Patents by Inventor Masashi Saito
Masashi Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20120204904Abstract: A cleaning substrate that can prevent a decrease in the operating rate of a substrate processing apparatus. The cleaning substrate that cleans the interior of a chamber in the substrate processing apparatus has a removal mechanism that removes foreign matter in the chamber.Type: ApplicationFiled: April 24, 2012Publication date: August 16, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Yohei YAMAZAWA, Hiroshi NAGAIKE, Masashi SAITO, Masanobu HONDA
-
Patent number: 8233389Abstract: In a vehicle ad-hoc network (VANET), a transceiver node is arranged in a vehicle. The node includes a protocol stack, which includes an application layer, a link layer; and a congestion control layer arranged between the application layer and the link layer. The congestion layer transfers short messages between the application layer and the link layer. The short messages are defined according to a standard for the VANET, and the congestion layer optimizes a network-wide rate allocation for the short messages.Type: GrantFiled: August 19, 2009Date of Patent: July 31, 2012Assignee: Mitsubishi Electric Research Laboratories, Inc.Inventors: Raymond Yim, Fei Ye, Masashi Saito, Philip V. Orlik
-
Publication number: 20120175500Abstract: A solid state image pickup device may include a pixel unit that includes a photoelectric conversion element, the pixel unit including a plurality of pixels that are arranged in a form of a two-dimensional matrix in the pixel unit, each of the plurality of pixels outputting a reset signal and a pixel signal, an analog signal processing unit that includes a first capacitor and a second capacitor, a delay circuit that includes a plurality of delay elements that are connected in a ring form, an A/D converter that detects the number of stages in which the pulse signal has propagated through the delay elements in the delay circuit during a sampling time period and generates a digital signal based on the detected number of stages, and a switching circuit that switches a connection of the first capacitor.Type: ApplicationFiled: January 11, 2012Publication date: July 12, 2012Applicant: OLYMPUS CORPORATIONInventor: Masashi Saito
-
Publication number: 20120145324Abstract: An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency is connected to the upper electrode. A second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber while any one of application voltage, application current, and application power from the variable DC power supply to the upper electrode is controlled, to generate plasma of the process gas so as to perform plasma etching.Type: ApplicationFiled: February 14, 2012Publication date: June 14, 2012Inventors: Akira Koshiishi, Masaru Sugimoto, Kunihiko Hinata, Noriyuki Kobayashi, Chishio Koshimizu, Ryuji Ohtani, Kazuo Kibi, Masashi Saito, Naoki Matsumoto, Manabu Iwata, Daisuke Yano, Yohei Yamazawa
-
Patent number: 8194183Abstract: Provided is an imaging device which simplifies an assembling adjustment so as to reduce the manufacturing time and cost, wherein second lens L2 driven by actuator 30 is brought into contact with first lens L1 and third lens L3 so that a hyper-focal position or an infinite position as a reference focal position, and close-up position are accurately positioned, that is, it is possible to perform assembling without adjustment and effectively reduce the number of manufacturing steps.Type: GrantFiled: July 14, 2008Date of Patent: June 5, 2012Assignee: Konica Minolta Opto, Inc.Inventor: Masashi Saito
-
Patent number: 8194323Abstract: There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive.Type: GrantFiled: April 8, 2009Date of Patent: June 5, 2012Assignee: Konica Minolta Opto, Inc.Inventors: Naoko Okazaki, Shigeru Hosoe, Masashi Saito
-
Patent number: 8174374Abstract: A road surface includes lane marking that store digital information. Images of the road surface and lane markings are acquired by a camera. The digital information is decoded from the images, analyzed so that a feedback signal can be generated according to the decoded digital information.Type: GrantFiled: June 30, 2009Date of Patent: May 8, 2012Assignee: Mitsubishi Electric Research Laboratories, Inc.Inventors: Raymond Yim, Masashi Saito, Fatih M. Porikli, Jinyun Zhang
-
Patent number: 8137471Abstract: An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency is connected to the upper electrode. A second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber while any one of application voltage, application current, and application power from the variable DC power supply to the upper electrode is controlled, to generate plasma of the process gas so as to perform plasma etching.Type: GrantFiled: January 29, 2010Date of Patent: March 20, 2012Assignee: Tokyo Electron LimitedInventors: Akira Koshiishi, Masaru Sugimoto, Kunihiko Hinata, Noriyuki Kobayashi, Chishio Koshimizu, Ryuji Ohtani, Kazuo Kibi, Masashi Saito, Naoki Matsumoto, Manabu Iwata, Daisuke Yano, Yohei Yamazawa
-
Patent number: 8131428Abstract: A control module for seat belt retractor capable of controlling a winding torque of a seat belt within a predetermined range, and such a seat belt retractor are provided. The seat belt retractor includes a spool 300 around which a seat belt for vehicle is wound, a motor 200 that causes the spool 300 to rotate, and a motor power transmission mechanism unit that couples the motor 200 and the spool 300. A microcomputer 400 uses a preset control parameter value to control a motor current that flows through the motor 200. The microcomputer 400 changes, based on the motor current and an output torque value of the spool, the control parameter value. The control parameter value is an apparent torque constant for each seat belt retractor product.Type: GrantFiled: October 31, 2008Date of Patent: March 6, 2012Assignees: Hitachi Automotive Systems, Ltd., Takata Corp.Inventors: Masashi Saito, Hiroshi Ito
-
Publication number: 20110303362Abstract: There is provided a plasma processing apparatus for performing a plasma process on a substrate mounted on a mounting table in a processing chamber by generating inductively coupled plasma within the processing chamber by applying a high frequency power to a high frequency antenna. The apparatus includes a multiple number of gas nozzles protruding from a sidewall of the processing chamber toward a center of the processing chamber in a space above the mounting table, and each gas nozzle has a gas discharge hole at a leading end of the gas nozzle in a protruding direction and a gas discharge hole at a sidewall of the gas nozzle. Further, the apparatus includes a rotation device configured to rotate each of the gas nozzles on each central axis of the gas nozzles and each central axis is extended in the protruding direction of each of the gas nozzles.Type: ApplicationFiled: June 14, 2011Publication date: December 15, 2011Applicant: TOKYO ELECTRON LIMITEDInventor: Masashi SAITO
-
Publication number: 20110272097Abstract: A plasma etching apparatus includes an upper electrode and a lower electrode, between which plasma of a process gas is generated to perform plasma etching on a wafer W. The apparatus further comprises a cooling ring disposed around the wafer, a correction ring disposed around the cooling ring, and a variable DC power supply directly connected to the correction ring, the DC voltage being preset to provide the correction ring with a negative bias, relative to ground potential, for attracting ions in the plasma and to increase temperature of the correction ring to compensate for a decrease in temperature of a space near the edge of the target substrate due to the cooling ring.Type: ApplicationFiled: July 19, 2011Publication date: November 10, 2011Inventors: Akira Koshiishi, Masaru Sugimoto, Kunihiko Hinata, Noriyuki Kobayashi, Chishio Koshimizu, Ryuji Ohtani, Kazuo Kibi, Masashi Saito, Naoki Matsumoto, Yoshinobu Ooya, Manabu Iwata, Daisuke Yano, Yohei Yamazawa, Hidetoshi Hanaoka, Toshihiro Hayami, Hiroki Yamazaki, Manabu Sato
-
Publication number: 20110214815Abstract: An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency, and a second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber to generate plasma of the process gas so as to perform plasma etching.Type: ApplicationFiled: May 23, 2011Publication date: September 8, 2011Inventors: Akira Koshiishi, Masaru Sugimoto, Kunihiko Hinata, Noriyuki Kobayashi, Chishio Koshimizu, Ryuji Ohtani, Kazuo Kibi, Masashi Saito, Naoki Matsumoto, Manabu Iwata, Daisuke Yano, Yohei Yamazawa, Hidetoshi Hanaoka, Toshihiro Hayami, Hiroki Yamazaki, Manabu Sato
-
Publication number: 20110208073Abstract: The disclosed is an arteriosclerosis evaluating apparatus capable of easily separating pulse wave data detected at one measurement site into an incident wave and a reflected wave and capable of easily determining and evaluating the degree of arteriosclerosis. The pulse wave transmitted through an artery is detected at one site of a living body by a pulse wave detection device, and the detected pulse wave is fitted with a fitting function by a breakdown device so that the detected pulse wave can be broken down into an incident wave and a reflected wave. The degree of arteriosclerosis is evaluated from the amplitude intensities (i.e., peak intensities) of the incident wave and the reflected wave broken down from the pulse wave.Type: ApplicationFiled: February 28, 2011Publication date: August 25, 2011Applicants: THE DOSHISHA, MURATA MANUFACTURING CO., LTD.Inventors: Mami MATSUKAWA, Yoshiaki WATANABE, Masashi SAITO, Takaaki ASADA, Mio FURUYA
-
Publication number: 20110204531Abstract: Provided is a method of manufacturing a wafer lens in which the surface configuration of the lens section can be transferred with high precision. The method possesses a step of preparing a molding die having plural molding surfaces corresponding to an optical surface configuration of the optical member; a filling step of filling the photo-curable resin in between the surface of the substrate and the molding surface of the molding die; a photo-curing step of exposing the photo-curable resin to light to accelerate curing; a heating step of conducting a heat treatment for the photo-curable resin having been cured in the photo-curing step; and a releasing step of releasing the molding die from the photo-curable resin after conducting the heating step, and further comprises a step of conducting a post-cure treatment for the optical member.Type: ApplicationFiled: April 24, 2009Publication date: August 25, 2011Inventors: Akiko Hara, Masashi Saito, Toshiyuki Imai
-
Publication number: 20110194003Abstract: An image processing device comprising: first A/D converters that receive output signals of respective columns of a plurality of pixels arranged in a matrix form, convert the output signals into first digital signals, and output the first digital signals; a second A/D converter that receives a correction signal, converts the correction signal into a second digital signal, and outputs the second digital signal; a first correction calculation unit that produces a first correction formula; a second correction calculation unit that produces a second correction formula based on the second digital signal; a determination unit that compares a coefficient of the second correction formula and a coefficient of a second correction formula produced before the second correction formula, and determines whether or not to produce the first correction formula based on the comparison result; and a signal output unit that outputs an update signal when it is determined to produce the first correction formula.Type: ApplicationFiled: February 2, 2011Publication date: August 11, 2011Applicant: OLYMPUS CORPORATIONInventor: Masashi Saito
-
Patent number: 7988816Abstract: A plasma etching apparatus includes an upper electrode and a lower electrode, between which plasma of a process gas is generated to perform plasma etching on a wafer W. The apparatus further comprises a cooling ring disposed around the wafer, a correction ring disposed around the cooling ring, and a variable DC power supply directly connected to the correction ring, the DC voltage being preset to provide the correction ring with a negative bias, relative to ground potential, for attracting ions in the plasma and to increase temperature of the correction ring to compensate for a decrease in temperature of a space near the edge of the target substrate due to the cooling ring.Type: GrantFiled: June 21, 2005Date of Patent: August 2, 2011Assignee: Tokyo Electron LimitedInventors: Akira Koshiishi, Masaru Sugimoto, Kunihiko Hinata, Noriyuki Kobayashi, Chishio Koshimizu, Ryuji Ohtani, Kazuo Kibi, Masashi Saito, Naoki Matsumoto, Yoshinobu Ooya, Manabu Iwata, Daisuke Yano, Yohei Yamazawa, Hidetoshi Hanaoka, Toshihiro Hayami, Hiroki Yamazaki, Manabu Sato
-
Patent number: 7985706Abstract: Provided are: a uniformly, highly dispersed metal catalyst including a catalyst carrier and a catalyst metal being loaded thereon dispersed throughout the carrier, the uniformly, highly dispersed metal catalyst having excellent performances with respect to catalytic activity, selectivity, life, etc.; and a method of producing the same. The uniformly, highly dispersed metal catalyst includes a catalyst carrier made of a metal oxide and a catalyst metal having catalytic activity, the catalyst metal being loaded on the catalyst carrier, in which the catalyst carrier is a sulfur-containing catalyst carrier having sulfur or a sulfur compound almost evenly distributed throughout the carrier and the catalyst metal is loaded on the sulfur-containing catalyst carrier in a substantially evenly dispersed manner over the entire carrier substantially according to the distribution of the sulfur or the sulfur compound.Type: GrantFiled: June 19, 2006Date of Patent: July 26, 2011Assignee: Chiyoda CorporationInventors: Yoshimi Okada, Toshiji Makabe, Masashi Saito, Takako Nishijima
-
Publication number: 20110128066Abstract: If a power supply is provided to a circuit necessary to control a switch for switching a path after wakeup, or if a buckle switch is switched while a microcomputer is asleep, an electrical current necessary for reliable operation of the buckle switch cannot be supplied during sleep, so that the buckle switch will not operate normally. This creates the possibility that wakeup cannot be performed. To permit the electrical current necessary for reliable operation of the buckle switch to be secured if the buckle switch is switched while the microcomputer is asleep, an FET capable of being kept ON or OFF by a power supply acting during sleep, a resistor connected with the FET, and a resistor of large resistance for blocking excessive dark current if the buckle switch is connected are arranged in parallel. The combined resistance of the parallel combination of these elements is used as a pull-up resistance at the input of a control unit.Type: ApplicationFiled: November 23, 2010Publication date: June 2, 2011Inventors: Hiroto NAGOSHI, Masashi Saito
-
Patent number: 7951262Abstract: An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency, and a second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber to generate plasma of the process gas so as to perform plasma etching.Type: GrantFiled: June 21, 2005Date of Patent: May 31, 2011Assignee: Tokyo Electron LimitedInventors: Akira Koshiishi, Masaru Sugimoto, Kunihiko Hinata, Noriyuki Kobayashi, Chishio Koshimizu, Ryuji Ohtani, Kazuo Kibi, Masashi Saito, Naoki Matsumoto, Manabu Iwata, Daisuke Yano, Yohei Yamazawa, Hidetoshi Hanaoka, Toshihiro Hayami, Hiroki Yamazaki, Manabu Sato
-
Publication number: 20110104902Abstract: A plasma processing apparatus includes a processing chamber including a dielectric window; a coil shaped RF antenna provided outside the dielectric window; a substrate supporting unit, provided in the processing chamber, for mounting thereon a target substrate to be processed; a processing gas supply unit for supplying a desired processing gas to the processing chamber to perform a desired plasma process on the target substrate; and an RF power supply unit for supplying an RF power to the RF antenna to generate a plasma of the processing gas by an inductive coupling in the processing chamber. The apparatus further includes a floating coil electrically floated and arranged at a position outside the processing chamber where the floating coil is to be coupled with the RF antenna by an electromagnetic induction; and a capacitor provided in a loop of the floating coil.Type: ApplicationFiled: October 27, 2010Publication date: May 5, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Yohei Yamazawa, Chishio Koshimizu, Kazuki Denpoh, Jun Yamawaku, Masashi Saito