Abstract: A metal resin composite molded body wherein various metal bases and a resin molded body are integrally and firmly bonded with each other; and a versatile method for producing this metal resin composite molded body. Particularly provided are: a metal resin composite molded body wherein an aluminum base and a polyolefin resin molded body are integrally and firmly bonded with each other; and a simple method for producing this metal resin composite molded body. A metal resin composite molded body which is characterized by comprising a metal base, a polypropylene resin layer and a thermoplastic resin molded body, and which is also characterized in that: the polypropylene resin layer is bonded to the metal base with a hydrophilic surface being interposed therebetween, said hydrophilic surface being formed on the metal base; and the thermoplastic resin molded body is bonded to the polypropylene resin layer by means of anchoring effect and compatibilizing effect with the polypropylene resin layer.

Abstract: An information processing device includes a processor configured to: determine, by using an anomaly detection model, whether an anomaly has occurred in a first system; when determination is made that the anomaly has occurred in the first system, presume whether the anomaly is influenced by a failure in an external system connected to the first system; and when presumption is made that the determined anomaly is influenced by the failure in the external system, update the anomaly detection model to reduce influence of the failure in the external system.

Abstract: An electrode composite material in the present disclosure includes a silicon clathrate particle and an amorphous silicon particle, and satisfies the following relational expression: 0 atom %<the number of silicon atoms in the amorphous silicon particle/(the number of silicon atoms in the amorphous silicon particle+the number of silicon atoms in the silicon clathrate particle)<50 atom %. A lithium-ion battery in the present disclosure includes an electrode active material layer, and the electrode active material layer contains the electrode composite material in the present disclosure. Further, a production method for a lithium-ion battery in the present disclosure includes forming an electrode active material layer, and the electrode active material layer contains the electrode composite material in the present disclosure.

Abstract: An electrode active material particle in the present disclosure includes a silicon clathrate portion and an amorphous silicon portion, and satisfies the following relational expression: 0 atom %<the number of silicon atoms in the amorphous silicon portion/(the number of silicon atoms in the amorphous silicon portion+the number of silicon atoms in the silicon clathrate portion)<50 atom %. An electrode composite material in the present disclosure includes the electrode active material particle in the present disclosure. Further, a lithium-ion battery in the present disclosure includes an electrode active material layer, and the electrode active material layer contains the electrode composite material in the present disclosure.

Abstract: Silicon-clathrate electrode active material particles of this disclosure meet the following relational expression: 0<surface oxygen ratio (wt %)/specific surface area (m2/g)<0.3. An electrode composite material of this disclosure includes the electrode active material particles of this disclosure. Further, a lithium-ion battery of this disclosure has an electrode active material layer, and the electrode active material layer contains the electrode composite material of this disclosure.

Abstract: A liquid crystal element is provided that can inhibit occurrence of voltage drop between one end and the other end of each electrode. A liquid crystal element (100) includes a liquid crystal layer LQ, a plurality of first arcuate electrodes (1), and a plurality of second arcuate electrodes (2). The first arcuate electrodes (1) are disposed concentrically about an optical axis (AX) of the liquid crystal element (100) and applies first voltage (V1) to the liquid crystal layer (LQ). The second arcuate electrodes (2) are disposed concentrically about the optical axis (AX) and applies second voltage (V2) to the liquid crystal layer (LQ).

Abstract: Semiconductor device assemblies with support substrates and associated methods are disclosed herein. In one embodiment, a semiconductor device assembly includes a support substrate, a first semiconductor die embedded within the support substrate, a second semiconductor die coupled to the support substrate, and a third semiconductor die coupled to the support substrate. The assembly can also include a redistribution network formed on a first and/or second side of the support substrate, and a plurality of conductive contacts electrically coupled to at least one of the first, second or third semiconductor dies.

Abstract: The present invention provides an epoxy resin composition containing: a component (A): epoxy resin; a component (B): microcapsular curing agent; a component (C): reactive diluent; and a component (D): compound represented by formula (1) below: wherein X1 has 2 or more and 5 or less consecutive carbon-carbon bonds, and a substituent of carbon contained in X1 and R1 to R5 are each one selected from the group consisting of hydrogen, an alkyl group, an unsaturated aliphatic group, an aromatic group, a heteroatom-containing substituent, a halogen atom-containing substituent, and a halogen atom; the substituent of carbon contained in X1 and R1 to R5 are the same as or different from each other; and the compound is optionally a fused ring compound in which any of R1 to R5 are present in the same ring.

Abstract: Semiconductor device assemblies with molded support substrates and associated methods are disclosed herein. In one embodiment, a semiconductor device assembly includes a support substrate, a first semiconductor die embedded within the support substrate, a second semiconductor die coupled to the support substrate, and a third semiconductor die coupled to the support substrate. The assembly can also include a redistribution network formed on a first and/or second side of the support substrate, and a plurality of conductive contacts electrically coupled to at least one of the first, second or third semiconductor dies.

Abstract: An epoxy resin composition comprising an epoxy resin (A) and a latent curing agent (B), wherein the latent curing agent (B) is solid at 25° C.

Abstract: The ink jet recording method includes ejecting an aqueous ink from a recording head to apply the aqueous ink to a recording medium, to thereby record an image. The ink jet recording method includes: ejecting the aqueous ink heated to a temperature TH (° C.) from the recording head to apply the aqueous ink to the recording medium; and heating the recording medium having the aqueous ink applied thereto to a temperature TF (° C.), the aqueous ink containing a pigment and a polyester resin particle, a glass transition temperature TG (° C.) of the polyester resin particle, the temperature TH (° C.) and the temperature TF (° C.) satisfying relationships of the following expressions (1) to (3). TG(° C.)>TH(° C.)??(1) TF(° C.)?TH(° C.)+10° C.??(2) TF(° C.)?TG(° C.)?10° C.

Abstract: Provided is an aqueous ink that can record an image achieving both of high abrasion resistance and high color developability. The aqueous ink is an aqueous ink for ink jet including: a coloring material; and a resin particle. A resin for forming the resin particle includes a unit having an aromatic group, a unit having a cyano group, a unit derived from a (meth)acrylic acid ester having a branched alkyl group and a unit represented by the following general formula (1). In the following general formula (1), “n” represents the number of a repeating unit, R1 represents an alkyl group and E represents the number of repeating units of an ethylene oxide group and satisfies E?1.

Abstract: Provided is an aqueous ink for ink jet capable of recording an image that is excellent in abrasion resistance immediately after recording and glossiness. The aqueous ink for ink jet includes: a coloring material dispersed by an action of an anionic group, a resin particle and a wax particle dispersed by a dispersant. A resin for forming the resin particle includes a unit having a cyano group and a volume-based 50% cumulative particle diameter Dw of the wax particle is larger than a volume-based 50% cumulative particle diameter Dc of the coloring material and a volume-based 50% cumulative particle diameter Dr of the resin particle.

Abstract: The present invention provides an ink jet recording method capable of recording an image having good abrasion resistance by using an aqueous ink and a reaction liquid. In the ink jet recording method, the aqueous ink containing a resin particle and the reaction liquid containing a reactant for aggregating the component in the aqueous ink are ejected from a recording head of the ink jet system and applied onto a recording medium. The reaction liquid contains a compound represented by the general formula (1) (n in the formula represents an integer of 0 to 3). At least one of the aqueous ink and the reaction liquid contains a surfactant having an HLB value of ? 15.

Abstract: The ink jet recording method includes ejecting an aqueous ink from a recording head to apply the aqueous ink to a recording medium, to thereby record an image. The ink jet recording method includes: ejecting the aqueous ink heated to a temperature TH (° C.) from the recording head to apply the aqueous ink to the recording medium; and heating the recording medium having the aqueous ink applied thereto to a temperature TF (° C.), the aqueous ink containing a pigment and a polyester resin particle, a glass transition temperature TG (° C.) of the polyester resin particle, the temperature TH (° C.) and the temperature TF (° C.) satisfying relationships of the following expressions (1) to (3). TG(° C.)>TH(° C.) ??(1) TF(° C.)?TH(° C.)+10° C. ??(2) TF(° C.)?TG(° C.)?10° C.

Abstract: An object is to provide a magnetic sensor module that suppresses a size of a magnetic sensor chip while applying a uniform calibration magnetic field to a magneto-resistive element. Provided is a magnetic sensor module comprising an IC chip having a first coil; and a magnetic sensor chip that is disposed on a surface of the IC chip and includes a first magnetic sensor that detects magnetism in a direction of first axis, wherein a planar shape of the IC chip encompasses a planar shape of the magnetic sensor chip, and the first coil has a planar shape including three or more sides, and is, when seen in a cross section along at least one side of the planar shape, is formed so as to cover a region, in a direction of the one side, of the first magnetic sensor.

Abstract: Provided is a hydrodesulfurization catalyst for hydrocarbon oil, the catalyst comprising: an inorganic oxide carrier comprising Si, Ti and Al; and at least one metal component, carried on the inorganic oxide carrier, being selected from the group consisting of group 6 elements, group 8 elements, group 9 elements and group 10 elements, wherein the content of Al in the inorganic oxide carrier is 50% by mass or higher in terms of Al2O3; the content of Si therein is 1.0 to 10% by mass in terms of SiO2; and the content of Ti therein is 12 to 28% by mass in terms of TiO2; and in the inorganic oxide carrier, the absorption edge wavelength of an absorption peak from Ti is 364 nm or shorter as measured by ultraviolet spectroscopy.

Abstract: A magnetic sensor device includes a composite chip component, and a sensor chip mounted on the composite chip component. The sensor chip includes a first magnetic sensor, a second magnetic sensor, and a third magnetic sensor that detect components of an external magnetic field that are in directions parallel to an X direction, parallel to a Y direction, and parallel to a Z direction, respectively. The composite chip component includes a first magnetic field generator, a second magnetic field generator, and a third magnetic field generator for generating additional magnetic field components that are in directions parallel to the X direction, parallel to the Y direction, and parallel to the Z direction, respectively.

Abstract: Semiconductor device assemblies with molded support substrates and associated methods are disclosed herein. In one embodiment, a semiconductor device assembly includes a support substrate, a first semiconductor die embedded within the support substrate, a second semiconductor die coupled to the support substrate, and a third semiconductor die coupled to the support substrate. The assembly can also include a redistribution network formed on a first and/or second side of the support substrate, and a plurality of conductive contacts electrically coupled to at least one of the first, second or third semiconductor dies.

Abstract: An object of the present invention is to provide a novel medical application to regenerative medicine that uses pluripotent stem cells (Muse cells). The present invention provides a cell preparation for treating cerebral infarction and sequelae associated therewith that contains SSEA-3-positive pluripotent stem cells isolated from mesenchymal tissue in the body or cultured mesenchymal cells. The cell preparation of the present invention is based on a brain tissue regeneration mechanism by which Muse cells differentiate into nerve cells and the like in damaged brain tissue by administering Muse cells into cerebral parenchyma.