Patents by Inventor Masato Nakamura

Masato Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040095422
    Abstract: A print head for a line printer in which errors between print head chips and another component are reduced and ink leakage is prevented, and in which heat generated in print head chips is efficiently dissipated without making the structure of the print head complex or increasing the size of the print head. A plurality of print head chips (11) are arranged along an ink path (20) and are disposed on both sides of the ink path in a zigzag pattern. Dummy chips (21) which do not eject ink are disposed at regions between the print head chips (11) arranged along the ink path (20). In addition, an ink-path member (23) is provided, at least a part of the ink-path member (23) which includes portions adhered to the print head chips (11) being composed of a material having a high thermal conductivity, so that the ink-path member (23) also serves as heat-dissipating means which dissipates heat generated in the print head chips (11).
    Type: Application
    Filed: August 15, 2003
    Publication date: May 20, 2004
    Inventors: Takeo Eguchi, Masayuki Takakura, Masato Nakamura, Shinichi Horii, Hiroyasu Uchida, Akihito Miyazaki
  • Patent number: 6724545
    Abstract: Provided in the present invention are an image pickup lens and a design method thereof which can achieve miniaturization of the system and capable of remarkably improving the optical characteristic with a simple structure. By forming a second face on the image pickup surface side of a lens body into a Fresnel face and unifying a diffraction element with at least a first face on the object face side or the second face on the image pickup surface side of the lens body, it becomes possible to correct the Petzval sum and reduce the curvature of the field so that an excellent image plane can be obtained. Also, due to the color dispersion characteristic of the diffraction element, chromatic aberration can be well corrected. Thereby, the optical characteristic of the image pickup lens can be remarkably improved.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: April 20, 2004
    Assignee: Enplas Corporation
    Inventors: Masato Nakamura, Takayuki Arai, Isamu Kaneko
  • Publication number: 20040057549
    Abstract: An object of the present invention is to provide a method of operating a nuclear reactor, which is capable of effectively suppressing the initiation and growth of SCC of reactor structural members of a BWR without increasing the dose rate of a main steam system and thereby reducing radioactivity of reactor water, by carrying out, at a suitable period, a control for injecting hydrogen in the reactor water while adjusting the pH of the reactor water on the alkali side.
    Type: Application
    Filed: August 7, 2003
    Publication date: March 25, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Yooichi Wada, Shunsuke Uchida, Atsushi Watanabe, Hideya Anzai, Masanori Sakai, Kazuhiko Akamine, Michiyoshi Yamamoto, Masato Nakamura
  • Publication number: 20040042965
    Abstract: It relates to a heat-generating composition having such dispersion stability that withstands continuous molding, and has excellent drainage property, excellent heat-generating characteristics, excellent molding property and excellent shape retaining property, without becoming viscous, and relates to a heat-generating body using the same and a process for producing the heat-generating body.
    Type: Application
    Filed: June 19, 2003
    Publication date: March 4, 2004
    Inventors: Kaoru Usui, Michio Aida, Yoshikazu Sakamaki, Masato Nakamura, Hisao Kimura, Toshihiro Dodo
  • Publication number: 20030186072
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.
    Type: Application
    Filed: March 25, 2003
    Publication date: October 2, 2003
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
  • Patent number: 6606368
    Abstract: In a nuclear power plant, by injecting an amount of hydrogen small enough not to increase a radiation dose rate of the main steam system, ECP of metallic component materials composing a nuclear reactor can be decreased to suppress the potential of occurrence of IGSCC, and the control can be easily performed, and the operating cost can be suppressed to increase. Occurrence of intergranular stress corrosion cracking in metallic component materials in contact with reactor cooling water is suppressed by injecting zirconium hydroxide and hydrogen into the reactor cooling water to decrease the electrochemical corrosion potential of the metallic component materials.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: August 12, 2003
    Assignees: Hitachi, Ltd., The Tokyo Electric Power Company, Incorporated
    Inventors: Yoshiyuki Takamori, Masanori Sakai, Yamato Asakura, Masato Nakamura, Hideyuki Hosokawa, Nagao Suzuki, Kouji Hayashi
  • Publication number: 20030117709
    Abstract: Provided in the present invention are an image pickup lens and a design method thereof which can achieve miniaturization of the system and capable of remarkably improving the optical characteristic with a simple structure. By forming a second face on the image pickup surface side of a lens body into a Fresnel face and unifying a diffraction element with at least a first face on the object face side or the second face on the image pickup surface side of the lens body, it becomes possible to correct the Petzval sum and reduce the curvature of the field so that an excellent image plane can be obtained. Also, due to the color dispersion characteristic of the diffraction element, chromatic aberration can be well corrected. Thereby, the optical characteristic of the image pickup lens can be remarkably improved.
    Type: Application
    Filed: September 12, 2002
    Publication date: June 26, 2003
    Applicant: Enplas Corporation
    Inventors: Masato Nakamura, Takayuki Arai, Isamu Kaneko
  • Publication number: 20030104867
    Abstract: There comprises reading out a video game soft program from a video game program recording medium body (60) having a video game soft program recorded including a video game soft program (60A), privilege information (60B) corresponding to a game stage of a video game progressed in accordance with a video game program, and a printing control program (60C) capable of printing privilege information corresponding to a cleared game stage when the game stage is cleared; progressing a video game in accordance with the video game soft program; and converting privilege information corresponding to a cleared game stage in accordance with the printing control program when the game stage of the video game is cleared to print it.
    Type: Application
    Filed: February 12, 2002
    Publication date: June 5, 2003
    Inventors: Yoichi Kobayashi, Masato Nakamura, Hiroshi Udagawa, Satoru Ueda, Kobei Nojiri, Naoki Takizawa
  • Publication number: 20030085325
    Abstract: A multi-function electronic appliance 1 includes an appliance body 2, an operation display unit 3, rollers 14 and spring pieces 20. The appliance body 2 is provided with a plurality of upright walls 10c. In the upright wall 10c, a guide groove 16 is formed. A through-hole 17 is opened in the guide groove 16. The operation display unit 3 is moves between the position where it covers the front face of the appliance body 2 and the position where it partially opens at least a part of the front face. The roller 14 is provided so as to be rotatable at the upper end of the operation display unit 3 and engaged with the guide groove 16. The spring piece 20 includes an attaching segment 21 attached to the appliance body 21 and an elastic deforming segment 22. The elastic deforming segment 22 advances into the guide groove 16 through the through-hole 17 and urges the roller 14 toward the front face when the operation display unit 3 covers the front face.
    Type: Application
    Filed: October 17, 2002
    Publication date: May 8, 2003
    Applicant: PIONEER CORPORATION
    Inventors: Kiyofumi Sugimoto, Masato Nakamura, Katsuomi Saito
  • Patent number: 6555052
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: April 29, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
  • Patent number: 6487265
    Abstract: Surfaces of the structural components of a nuclear power plant exposed to reactor water are wetted with an electroless plating solution containing an electrical insulating substance. The electrical insulating substance has a high resistivity about 105 (100000) times those of the structural components of the nuclear power plant or above. A metal film containing the electrical insulating substance is formed on the surfaces of the structural components exposed to the reactor water by wetting the surfaces of the structural components with the electroless plating solution. Thus, the electrochemical corrosion potential of the structural components is reduced regardless of whether hydrogen is injected into the reactor water.
    Type: Grant
    Filed: July 6, 2000
    Date of Patent: November 26, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Masato Nakamura, Yamato Asakura, Yoshiyuki Takamori, Kazuhiko Akamine, Katsumi Ohsumi, Masanori Sakai, Yoichi Wada
  • Publication number: 20020136344
    Abstract: Surfaces of the structural components of a nuclear power plant exposed to reactor water are wetted with an electroless plating solution containing an electrical insulating substance. The electrical insulating substance has a high resistivity about 105 (100000) times those of the structural components of the nuclear power plant or above. A metal film containing the electrical insulating substance is formed on the surfaces of the structural components exposed to the reactor water by wetting the surfaces of the structural components with the electroless plating solution. Thus, the electrochemical corrosion potential of the structural components is reduced regardless of whether hydrogen is injected into the reactor water.
    Type: Application
    Filed: April 29, 2002
    Publication date: September 26, 2002
    Applicant: Hitachi, LTD.
    Inventors: Masato Nakamura, Yamato Asakura, Yoshiyuki Takamori, Kazuhiko Akamine, Katsumi Ohsumi, Masanori Sakai, Yoichi Wada
  • Publication number: 20020082089
    Abstract: In progressing a video gate in accordance with a game software program read out from a video game program recording medium and in converting the contents for printing into printing data, which is printed, the printer driver stored in a non-volatile memory is to be updated to enable the printing by the latest printer driver. To this end, as a printer driver is read from the video game program recording medium at step S11, the version of the printer driver as read out is checked at step S12. If the printer driver as read out is of a new version, the printer driver in the memory card is updated at step S13.
    Type: Application
    Filed: June 26, 2001
    Publication date: June 27, 2002
    Inventors: Yoichi Kobayashi, Kohei Nojiri, Hiroshi Udagawa, Masato Nakamura, Koichiro Ishigami, Haruo Asano
  • Publication number: 20020073002
    Abstract: A printer performs a printing operation by driving a cartridge to discharge ink. The ink in the printer is billed according to the amount of actual use of ink. In a service center, the head ID is first input. Then, the head ID is verified against the user ID. The amount of the use of ink is checked. Then, the billing amount for the actual use of ink is determined. The user is requested to pay for the cost.
    Type: Application
    Filed: July 18, 2001
    Publication date: June 13, 2002
    Inventors: Shinichi Horii, Shigeyoshi Hirashima, Hiroshi Tokunaga, Masato Nakamura
  • Publication number: 20020066583
    Abstract: An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.
    Type: Application
    Filed: March 7, 2001
    Publication date: June 6, 2002
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita, Toshiharu Ishida, Masahide Okamoto, Koji Serizawa, Toshihiro Hachiya, Hideki Mukuno
  • Patent number: 6383238
    Abstract: The abrasive particle layer of resin bonded abrasive tool is constructed by resin binder phase consisting of heat hardening resin, for example, phenol resin etc. and super abrasive particle of diamond (or CBN etc.) distributed in this resin binder phase. The wear resistant filler consisting of SiC, for example, as hard filler and hollow glass and metal coated amorphous carbon is distributed in resin binder phase. The amorphous carbon is made to spherical shape and metal coating layer consisting of Cu, for example, as the metal having high thermal conductivity, is set on a surface of this amorphous carbon.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: May 7, 2002
    Assignee: Mitsubishi Materials Corporation
    Inventors: Tsutomu Takahashi, Toshiyuki Takano, Masato Nakamura
  • Publication number: 20020021778
    Abstract: In a nuclear power plant, by injecting an amount of hydrogen small enough not to increase a radiation dose rate of the main steam system, ECP of metallic component materials composing a nuclear reactor can be decreased to suppress the potential of occurrence of IGSCC, and the control can be easily performed, and the operating cost can be suppressed to increase. Occurrence of intergranular stress corrosion cracking in metallic component materials in contact with reactor cooling water is suppressed by injecting zirconium hydroxide and hydrogen into the reactor cooling water to decrease the electrochemical corrosion potential of the metallic component materials.
    Type: Application
    Filed: April 23, 2001
    Publication date: February 21, 2002
    Inventors: Yoshiyuki Takamori, Masanori Sakai, Yamato Asakura, Masato Nakamura, Hideyuki Hosokawa, Nagao Suzuki, Kouji Hayashi
  • Publication number: 20020016841
    Abstract: A connection apparatus is disclosed which includes a connection source and a connection destination. The connection source includes information about a predetermined connection destination; and a connecting element for making a connection request to the predetermined connection destination based on the information about the connection destination and, given a permission, for automatically connecting to the connection destination. The predetermined connection destination includes a receiving element for receiving the connection request from the connection source, a judging element which, upon interpreting the connection request, judges whether the connection source is a predetermined connection source or not, and a permission granting element which, if the judging element judges the connection source to be a predetermined connection source, then grants connection permission to the connection source.
    Type: Application
    Filed: June 27, 2001
    Publication date: February 7, 2002
    Inventors: Shigeyoshi Hirashima, Shinichi Horii, Hiroshi Tokunaga, Masato Nakamura
  • Patent number: 6118671
    Abstract: Ceramic circuit substrate which is sintered at 900 to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850 to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: September 12, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Hirayoshi Tanei, Shoichi Iwanaga, Masahide Okamoto, Masato Nakamura, Kousaku Morita, Shousaku Ishihara, Fumikazu Tagami, Norio Sengoku, Tsuyoshi Fujita, Fumiyuki Kobayashi
  • Patent number: 6018356
    Abstract: An autochanger which can continuously operate a video printing apparatus without having recourse to intervention by an operator which includes a paper feed tray for containing a plurality of recording media and/or an ink ribbon cartridge are loaded in the video printer device to selectively change them as the occasion demands, a magazine which can contain a plurality of paper feed trays and/or ink ribbon cartridges and a conveyance means of paper feed tray and/or ink ribbon cartridge for conveying the paper feed tray and/or the ink ribbon cartridge between the video printer device and the magazine. Therefore, the paper feed tray and the ink ribbon cartridge of the video printer device can be changed by the conveyance means as the occasion demands, so as to realize an autochanger which can continuously operate a video printer device without having recourse to intervention by an operator.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: January 25, 2000
    Assignee: Sony Corporation
    Inventors: Jinichi Morimura, Kazuhiro Sato, Hidehiko Funayama, Hiroshi Dohi, Shojiro Asami, Masato Nakamura, Akio Hitachi