Abstract: A method for manufacturing a rotor including a rotor body, and a sleeve surrounding an outer peripheral portion of the rotor body and applying a pressurizing force toward an inner periphery to the rotor body, includes: preparing the sleeve having a tubular shape and having an inner diameter smaller than an outer diameter of the rotor body; expanding an inner diameter of the sleeve to be larger than an outer diameter of the rotor body, by applying a liquid pressure to an inner diameter portion of the sleeve; inserting the rotor body into the inner diameter portion of the sleeve while applying the liquid pressure; and fixing the sleeve to the rotor body by removing the liquid pressure and contracting the sleeve.

Abstract: A data processing method performed by a processor that receives data signals from a plurality of devices that utilize different protocols from each other receives data signals, respectively, from each of the plurality of devices, and generates multitrack audio data, in which audio data of a plurality of channels is stored by storing a first data string of a digital audio signal, received from a first device of the plurality of devices that utilizes a first protocol, in a first channel of the plurality of channels, and storing a data string of a digital signal, related to the digital audio signal and received from a second device of the plurality of devices that utilizes a second protocol different from the first protocol, as a second data string of the digital audio signal in a second channel of the plurality of channels.

Abstract: A semiconductor device has laminated therein three or more chips. The plurality of chips are provided with substrates, transmission coils, and reception coils that are disposed in regions where the transmission coils and the reception coils do not overlap with each other in an in-plane direction of the substrates. The transmission coils are disposed in regions that are in a lamination direction and that are adjacent to and overlap with reception coils of other chips. The reception coils are configured to allow data transmission with respect to the transmission coils that are disposed on the same substrates.

Abstract: Provided is a polyimide having a repeating unit represented by the following Formula (1): wherein R1 represents a tetravalent group; R2 represents a divalent group; provided that at least one of R1's is represented by the following Formula (2); and among R2's, at least one group is represented by the following Formula (3), and at least one other group is represented by the following Formula (4):

Abstract: A signal processing apparatus includes a first signal processing circuit configured to generate a first sound signal based on an input signal, and a second signal processing circuit configured to generate a second sound signal based on the first sound signal. In a case that a gain of the first signal processing circuit is switched, the second signal processing circuit generates, for a predetermined time after the gain of the first signal processing circuit is switched, a value of the second sound signal based on a value of the first sound signal at or before a timing of the gain of the first signal processing circuit being switched.

Abstract: In an audio processing apparatus configured to supply audio data to a processor configured to process audio data, a plurality of receivers, each configured to receive audio data and a work clock carried with the audio data and to supply the audio data to the processor; a plurality of PLL circuits corresponding to the plurality of receivers, each PLL circuit being configured to generate a clock signal based on a word clock received by the corresponding receiver; and a selector configured to select a clock signal from among a plurality of clock signals generated by the plurality of PLL circuits, and to supply the selected clock signal to the processor, the processor outputting the processed audio data at timing synchronized with the selected clock signal are provided.

Abstract: In an audio processing apparatus configured to supply audio data to a processor configured to process audio data, a plurality of receivers, each configured to receive audio data and a work clock carried with the audio data and to supply the audio data to the processor; a plurality of PLL circuits corresponding to the plurality of receivers, each PLL circuit being configured to generate a clock signal based on a word clock received by the corresponding receiver; and a selector configured to select a clock signal from among a plurality of clock signals generated by the plurality of PLL circuits, and to supply the selected clock signal to the processor, the processor outputting the processed audio data at timing synchronized with the selected clock signal are provided.

Abstract: A polyesterimide having a repeating unit expressed by formula (3) is useful for FPC substrates, COF substrates and TAB substrate materials, especially as FPC substrate materials: wherein R represents a phenyl group, R1 represents an alkyl group with 1 to 6 carbon atoms or alkoxy group with 1 to 6 carbon atoms, n each independently takes a value of 0 to 4, a each independently takes a value of 0 to 4, and m represents an integer of 2 to 4, where not all n's are 0 at the same time and 0?n+a?4 is satisfied by each phenylene group, and X is a divalent aromatic group and/or aliphatic group.

Abstract: A polyimide demonstrates low coefficient of hygroscopic expansion and low water absorption coefficient when used as an insulation film. The polyimide is derived from a tetracarboxylic acid dianhydride containing ester group expressed by the general formula below, and a polyester imide precursor: wherein R is independent and represents a straight or branched-chain alkyl group with 1 to 6 carbon atoms or straight or branched-chain alkoxyl group with 1 to 6 carbon atoms, n is an integer of 0 to 4, and m is an integer of 2 to 4, but wherein, if m =2, n is an integer of 1 to 4.

Abstract: A semiconductor device that makes isolation circuits unnecessary and that also resolves the problem of through-current flowing during power supply shutdown transitions and during power supply recovery and that even flows between the regions during power shutdown. A semiconductor device of the present invention including a first power supply line, and a second power supply line coupled to a first power supply line by way of a first switch, a macro cell containing a macro cell core coupled to the second power supply line, and a third power supply line coupled by way of a second switch to a first power supply line, and a circuit block coupled to the third power supply line and also coupled to at least either the macro cell core input or output; and the second power supply line is coupled to the third power supply line.

Abstract: Provided are (i) a polyimide which is transparent and has an excellent solution processability, a high heat resistance, and a low linear thermal expansion coefficient, and (ii) a polyimide film of the polyimide. According to the present invention, it is possible to produce, by use of a novel diamine characterized in having an amide group and a trifluoromethyl group, the polyimide which is transparent and has the excellent solution processability, the high heat resistance, and the low linear thermal expansion coefficient. The polyimide can be applied to various electronic devices such as an electronic display device.

Abstract: An object of the present invention is to obtain a polyamide-imide solution that has a low linear thermal expansion coefficient, that is, an excellent linear thermal expansion coefficient, and that also is excellent in coating applicability. A further object of the present invention is to provide, with use of the polyamide-imide solution, a product or member which has high requirements for heat resistance and a low linear thermal expansion coefficient. In particular, the present invention is intended to provide a product or member that is suitably used for applications in which the polyamide-imide film obtained from the polyamide-imide solution of the present invention is formed on a surface of an inorganic material such as metal, metal oxide, or monocrystalline silicon.

Abstract: A semiconductor device having an SRAM macro which has a power-off function and facilitates a design associated with a change in storage capacity is provided. The semiconductor device has plural layout units each including a memory array having plural memory cells in an SRAM, a first peripheral circuit that writes data into the memory array and reads the data from the memory array, and a switch group that disconnects the memory array and the first peripheral circuit, and power wires.

Abstract: An optical film that is excellent not only in transparency and heat resistance but also in solubility in an organic solvent and linear thermal expansion coefficient. Also, a product or a member which meets high demands for heat resistance and low linear thermal expansion coefficient with the use of the optical film, more specifically a transparent substrate using the optical film, and an image display device and a solar cell including the optical film or the transparent substrate. The optical film contains a polyimide having a specific structure in which a repeating unit of a chain of a polymer has both an amide group and an imide group and the polymer has a fluorine atom. The polyimide is obtained by mixing a dehydrating agent and an imidizing agent with a polyamic acid solution so as to imidize the polyamic acid.

Abstract: An optical film that is excellent not only in transparency and heat resistance but also in solubility in an organic solvent and linear thermal expansion coefficient. Also, a product or a member which meets high demands for heat resistance and low linear thermal expansion coefficient with the use of the optical film, more specifically a transparent substrate using the optical film, and an image display device and a solar cell including the optical film or the transparent substrate. The optical film contains a polyimide having a specific structure in which a repeating unit of a chain of a polymer has both an amide group and an imide group and the polymer has a fluorine atom. The polyimide is obtained by mixing a dehydrating agent and an imidizing agent with a polyamic acid solution so as to imidize the polyamic acid.

Abstract: A semiconductor device having an SRAM macro which has a power-off function and facilitates a design associated with a change in storage capacity is provided. The semiconductor device has plural layout units each including a memory array having plural memory cells in an SRAM, a first peripheral circuit that writes data into the memory array and reads the data from the memory array, and a switch group that disconnects the memory array and the first peripheral circuit, and power wires.

Abstract: A semiconductor device that makes isolation circuits unnecessary and that also resolves the problem of through-current flowing during power supply shutdown transitions and during power supply recovery and that even flows between the regions during power shutdown. A semiconductor device of the present invention including a first power supply line, and a second power supply line coupled to a first power supply line by way of a first switch, a macro cell containing a macro cell core coupled to the second power supply line, and a third power supply line coupled by way of a second switch to a first power supply line, and a circuit block coupled to the third power supply line and also coupled to at least either the macro cell core input or output; and the second power supply line is coupled to the third power supply line.

Abstract: A linear polyimide is produced from mellophanic dianhydride, diamine (NH2-A-NH2), and a monofunctional acid anhydride and contains a repeating unit represented by the following general formula (3): wherein A represents a divalent aromatic diamine residue or aliphatic diamine residue, B represents a monofunctional acid anhydride residue, and n represents a degree of polymerization.

Abstract: Disclosed is a polyesterimide having a repeating unit expressed by the formula below, and also provides the manufacturing methods thereof: wherein R represents a phenyl group, R1 represents an alkyl group with 1 to 6 carbon atoms or alkoxy group with 1 to 6 carbon atoms, n each independently takes a value of 0 to 4, a each independently takes a value of 0 to 4, and m represents an integer of 2 to 4, where not all n's are 0 at the same time and 0?n+a?4 is satisfied by each phenylene group, and X is a divalent aromatic group and/or aliphatic group.

Abstract: Disclosed is a positive photosensitive resin composition which can reduce warping of a substrate such as a semiconductor wafer or the like even when the positive photosensitive resin composition is subjected to dehydration ring closing by the application of a thermal history; a cured film; a protecting film; an insulating film; a semiconductor device; and a display device. The positive photosensitive resin composition comprises a polyamide resin mainly composed of a polybenzoxazole precursor and being patterned on the substrate such as a semiconductor wafer or the like by coating, exposure and development. The cured film is obtained by subjecting the positive photosensitive resin composition containing a polyamide resin mainly composed of a polybenzoxazole precursor to dehydration ring closing. The protecting film comprises the cured film.