Abstract: A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.

Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein ? represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract: The present invention is based on a polyimide precursor having unit structures represented by general formula (1) and unit structures represented by general formula (2), provides a polyimide precursor for which film whitening, cracking and bubbling do not occur regardless of film baking conditions, and provides a flexible TFT array, a flexible color filter, and a flexible substrate with a gas barrier layer using the polyimide precursor, and a flexible display device, etc. using same. (In general formulas (1) and (2), X1-X4 each independently represents a hydrogen atom, C1 to C10 monovalent organic group or C1 to C10 monovalent alkylsilyl group. R1 is represented by general formula (3) and R2 is represented by general formula (4).) (In general formula (4), R3 and R4 each independently represents a C1 to C10 monovalent organic group.

Abstract: The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower.

Abstract: The present invention provides a polyimide precursor that serves to produce a cured film that has high light permeability in combination with low birefringence and low linear thermal expansion. The polyimide precursor includes at least an acid dianhydride residue as represented by Formula (1), a diamine residue as represented by Formula (2), and one or more diamine residues as represented by Formula (3), the acid dianhydride residue as represented by Formula (1) accounting for 50 mol % or more of the total quantity of acid dianhydride residues in the polyimide precursor, the diamine residue as represented by Formula (2) accounting for 50 mol % or more of the total quantity of diamine residues in the polyimide precursor, and the diamine residue as represented by Formula (3) accounting for 15 mol % or less of the total quantity of diamine residues in the polyimide precursor.

Abstract: The present invention is based on a polyimide precursor having unit structures represented by general formula (1) and unit structures represented by general formula (2), provides a polyimide precursor for which film whitening, cracking and bubbling do not occur regardless of film baking conditions, and provides a flexible TFT array, a flexible color filter, and a flexible substrate with a gas barrier layer using the polyimide precursor, and a flexible display device, etc. using same. (In general formulas (1) and (2), X1-X4 each independently represents a hydrogen atom, C1 to C10 monovalent organic group or C1 to C10 monovalent alkylsilyl group. R1 is represented by general formula (3) and R2 is represented by general formula (4).) (In general formula (4), R3 and R4 each independently represents a C1 to C10 monovalent organic group.

Abstract: Disclosed is a method for producing polyamide, wherein a diimidazolide compound represented by the general formula (1) shown below is reacted with a diamine compound represented by the general formula (2) shown below. The present invention provides a method for producing a chlorine-free high molecular weight alkali-soluble polyamide by simple process.

Abstract: Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.

Abstract: Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200° C. or lower.

Abstract: The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower.

Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), ? represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

Abstract: The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), ? represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract: Disclosed is a resin composition for positive electrodes of lithium ion cells, which imparts strong adhesiveness and electrolyte injectability and shows good discharge and charge characteristics and input-output characteristics with smaller amount of a binder. The resin composition for positive electrodes of lithium ion cells is a resin composition for positive electrodes of lithium ion cells, which comprises a polyimide precursor whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. after being imidized is 3 to 50 ppm, and/or a polyimide whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. is 3 to 50 ppm, and a positive electrode active compound, wherein the positive electrode active compound is one obtained by coating the surface of a composite oxide containing lithium with a lithium ion conductive material.

Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.

Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.

Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.

Abstract: Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.

Abstract: The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A?, C, C? are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A?, or C, C?.

Abstract: The present invention is directed to a binder for a lithium ion battery electrode, comprising a polyimide precursor having a tetracarboxylic acid residue and a diamine residue and/or a polyimide, the polyimide precursor having a residue of a tetracarboxylic dianhydride selected from those represented by the following general formulas (1) and (2) as the tetracarboxylic acid residue, and a residue of a diamine selected from those represented by the following general formulas (3) and (4) as the diamine residue, the content of the acid residue being from 0.90 to 0.95 moles based on 1 mole of the diamine residue.

Abstract: A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6).