Abstract: A thermal flowmeter includes a plurality of measuring units for stabilizing air flowing in a sub-passage, and improves noise performance or a pulsation characteristic of a flow rate sensor. The thermal flowmeter includes a flange fixed to an attachment part of a main passage, a sub-passage takes in a part of measured gas flowing in the main passage, a flow rate measuring unit measures a flow rate of the measured gas in the sub-passage, a circuit component controls the flow rate measuring unit, and the flow rate measuring unit and an electronic component are mounted on a circuit substrate. The sub-passage is formed in a substrate of the circuit substrate, the sub-passage on a surface side of the circuit substrate and a second space on a rear surface side are separated by the circuit substrate, and a pressure measuring unit and the circuit component are arranged in the second space.

Abstract: Provided is a gateway device capable of reducing power consumption in a sleep state and relaying an activation signal between networks without delay. When receiving an activation signal, the gateway device according to the present invention transfers the activation signal to another network via a relay switch, and outputs a signal indicating the reception of the activation signal from a transceiver, thereby turning on a microcomputer.

Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode including a plurality of electrodes; a second electrode opposed to the first electrode; a photoelectric conversion layer including an organic material provided between the first electrode and the second electrode; a first semiconductor layer provided between the first electrode and the photoelectric conversion layer, and including an n-type semiconductor material; and a second semiconductor layer provided between the second electrode and the photoelectric conversion layer, and including at least one of a carbon-containing compound having an electron affinity larger than a work function of the first electrode or an inorganic compound having a work function larger than the work function of the first electrode.

Abstract: To provide a photoelectric conversion element that can improve image quality. Provided is a photoelectric conversion element (100) including at least a first electrode (101), a work function control layer (108), a photoelectric conversion layer (102), an oxide semiconductor layer (104), and a second electrode (107) in this order, and further including a third electrode (105), in which the third electrode (105) is provided apart from the second electrode (107) and is provided facing the photoelectric conversion layer (102) via an insulating layer (106), and the work function control layer (108) contains a larger amount of oxygen than an amount of oxygen satisfying a stoichiometric composition.

Abstract: A plasma processing apparatus includes a process container that forms a process space to accommodate a target substrate, and a first electrode and a second electrode disposed opposite each other inside the process container. The first electrode is an upper electrode and the second electrode is a lower electrode and configured to support the target substrate through a mount face. A correction ring is disposed to surround the target substrate placed on the mount face of the second electrode. The correction ring includes a combination of a first ring to be around the target substrate and a second ring arranged around or above the first ring. A power supply unit is configured to apply a first electric potential and a second electric potential respectively to the first ring and the second ring to generate a potential difference between the first and second rings. The power supply unit is configured to variably set the potential difference.

Abstract: In an imaging system, a differential signal transmission circuit is configured to output a first signal to a first signal line in an image output period and is configured to output a second signal to a second signal line in the image output period. The first signal and the second signal are included in a differential signal. A signal output circuit is configured to output a second clock signal to the first signal line in a blanking period different from the image output period and is configured to output a second control signal to the second signal line in the blanking period. In a PLL, connection between a charge pump and a loop filter is controlled on the basis of the second control signal output to the second signal line.

Abstract: A plasma processing method includes executing an etching process that includes supplying an etching gas into a process container in which a target substrate is supported on a second electrode serving as a lower electrode, and applying an RF power for plasma generation and an RF power for ion attraction to turn the etching gas into plasma and to subject the target substrate to etching. The etching process includes applying a negative DC voltage to a first electrode serving as an upper electrode during the etching to increase an absolute value of self-bias on the first electrode. The etching process includes releasing DC electron current generated by the negative DC voltage to ground through plasma and a conductive member disposed as a ring around the first electrode, by using a first state where the conductive member is connected to a ground potential portion.

Abstract: A plasma processing apparatus includes: an evacuable processing chamber including a dielectric window; a substrate supporting unit, provided in the processing chamber, for mounting thereon a target substrate; a processing gas supply unit for supplying a desired processing gas to the processing chamber to perform a plasma process on the target substrate; a first RF antenna, provided on the dielectric window, for generating a plasma by an inductive coupling in the processing chamber; and a first RF power supply unit for supplying an RF power to the first RF antenna. The first RF antenna includes a primary coil provided on or above the dielectric window and electrically connected to the first RF power supply unit; and a secondary coil provided such that the coils are coupled with each other by an electromagnetic induction therebetween while being arranged closer to a bottom surface of the dielectric window than the primary coil.

Abstract: A plasma processing apparatus includes a processing chamber including a dielectric window; a coil shaped RF antenna provided outside the dielectric window; a substrate supporting unit, provided in the processing chamber, for mounting thereon a target substrate to be processed; a processing gas supply unit for supplying a desired processing gas to the processing chamber to perform a desired plasma process on the target substrate; and an RF power supply unit for supplying an RF power to the RF antenna to generate a plasma of the processing gas by an inductive coupling in the processing chamber. The apparatus further includes a floating coil electrically floated and arranged at a position outside the processing chamber where the floating coil is to be coupled with the RF antenna by an electromagnetic induction; and a capacitor provided in a loop of the floating coil.

Abstract: Provided is a gateway device capable of reducing power consumption in a sleep state and relaying an activation signal between networks without delay. When receiving an activation signal, the gateway device according to the present invention transfers the activation signal to another network via a relay switch, and outputs a signal indicating the reception of the activation signal from a transceiver, thereby turning on a microcomputer.

Abstract: A plasma processing method includes executing an etching process that includes supplying an etching gas into a process container in which a target substrate is supported on a second electrode serving as a lower electrode, and applying an RF power for plasma generation and an RF power for ion attraction to turn the etching gas into plasma and to subject the target substrate to etching. The etching process includes applying a negative DC voltage to a first electrode serving as an upper electrode during the etching to increase an absolute value of self-bias on the first electrode. The etching process includes releasing DC electron current generated by the negative DC voltage to ground through plasma and a conductive member disposed as a ring around the first electrode, by using a first state where the conductive member is connected to a ground potential portion.

Abstract: According to the present disclosure, a photoelectric conversion film includes a plurality of semiconductor nanoparticles and a matrix phase provided around each of the plurality of semiconductor nanoparticles. The matrix phase includes a principal phase including a composite, which includes an organic molecule polymer and an inorganic material. A photoelectric conversion device includes a transparent electrically conductive film, a photoelectric conversion layer, a semiconductor substrate, and an electrode layer, which are layered on a glass substrate in this order. The photoelectric conversion layer includes the photoelectric conversion film.

Abstract: A plasma etching apparatus includes an upper electrode and a lower electrode, between which plasma of a process gas is generated to perform plasma etching on a wafer W. The apparatus further comprises a cooling ring disposed around the wafer, a correction ring disposed around the cooling ring, and a variable DC power supply directly connected to the correction ring, the DC voltage being preset to provide the correction ring with a negative bias, relative to ground potential, for attracting ions in the plasma and to increase temperature of the correction ring to compensate for a decrease in temperature of a space near the edge of the target substrate due to the cooling ring.

Abstract: An imaging element includes: a pixel chip where a pixel unit and a vertical selecting unit are arranged, the pixel unit including plural pixels that are arranged in a two-dimensional matrix, the pixels being configured to generate and output imaging signals; a transmission chip where at least a power source unit and a transmission unit are arranged; plural capacitative chips, each capacitative chip having capacitance functioning as a bypass condenser for a power source in the power source unit; and plural connecting portions configured to electrically connect the pixel chip, the transmission chip, and the capacitative chip respectively to another chip. The transmission chip is layered and connected at a back surface side of the pixel chip. The capacitative chips are layered and connected at a back surface side of the transmission chip. The connecting portions are arranged so as to overlap one another.

Abstract: An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency, and a second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber to generate plasma of the process gas so as to perform plasma etching.

Abstract: A fixing device has a fixing member, a cleaning roller, and a web, a first drive mechanism, a rotation drive unit, and a control unit. The first drive mechanism moves the cleaning roller to abut on or separate from the fixing member. The rotation drive unit can rotatingly drive the cleaning roller when the cleaning roller separates from the fixing member. The control unit performs control such that, in a case where a cleaning mode for cleaning the cleaning roller using the web is selected, the cleaning roller moves to separate from the fixing member and is rotatingly driven, and the web abuts on the cleaning roller, in order to clean the cleaning roller.

Abstract: An imaging device includes: a first chip including a light receiving unit, and a read circuit; a second chip including a timing control circuit, an A/D conversion circuit, and a cable transmission circuit; and a connection unit configured to connect the first and the second chips. The read circuit includes a column read circuit and a horizontal selection circuit, and a vertical selection circuit. The connection unit of the first chip is provided in a first area along a side of the rectangular light receiving unit, and in a second area adjacent to the column read circuit, the horizontal selection circuit, and the vertical selection circuit. The connection unit of the second chip is provided in a third area around the timing control circuit, the A/D conversion circuit, and the cable transmission circuit and in a fourth area adjacent to the timing control circuit and the A/D conversion circuit.

Abstract: A fixing device has a fixing member, a cleaning roller, and a web, a first drive mechanism, a rotation drive unit, and a control unit. The first drive mechanism moves the cleaning roller to abut on or separate from the fixing member. The rotation drive unit can rotatingly drive the cleaning roller when the cleaning roller separates from the fixing member. The control unit performs control such that, in a case where a cleaning mode for cleaning the cleaning roller using the web is selected, the cleaning roller moves to separate from the fixing member and is rotatingly driven, and the web abuts on the cleaning roller, in order to clean the cleaning roller.

Abstract: An imaging element includes: a pixel chip where a pixel unit and a vertical selecting unit are arranged, the pixel unit including plural pixels that are arranged in a two-dimensional matrix, the pixels being configured to generate and output imaging signals; a transmission chip where at least a power source unit and a transmission unit are arranged; plural capacitative chips, each capacitative chip having capacitance functioning as a bypass condenser for a power source in the power source unit; and plural connecting portions configured to electrically connect the pixel chip, the transmission chip, and the capacitative chip respectively to another chip. The transmission chip is layered and connected at a back surface side of the pixel chip. The capacitative chips are layered and connected at a back surface side of the transmission chip. The connecting portions are arranged so as to overlap one another.

Abstract: The present invention provides an in-vehicle device control method and an in-vehicle control device capable of suppressing radiation noise occurring at the time of simultaneously driving a plurality of loads to activate a plurality of in-vehicle devices, respectively, without providing a noise suppression component newly. In a motor drive controller 25 that controls driving of two motors 27a and 27b for retractors to activate two retractors 26a and 26b for seat belts, respectively, when the two motors for the retractors are simultaneously driven, a phase difference ? is provided for two drive frequency waveforms 40a and 40b corresponding to the two motors.