Patents by Inventor Masatoshi Kaneda

Masatoshi Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10487426
    Abstract: A bent part of a sock has (i) a bulging part having a first bulging region which includes a region in which the number of wales decreases, and a second bulging region which includes a region in which the number of wales increases and (ii) an extended part having a first extended region in which the number of wales increases, and a second extended region in which the number of wales decreases. The extended part is located so as to be closer to a bend direction side than the bulging part. The extended part has a boundary part between the first extended region and the second extended region which boundary part has a bend direction side first end. The bend direction side first end is located on a center line in a direction in which a width of the sock extends, or within a predetermined distance from the center line.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: November 26, 2019
    Assignee: OKAMOTO CORPORATION
    Inventors: Masatoshi Kaneda, Takao Fukui
  • Publication number: 20180094367
    Abstract: A bent part of a sock has (i) a bulging part having a first bulging region which includes a region in which the number of wales decreases, and a second bulging region which includes a region in which the number of wales increases and (ii) an extended part having a first extended region in which the number of wales increases, and a second extended region in which the number of wales decreases. The extended part is located so as to be closer to a bend direction side than the bulging part. The extended part has a boundary part between the first extended region and the second extended region which boundary part has a bend direction side first end. The bend direction side first end is located on a center line in a direction in which a width of the sock extends, or within a predetermined distance from the center line.
    Type: Application
    Filed: October 2, 2017
    Publication date: April 5, 2018
    Inventors: Masatoshi KANEDA, Takao FUKUI
  • Publication number: 20170047233
    Abstract: A substrate processing apparatus includes a placing table configured to hold a substrate having a processing target film, which is decomposed by irradiating an ultraviolet ray thereto under an oxygen-containing atmosphere; a processing chamber, configured to accommodate therein the substrate placed on the placing table, having therein the oxygen-containing atmosphere; and an ultraviolet ray irradiation device configured to irradiate the ultraviolet ray to the substrate within the processing chamber. Further, the placing table is provided with a surrounding member configured to surround the substrate placed on the placing table and restrict a gas introduction amount from an outside of the substrate toward above the substrate.
    Type: Application
    Filed: November 1, 2016
    Publication date: February 16, 2017
    Inventors: Masatoshi Kaneda, Yuzo Ohishi, Keisuke Yoshida
  • Patent number: 9514951
    Abstract: A substrate processing method can remove a part of a processing target film formed on a surface of a substrate W under a normal pressure atmosphere while suppressing an influence upon the substrate. A source material of the processing target film, which is decomposed by irradiating an ultraviolet ray thereto under an oxygen-containing atmosphere, is coated on the substrate W, and the processing target film is formed by heating the source material coated on the substrate W. Then, the substrate W having thereon the processing target film is placed within a processing chamber under the oxygen-containing atmosphere where a gas flow velocity is equal to or smaller than 10 cm/sec, and the part of the processing target film is removed by irradiating the ultraviolet ray to the substrate W.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: December 6, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masatoshi Kaneda, Yuzo Ohishi, Keisuke Yoshida
  • Patent number: 9362150
    Abstract: A substrate processing apparatus includes a housing, a mounting table provided in the housing and configured to mount a substrate thereon, a drive mechanism provided below the mounting table so as to move the mounting table in a front-back direction between a delivering/receiving location for the substrate and a processing chamber, an ultraviolet irradiation unit configured to irradiate the substrate in the processing chamber with ultraviolet rays, a partition member provided to partition the processing chamber and a drive chamber with the drive mechanism positioned therein up and down, the partition member having a slit for allowing movement of a support supporting the mounting table, first exhaust ports formed in the drive chamber to exhaust an atmosphere in the drive chamber, and second exhaust ports formed along a lengthwise direction of the slit so as to face the slit.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: June 7, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masatoshi Kaneda, Kazuki Nagamoto, Ryo Shimada
  • Publication number: 20150371894
    Abstract: A substrate processing method can remove a part of a processing target film formed on a surface of a substrate W under a normal pressure atmosphere while suppressing an influence upon the substrate. A source material of the processing target film, which is decomposed by irradiating an ultraviolet ray thereto under an oxygen-containing atmosphere, is coated on the substrate W, and the processing target film is formed by heating the source material coated on the substrate W. Then, the substrate W having thereon the processing target film is placed within a processing chamber under the oxygen-containing atmosphere where a gas flow velocity is equal to or smaller than 10 cm/sec, and the part of the processing target film is removed by irradiating the ultraviolet ray to the substrate W.
    Type: Application
    Filed: June 19, 2015
    Publication date: December 24, 2015
    Inventors: Masatoshi Kaneda, Yuzo Ohishi, Keisuke Yoshida
  • Publication number: 20150303077
    Abstract: A substrate processing apparatus includes a housing, a mounting table provided in the housing and configured to mount a substrate thereon, a drive mechanism provided below the mounting table so as to move the mounting table in a front-back direction between a delivering/receiving location for the substrate and a processing chamber, an ultraviolet irradiation unit configured to irradiate the substrate in the processing chamber with ultraviolet rays, a partition member provided to partition the processing chamber and a drive chamber with the drive mechanism positioned therein up and down, the partition member having a slit for allowing movement of a support supporting the mounting table, first exhaust ports formed in the drive chamber to exhaust an atmosphere in the drive chamber, and second exhaust ports formed along a lengthwise direction of the slit so as to face the slit.
    Type: Application
    Filed: April 16, 2015
    Publication date: October 22, 2015
    Inventors: Masatoshi KANEDA, Kazuki NAGAMOTO, Ryo SHIMADA
  • Patent number: 9105519
    Abstract: A substrate treatment apparatus configured such that substrates in a same lot are distributed by a delivery mechanism into a plurality of unit blocks, each unit block including a solution treatment module, an ultraviolet irradiation module, and a substrate carrying mechanism, the apparatus includes: an illuminance detection part that detects an illuminance of a light source of the ultraviolet irradiation module; and a control part that controls, when an illuminance detection value of the ultraviolet irradiation module in one unit block among the plurality of unit blocks becomes a set value or less, the delivery mechanism to stop delivery of a substrate to the one unit block and deliver subsequent substrates to another unit block, and the ultraviolet irradiation module to perform irradiation on substrates which have already been delivered to the one unit block with an irradiation time adjusted to a length according to the illuminance detection value.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: August 11, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Masatoshi Kaneda
  • Publication number: 20150037911
    Abstract: A substrate treatment apparatus configured such that substrates in a same lot are distributed by a delivery mechanism into a plurality of unit blocks, each unit block including a solution treatment module, an ultraviolet irradiation module, and a substrate carrying mechanism, the apparatus includes: an illuminance detection part that detects an illuminance of a light source of the ultraviolet irradiation module; and a control part that controls, when an illuminance detection value of the ultraviolet irradiation module in one unit block among the plurality of unit blocks becomes a set value or less, the delivery mechanism to stop delivery of a substrate to the one unit block and deliver subsequent substrates to another unit block, and the ultraviolet irradiation module to perform irradiation on substrates which have already been delivered to the one unit block with an irradiation time adjusted to a length according to the illuminance detection value.
    Type: Application
    Filed: October 20, 2014
    Publication date: February 5, 2015
    Inventor: Masatoshi KANEDA
  • Patent number: 8893650
    Abstract: A substrate treatment apparatus configured such that substrates in a same lot are distributed by a delivery mechanism into a plurality of unit blocks, each unit block including a solution treatment module, an ultraviolet irradiation module, and a substrate carrying mechanism, the apparatus includes: an illuminance detection part that detects an illuminance of a light source of the ultraviolet irradiation module; and a control part that controls, when an illuminance detection value of the ultraviolet irradiation module in one unit block among the plurality of unit blocks becomes a set value or less, the delivery mechanism to stop delivery of a substrate to the one unit block and deliver subsequent substrates to another unit block, and the ultraviolet irradiation module to perform irradiation on substrates which have already been delivered to the one unit block with an irradiation time adjusted to a length according to the illuminance detection value.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: November 25, 2014
    Assignee: Tokyo Electron Limited
    Inventor: Masatoshi Kaneda
  • Patent number: 8776393
    Abstract: A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: July 15, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Kouichi Mizunaga, Yasuhiro Kuga, Masatoshi Kaneda
  • Patent number: 8748780
    Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: June 10, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Shouken Moro, Yasuhiro Takaki, Masatoshi Kaneda
  • Patent number: 8544300
    Abstract: To provide a functional area partially within the toe area on the sole side of the sock. Providing a needle-lowering area 1a which is knit by needle-lowering knitting and a needle-raising area 2 which is knit by needle-raising knitting at a specified position within the toe area 4 on the sole side of sock S, these being aligned in the course direction, and providing a first functional area 1 in which the needle-lowering area 1a and/or the needle-raising area 2 is knit with a functional yarn which differs from the yarn used in knitting the other areas 11 within the toe area 4 on the sole side. A first functional member 1 can be provided within a specified portion of the toe area 4 on the sole side. If the first functional member 1 is knit with a functional yarn having high frictional resistance, it becomes possible to increase the gripping force only of that specified portion.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: October 1, 2013
    Assignee: Okamoto Corporation
    Inventors: Masatoshi Kaneda, Akinobu Iwaki, Atsushi Shiraishi
  • Patent number: 8277884
    Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: October 2, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Shinji Kobayashi, Tetsushi Miyamoto, Masahito Hamada, Masatoshi Kaneda
  • Patent number: 8186077
    Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: May 29, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Tatsuya Kawaji, Yuichi Sakai, Masatoshi Kaneda
  • Publication number: 20110302699
    Abstract: To provide a functional area partially within the toe area on the sole side of the sock. Providing a needle-lowering area 1a which is knit by needle-lowering knitting and a needle-raising area 2 which is knit by needle-raising knitting at a specified position within the toe area 4 on the sole side of sock S, these being aligned in the course direction, and providing a first functional area 1 in which the needle-lowering area 1a and/or the needle-raising area 2 is knit with a functional yarn which differs from the yarn used in knitting the other areas 11 within the toe area 4 on the sole side. A first functional member 1 can be provided within a specified portion of the toe area 4 on the sole side. If the first functional member 1 is knit with a functional yarn having high frictional resistance, it becomes possible to increase the gripping force only of that specified portion.
    Type: Application
    Filed: June 10, 2011
    Publication date: December 15, 2011
    Inventors: Masatoshi Kaneda, Akinobu Iwaki, Atsushi Shiraishi
  • Publication number: 20110233187
    Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
    Type: Application
    Filed: June 6, 2011
    Publication date: September 29, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Tatsuya KAWAJI, Yuichi SAKAI, Masatoshi KANEDA
  • Patent number: 7992318
    Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: August 9, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Tatsuya Kawaji, Yuichi Sakai, Masatoshi Kaneda
  • Patent number: 7971280
    Abstract: The present invention provides a comfortable sock free from tightness in a sole portion. The sock is constructed so that a bottom extension portion 13, in which the number of courses on the side of a sole portion 8 is larger than that on the side of an instep portion 9, is formed between a toe portion 5 and a heel portion 3, and length in the longitudinal direction of the sole portion 8 is larger than that of the instep portion 9.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: July 5, 2011
    Assignee: Okamoto Corporation
    Inventor: Masatoshi Kaneda
  • Publication number: 20110085299
    Abstract: A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.
    Type: Application
    Filed: October 5, 2010
    Publication date: April 14, 2011
    Applicant: Tokyo Electron Limited
    Inventors: Kouichi Mizunaga, Yasuhiro Kuga, Masatoshi Kaneda