Abstract: A composition for film formation containing a polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the following formulae (1A) and (1B), wherein the repeating units are linked to each other by a direct bond between aromatic rings.

Abstract: A polycyclic polyphenolic resin having a repeating unit derived from at least one monomer selected from the group consisting of an aromatic hydroxy compound represented by the following formulae (1A) and (1B), wherein the repeating units are linked to each other by a direct bond between aromatic rings, wherein X represents an oxygen atom, a sulfur atom, a single bond or non-crosslinked state, and Y represents a 2n-valent group having 1 to 60 carbon atoms or a single bond, wherein when X is non-crosslinked state, Y represents the 2n-valent group; A represents a benzene ring or a fused ring; each R0 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol

Abstract: The present invention provides a compound comprising a condensed skeleton of an aromatic compound represented by formula (1-1) and an aromatic aldehyde represented by formula (2-1). (In the formula (1-1), A represents an aromatic ring; R is each independently an alkyl group, an aryl group, an alkenyl group, an alkynyl group, an alkoxy group, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a crosslinkable group, a dissociation group, or a thiol group; k is an integer of 0 or more; and L is an integer of 1 or more.

Abstract: The resist composition of the present invention contains one or more selected from compounds represented by specific formulae and resins obtained using these as monomers.

Abstract: The present invention employs a compound represented by the following formula (1) and/or a resin comprising the compound as a constituent: wherein R1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R2 to R5 are each independently a linear, branched, or cyclic alkyl group of 1 to 10 carbon atoms, an aryl group of 6 to 10 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, an alkoxy group of 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, provided that at least one selected from R2 to R5 is a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; m2 and m3 are each independently an integer of 0 to 8; m4 and m5 are each independently an integer of 0 to 9, provided that m2, m3, m4, and m5 are not 0 at the same time; n is an integer of 1 to 4; and p2 to p5 are each independently an integer of 0 to 2.

Abstract: The present invention provides a film forming material for lithography comprising a compound having: a group of formula (0A): and a group of formula (0B): wherein each R is independently selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms, provided that at least one R is an alkyl group having 1 to 4 carbon atoms.

Abstract: A film forming material for lithography comprising a maleimide resin represented by the following formula (1A)

Abstract: The present invention has an object to provide a film forming material for lithography that is applicable to a wet process, has excellent heat resistance and film flatness in a supporting material having difference in level, and has excellent solubility in a solvent and long term storage stability in a solution form; and the like. The above object can be achieved by a film forming material for lithography comprising: a compound having a group of formula (0A): (In formula (0A), RA and RB are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms); and a latent curing accelerator.

Abstract: A composition comprising a polyphenol compound (B), wherein the polyphenol compound (B) is one or more selected from the group consisting of a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2):

Abstract: The present embodiment provides a material for forming an underlayer film for lithography, containing at least any of a compound represented by following formula (1) or a resin including a structural unit derived from a compound represented by the following formula (1), wherein R1 represents a 2n-valent group having 1 to 60 carbon atoms, or a single bond, each R2 independently represents a halogen atom, a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a thiol group, a hydroxyl group, or a group where a hydrogen atom of a hydroxyl group is substituted with an acid-dissociable group, and may be the same or different in the same naphthalene ring or benzene ring, in which at least one R2 represents a group where a hydrogen atom of a hydroxyl group is substituted with an acid-dissociable group, n is an integer of 1 to 4, and structural formulae of n struct

Abstract: Provided is a composition containing a polyphenol compound (B) and a solvent, in which the polyphenol compound (B) is at least one selected from a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2): wherein RY, RT, X, m, N, r, and L are as described in the description.

Abstract: The present invention provides a material for forming an underlayer film for lithography, containing at least any of a compound represented by following formula (1) or a resin including a structural unit derived from a compound represented by the following formula (1), wherein R1 represents a 2n-valent group having a 1 to 60 carbon atoms, or a single bond, each R2 independently represents a halogen atom, a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a thiol group, or a hydroxyl group, and may be the same or different in the same naphthalene ring or benzene ring, n is an integer of 1 to 4, structural formulae of n's structural units in square brackets [ ] may be the same or different when n is an integer of 2 or more, X represents an oxygen atom, a sulfur atom, or a non-bridging group, each m2 is independently an integer of 0 to 7, in which at least

Abstract: The present invention employs a compound represented by the following formula (0): wherein RY is a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms or an aryl group of 6 to 30 carbon atoms; RZ is an N-valent group of 1 to 60 carbon atoms or a single bond; each RT is independently an alkyl group of 1 to 30 carbon atoms optionally having a substituent, an aryl group of 6 to 40 carbon atoms optionally having a substituent, an alkenyl group of 2 to 30 carbon atoms optionally having a substituent, an alkoxy group of 1 to 30 carbon atoms optionally having a substituent, a halogen atom, a nitro group, an amino group, a cyano group, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, wherein the alkyl group, the alkenyl group, and the aryl group each optionally contain an ether bond, a ketone bond, or an ester bond, wherein at least one RT is a hydroxy group or a group in which a hydrogen atom of a hydroxy group is

Abstract: An object of the present invention is to provide a useful underlayer film forming composition. The following underlayer film forming composition can solve the problem described above. An underlayer film forming composition comprising: a compound having a constituent unit represented by the following formula (1); and a solvent, wherein the weight average molecular weight of the compound is 1,000 to 30,000 as the molecular weight in terms of polystyrene, and the solubility of the compound in propylene glycol monomethyl ether acetate is 10% by mass at 23° C.

Abstract: An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. A film forming material for lithography comprising a compound having a group of the following formula (0): can solve the problem described above.

Abstract: A compound represented by the following formula (1) and a method for producing the same, and a composition, a composition for optical component formation, a film forming composition for lithography, a resist composition, a method for forming a resist pattern, a radiation-sensitive composition, a method for producing an amorphous film, an underlayer film forming material for lithography, a composition for underlayer film formation for lithography, a method for producing an underlayer film for lithography, a resist pattern formation method, a circuit pattern formation method, and a purification method.

Abstract: A composition containing a polyphenol compound (B), wherein the polyphenol compound (B) is one or more selected from the group consisting of a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2):

Abstract: An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following film forming material for lithography. A film forming material for lithography comprising: a compound having a group of formula (0A): (In formula (0A), RA is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and RB is an alkyl group having 1 to 4 carbon atoms.

Abstract: A composition is provided for resist underlayer film formation comprising a compound represented by the following formula (1) and a silicon containing compound: [LxTe(OR1)y]??(1) (In formula (1), L is a ligand other than OR1; R1 is any of a hydrogen atom, a substituted or unsubstituted linear alkyl group having 1 to 20 carbon atoms or branched or cyclic alkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, and a substituted or unsubstituted alkenyl group having 2 to 20 carbon atoms; x is an integer of 0 to 6; y is an integer of 0 to 6; the sum of x and y is 1 to 6; when x is 2 or more, a plurality of L may be the same or different; and when y is 2 or more, a plurality of R1 may be the same or different.

Abstract: An object of the present invention is to provide a new compound that is useful as a film forming material for lithography and the like. The above object can be achieved by a compound represented by the following formula (1).