductances from each other.

Abstract: A piezoelectric thin film resonator of the present has a substrate 1, an intermediate layer 7 disposed on the substrate 1 and is formed of an insulator, a lower electrode 3 disposed on the intermediate layer 7, a piezoelectric film 4 disposed on the lower electrode 3, and an upper electrode 5 disposed on a position facing the lower electrode 3 with the piezoelectric film 4 interposed therebetween, in which, in a resonant region 8 where the lower electrode 3 and the upper electrode 5 face each other, a space 6 is formed in the substrate 1 and the intermediate layer 7 or between the lower electrode 3 and the intermediate layer 7 and the region of the space 6 is included in the resonant region 8. With the structure, the dissipation of the vibrational energy to the substrate from the resonance portion can be suppressed, thereby improving the quality factor.

Abstract: According to an aspect of the invention, each of a filter, a duplexer and a communication module includes a plurality of series resonators connected to a signal line in series and a plurality of parallel resonators connected to the signal line in parallel. At least two of the plurality of parallel resonators are connected to the signal line between two of the plurality of series resonators in parallel, inductors are respectively connected to the at least two parallel resonators, and the inductors have different inductances from each other.

Abstract: A plasma CVD apparatus comprising a vacuum chamber, and a main roll and a plasma generation electrode in the vacuum chamber, wherein a thin film is formed on a surface of a long substrate which is conveyed along the surface of the main roll is provided. At least one side wall extending in transverse direction of the long substrate is provided on each of the upstream and downstream sides in the machine direction of the long substrate, and the side walls surrounds the film deposition space between the main roll and the plasma generation electrode. The side walls are electrically insulated from the plasma generation electrode. The side wall on either the upstream or the downstream side in the machine direction of the long substrate is provided with at least one raw of gas supply holes formed by gas supply holes aligned in the transverse direction of the long substrate.

Abstract: The invention aims to provide a magnetron electrode for plasma treatment that is free of significant abnormal electrical discharge and able to perform electrical discharge with long-term stability. A second electrode is provided only at a position outside the inner side surface of the outer magnetic pole of a first electrode or at a position where the magnetic flux density is low.

Abstract: A filter includes at least one series resonator and parallel resonators, the at least one series resonator and the parallel resonators including excitation electrodes and reflectors, the parallel resonators having different resonance frequencies, and at least one of the parallel resonators other than the parallel resonator having the highest resonance frequency being configured to have a pitch of reflectors that is smaller than that of excitation electrodes.

Abstract: A piezoelectric thin-film resonator includes a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode and an upper electrode that is located opposite the lower electrode across at least a part of the piezoelectric film. A mass load film is provided on the upper electrode. The mass load film includes a plurality of concave or convex patterns in at least a region that faces the lower electrode. The plurality of concave or convex patterns are densely arranged in a central portion of the region and are sparsely arranged in a peripheral portion of the region.

Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.