Patents by Inventor Masao Tomikawa

Masao Tomikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10793718
    Abstract: A resin composition including: (A) a polyimide resin containing 60 mol % or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: October 6, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Akira Shimada, Masao Tomikawa
  • Publication number: 20200192227
    Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 ?m after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.
    Type: Application
    Filed: February 25, 2020
    Publication date: June 18, 2020
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Kazuto MIYOSHI, Masao TOMIKAWA
  • Patent number: 10669377
    Abstract: The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: June 2, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Natsuko Chayama, Masao Tomikawa, Tomoyuki Yuba
  • Publication number: 20190345332
    Abstract: A resin composition including: (A) a polyimide resin containing 60 mol % or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness.
    Type: Application
    Filed: July 18, 2017
    Publication date: November 14, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Akira Shimada, Masao Tomikawa
  • Publication number: 20190080952
    Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.
    Type: Application
    Filed: November 12, 2018
    Publication date: March 14, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa
  • Patent number: 10177022
    Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: January 8, 2019
    Assignee: Toray Industries, Inc.
    Inventors: Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa
  • Patent number: 10026637
    Abstract: A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: July 17, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Masao Tomikawa, Takuo Watanabe, Chungseo Lee
  • Patent number: 9865879
    Abstract: The present invention is directed to a binder for a lithium ion battery electrode, comprising a polyimide precursor having a tetracarboxylic acid residue and a diamine residue and/or a polyimide, the polyimide precursor having a residue of a tetracarboxylic dianhydride selected from those represented by the following general formulas (1) and (2) as the tetracarboxylic acid residue, and a residue of a diamine selected from those represented by the following general formulas (3) and (4) as the diamine residue, the content of the acid residue being from 0.90 to 0.95 moles based on 1 mole of the diamine residue.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: January 9, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Masao Tomikawa, Tomoyuki Yuba, Natsuko Chayama
  • Patent number: 9850347
    Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), ? represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: December 26, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Masao Tomikawa
  • Publication number: 20170342214
    Abstract: The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.
    Type: Application
    Filed: October 2, 2015
    Publication date: November 30, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Natsuko CHAYAMA, Masao TOMIKAWA, Tomoyuki YUBA
  • Patent number: 9828469
    Abstract: The present invention provides a polyimide precursor that serves to produce a cured film that has high light permeability in combination with low birefringence and low linear thermal expansion. The polyimide precursor includes at least an acid dianhydride residue as represented by Formula (1), a diamine residue as represented by Formula (2), and one or more diamine residues as represented by Formula (3), the acid dianhydride residue as represented by Formula (1) accounting for 50 mol % or more of the total quantity of acid dianhydride residues in the polyimide precursor, the diamine residue as represented by Formula (2) accounting for 50 mol % or more of the total quantity of diamine residues in the polyimide precursor, and the diamine residue as represented by Formula (3) accounting for 15 mol % or less of the total quantity of diamine residues in the polyimide precursor.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: November 28, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Junji Wakita, Yukari Arimoto, Masao Tomikawa
  • Patent number: 9822281
    Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein ? represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: November 21, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Masao Tomikawa
  • Publication number: 20170299965
    Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 ?m after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.
    Type: Application
    Filed: October 1, 2015
    Publication date: October 19, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Kazuto MIYOSHI, Masao TOMIKAWA
  • Publication number: 20170221746
    Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.
    Type: Application
    Filed: August 5, 2015
    Publication date: August 3, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa
  • Publication number: 20160372357
    Abstract: A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.
    Type: Application
    Filed: February 24, 2015
    Publication date: December 22, 2016
    Inventors: Masao Tomikawa, Takuo Watanabe, Chungseo Lee
  • Publication number: 20160340547
    Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein ? represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
    Type: Application
    Filed: August 1, 2016
    Publication date: November 24, 2016
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Daichi MIYAZAKI, Masao TOMIKAWA
  • Patent number: 9493614
    Abstract: The present invention is based on a polyimide precursor having unit structures represented by general formula (1) and unit structures represented by general formula (2), provides a polyimide precursor for which film whitening, cracking and bubbling do not occur regardless of film baking conditions, and provides a flexible TFT array, a flexible color filter, and a flexible substrate with a gas barrier layer using the polyimide precursor, and a flexible display device, etc. using same. (In general formulas (1) and (2), X1-X4 each independently represents a hydrogen atom, C1 to C10 monovalent organic group or C1 to C10 monovalent alkylsilyl group. R1 is represented by general formula (3) and R2 is represented by general formula (4).) (In general formula (4), R3 and R4 each independently represents a C1 to C10 monovalent organic group.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: November 15, 2016
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Junji Wakita, Yukari Jo, Masao Tomikawa
  • Patent number: 9454078
    Abstract: The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: September 27, 2016
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Hiroyuki Onishi, Yuki Masuda, Masao Tomikawa
  • Publication number: 20160222165
    Abstract: The present invention provides a polyimide precursor that serves to produce a cured film that has high light permeability in combination with low birefringence and low linear thermal expansion. The polyimide precursor includes at least an acid dianhydride residue as represented by Formula (1), a diamine residue as represented by Formula (2), and one or more diamine residues as represented by Formula (3), the acid dianhydride residue as represented by Formula (1) accounting for 50 mol % or more of the total quantity of acid dianhydride residues in the polyimide precursor, the diamine residue as represented by Formula (2) accounting for 50 mol % or more of the total quantity of diamine residues in the polyimide precursor, and the diamine residue as represented by Formula (3) accounting for 15 mol % or less of the total quantity of diamine residues in the polyimide precursor.
    Type: Application
    Filed: September 18, 2014
    Publication date: August 4, 2016
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Junji Wakita, Yukari Arimoto, Masao Tomikawa
  • Publication number: 20160002407
    Abstract: The present invention is based on a polyimide precursor having unit structures represented by general formula (1) and unit structures represented by general formula (2), provides a polyimide precursor for which film whitening, cracking and bubbling do not occur regardless of film baking conditions, and provides a flexible TFT array, a flexible color filter, and a flexible substrate with a gas barrier layer using the polyimide precursor, and a flexible display device, etc. using same. (In general formulas (1) and (2), X1-X4 each independently represents a hydrogen atom, C1 to C10 monovalent organic group or C1 to C10 monovalent alkylsilyl group. R1 is represented by general formula (3) and R2 is represented by general formula (4).) (In general formula (4), R3 and R4 each independently represents a C1 to C10 monovalent organic group.
    Type: Application
    Filed: December 26, 2013
    Publication date: January 7, 2016
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Junji WAKITA, Yukari JO, Masao TOMIKAWA