Publication number: 20230348351
Abstract: Provided is a compound, a polymer, a composition, a composition for film formation, a pattern formation method, an insulating film formation method, and a method for producing a compound, by which a resist having excellent exposure sensitivity can be obtained. A compound represented by the following formula (1): wherein RA is a hydrogen atom, a methyl group, or a trifluoromethyl group; RX is ORB or a hydrogen atom; RB is a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms; and P is a hydroxy group, an alkoxy group, an ester group, an acetal group, a carboxyalkoxy group, a carbonate ester group, a nitro group, an amino group, a carboxyl group, a thiol group, an ether group, a thioether group, a phosphine group, a phosphone group, a urethane group, a urea group, an amide group, an imide group, or a phosphate group.
Type:
Application
Filed:
December 21, 2021
Publication date:
November 2, 2023
Inventors:
Tadashi OMATSU, Yu OKADA, Takeru KOGUMA, Masahiro MATSUMOTO, Yushi NIIMI, Masatoshi ECHIGO