Patents by Inventor Masatoshi Kaneda
Masatoshi Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7992318Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.Type: GrantFiled: January 17, 2008Date of Patent: August 9, 2011Assignee: Tokyo Electron LimitedInventors: Tatsuya Kawaji, Yuichi Sakai, Masatoshi Kaneda
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Patent number: 7971280Abstract: The present invention provides a comfortable sock free from tightness in a sole portion. The sock is constructed so that a bottom extension portion 13, in which the number of courses on the side of a sole portion 8 is larger than that on the side of an instep portion 9, is formed between a toe portion 5 and a heel portion 3, and length in the longitudinal direction of the sole portion 8 is larger than that of the instep portion 9.Type: GrantFiled: February 8, 2006Date of Patent: July 5, 2011Assignee: Okamoto CorporationInventor: Masatoshi Kaneda
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Publication number: 20110085299Abstract: A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.Type: ApplicationFiled: October 5, 2010Publication date: April 14, 2011Applicant: Tokyo Electron LimitedInventors: Kouichi Mizunaga, Yasuhiro Kuga, Masatoshi Kaneda
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Publication number: 20100034969Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.Type: ApplicationFiled: September 30, 2009Publication date: February 11, 2010Inventors: Shinji KOBAYASHI, Tetsushi Miyamoto, Masahito Hamada, Masatoshi Kaneda
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Publication number: 20090282607Abstract: The present invention provides a comfortable sock free from tightness in a sole portion. A sock is constructed so that a bottom extension portion 13 in which the number of courses on the side of a sole portion 8 is larger than that on the side of an instep portion 9 is formed between a toe portion 5 and a heel portion 3, and length in the longitudinal direction of the sole portion 8 is larger than that of the instep portion 9.Type: ApplicationFiled: February 8, 2006Publication date: November 19, 2009Inventor: Masatoshi Kaneda
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Patent number: 7615117Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.Type: GrantFiled: March 9, 2004Date of Patent: November 10, 2009Assignee: Tokyo Electron LimitedInventors: Shinji Kobayashi, Tetsushi Miyamoto, Masahito Hamada, Masatoshi Kaneda
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Patent number: 7587915Abstract: A sock includes a sole having protrusions formed on its inner surface by tuck knitting. The protrusions are spaced from each other in the course direction to define first recesses between the protrusions that are adjacent to each other in the course direction, and spaced from each other in the wale direction to define second recesses between the protrusions adjacent to each other in the wale direction. Each protrusion is formed by knitting six courses in one loop, and includes six rubber threads, 12 reinforcing threads, three front threads and three back threads. The protrusions are arranged in a plurality of rows, each row occupying one course. Between the adjacent rows of protrusions, the second recesses are defined, which each occupy four courses. The protrusions have a height of 3.5 to 4.5 mm from the second recesses.Type: GrantFiled: October 21, 2008Date of Patent: September 15, 2009Assignee: Okamoto CorporationInventor: Masatoshi Kaneda
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Publication number: 20090100877Abstract: A sock includes a sole having protrusions formed on its inner surface by tuck knitting. The protrusions are spaced from each other in the course direction to define first recesses between the protrusions that are adjacent to each other in the course direction, and spaced from each other in the wale direction to define second recesses between the protrusions adjacent to each other in the wale direction. Each protrusion is formed by knitting six courses in one loop, and includes six rubber threads, 12 reinforcing threads, three front threads and three back threads. The protrusions are arranged in a plurality of rows, each row occupying one course. Between the adjacent rows of protrusions, the second recesses are defined, which each occupy four courses. The protrusions have a height of 3.5 to 4.5 mm from the second recesses.Type: ApplicationFiled: October 21, 2008Publication date: April 23, 2009Inventor: Masatoshi KANEDA
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Patent number: 7431584Abstract: A heat processing apparatus for heating a mask substrate is disclosed. A mask substrate on which a coating solution has been coated is placed on a heating plate that heats the substrate. A frame member is disposed on the heating plate so that the frame member faces a side surface of the mask substrate placed on the heating plate when the frame member is attached to the heating plate and that a clearance is formed between the frame member and the heating plate when the frame member is attached to the heating plate. The frame member suppresses heat radiated from the side surface of the substrate. As a result, the temperature uniformity of the surface of the substrate can be improved. In addition, since the clearance is formed between the frame member and the heating plate, particles do not accumulate in the region. Thus, adhesion of particles to the substrate can be suppressed.Type: GrantFiled: February 10, 2004Date of Patent: October 7, 2008Assignee: Tokyo Electron LimitedInventors: Toshichika Takei, Masatoshi Kaneda
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Publication number: 20080175999Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.Type: ApplicationFiled: January 17, 2008Publication date: July 24, 2008Inventors: Tatsuya Kawaji, Yuichi Sakai, Masatoshi Kaneda
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Publication number: 20080171131Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.Type: ApplicationFiled: January 16, 2008Publication date: July 17, 2008Inventors: Shouken Moro, Yasuhiro Takaki, Masatoshi Kaneda
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Patent number: 7151239Abstract: A heat treating apparatus is provided to apply a heat treatment on a substrate. Prior to the heat treatment, an exclusive transfer mechanism transfers the substrate from a cooling plate onto a heating plate for heating the substrate. Before mounting the substrate on the heating plate, the control mode for heater modules for heating the heating plate on power supply module is switched from a PID control by a regulating part in a controller of the apparatus to a MV control by a fixed-pattern output part in the controller. Next, at a predetermined timing since the substrate has been mounted on the heating plate, the MV control is switched to the PID control. Consequently, it becomes possible to quickly restore a reduce temperature of the heating plate prior to the mounting of substrate on the heating plate and also possible to quickly stabilize a so-raised temperature of the heating plate, accomplishing a heating process with high accuracy and shirt time.Type: GrantFiled: May 23, 2005Date of Patent: December 19, 2006Assignee: Tokyo Electron LimitedInventors: Toshichika Takei, Masatoshi Kaneda
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Patent number: 7049553Abstract: Immediately after a cold substrate G is placed on a substrate table 3, a large electric power P1 is supplied to a heating element 32 embedded in the substrate table for a time period T1 so that temperature of the substrate table overshoots a target temperature, and thereafter zero or very small electric power P2 is supplied to the heating element for a time period T2 so that the temperature of the substrate table 3 is lowered to the target temperature while temperature of the substrate continues to rise up to the target temperature. When both the temperature of the substrate table and of the substrate reaches approximately to the target temperature after the time period T2 has elapsed, control of the electric power is entrusted to a PID controller.Type: GrantFiled: June 16, 2004Date of Patent: May 23, 2006Assignee: Tokyo Electron LimitedInventors: Kenichi Shigetomi, Nobuyuki Sata, Toshichika Takei, Masatoshi Kaneda
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Publication number: 20050258165Abstract: A heat treating apparatus is provided to apply a heat treatment on a substrate. Prior to the heat treatment, an exclusive transfer mechanism transfers the substrate from a cooling plate onto a heating plate for heating the substrate. Before mounting the substrate on the heating plate, the control mode for heater modules for heating the heating plate on power supply module is switched from a PID control by a regulating part in a controller of the apparatus to a MV control by a fixed-pattern output part in the controller. Next, at a predetermined timing since the substrate has been mounted on the heating plate, the MV control is switched to the PID control. Consequently, it becomes possible to quickly restore a reduce temperature of the heating plate prior to the mounting of substrate on the heating plate and also possible to quickly stabilize a so-raised temperature of the heating plate, accomplishing a heating process with high accuracy and shirt time.Type: ApplicationFiled: May 23, 2005Publication date: November 24, 2005Inventors: Toshichika Takei, Masatoshi Kaneda
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Publication number: 20040250762Abstract: Immediately after a cold substrate G is placed on a substrate table 3, a large electric power P1 is supplied to a heating element 32 embedded in the substrate table for a time period T1 so that temperature of the substrate table overshoots a target temperature, and thereafter zero or very small electric power P2 is supplied to the heating element for a time period T2 so that the temperature of the substrate table 3 is lowered to the target temperature while temperature of the substrate continues to rise up to the target temperature. When both the temperature of the substrate table and of the substrate reaches approximately to the target temperature after the time period T2 has elapsed, control of the electric power is entrusted to a PID controller.Type: ApplicationFiled: June 16, 2004Publication date: December 16, 2004Applicant: TOKYO ELECTRON LIMITEDInventors: Kenichi Shigetomi, Nobuyuki Sata, Toshichika Takei, Masatoshi Kaneda
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Publication number: 20040180141Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.Type: ApplicationFiled: March 9, 2004Publication date: September 16, 2004Inventors: Shinji Kobayashi, Tetsushi Miyamoto, Masahito Hamada, Masatoshi Kaneda
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Publication number: 20040157419Abstract: A heat processing apparatus for heating a mask substrate is disclosed. A mask substrate on which a coating solution has been coated is placed on a heating plate that heats the substrate. A frame member is disposed on the heating plate so that the frame member faces a side surface of the mask substrate placed on the heating plate when the frame member is attached to the heating plate and that a clearance is formed between the frame member and the heating plate when the frame member is attached to the heating plate. The frame member suppresses heat radiated from the side surface of the substrate. As a result, the temperature uniformity of the surface of the substrate can be improved. In addition, since the clearance is formed between the frame member and the heating plate, particles do not accumulate in the region. Thus, adhesion of particles to the substrate can be suppressed.Type: ApplicationFiled: February 10, 2004Publication date: August 12, 2004Applicant: TOKYO ELECTRON LIMITEDInventors: Toshichika Takei, Masatoshi Kaneda
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Patent number: 6655891Abstract: A substrate transfer system comprising a cassette table for mounting a cassette which has an opening portion for loading and unloading a substrate and a cover detachably provided to the opening portion, process portion for processing the substrate housed in a cassette on the cassette table, a transfer arm mechanism for taking out the substrate from the cassette table, transferring it to process units G1 to G5, and returning a processed substrate to the cassette on the cassette table, partition members provided between the transfer arm mechanism and the cassette table, for separating an atmosphere on the side of the transfer arm mechanism from that on the side of the cassette table, a passage formed in the partition member so as to face the opening portion of the cassette on the cassette table, for passing the substrate taken out from the cassette on the cassette table by the transfer arm mechanism and returning the substrate to the cassette on the cassette table, cassette moving mechanisms for moving the openType: GrantFiled: March 25, 2002Date of Patent: December 2, 2003Assignee: Tokyo Electron LimitedInventors: Issei Ueda, Masami Akimoto, Kazuhiko Ito, Mitiaki Matsushita, Masatoshi Kaneda, Yuji Matsuyama
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Publication number: 20020106268Abstract: A substrate transfer system comprising a cassette table for mounting a cassette which has an opening portion for loading and unloading a substrate and a cover detachably provided to the opening portion, process portion for processing the substrate housed in a cassette on the cassette table, a transfer arm mechanism for taking out the substrate from the cassette table, transferring it to process units G1 to G5, and returning a processed substrate to the cassette on the cassette table, partition members provided between the transfer arm mechanism and the cassette table, for separating an atmosphere on the side of the transfer arm mechanism from that on the side of the cassette table, a passage formed in the partition member so as to face the opening portion of the cassette on the cassette table, for passing the substrate taken out from the cassette on the cassette table by the transfer arm mechanism and returning the substrate to the cassette on the cassette table, cassette moving mechanisms for moving the openType: ApplicationFiled: March 25, 2002Publication date: August 8, 2002Inventors: Issei Ueda, Masami Akimoto, Kazuhiko Ito, Mitiaki Matsushita, Masatoshi Kaneda, Yuji Matsuyama
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Patent number: 6425722Abstract: A substrate transfer system comprising a cassette table for mounting a cassette which has an opening portion for loading and unloading a substrate and a cover detachably provided to the opening portion, process portion for processing the substrate housed in a cassette on the cassette table, a transfer arm mechanism for taking out the substrate from the cassette table, transferring it to process units G1 to G5, and returning a processed substrate to the cassette on the cassette table, partition members provided between the transfer arm mechanism and the cassette table, for separating an atmosphere on the side of the transfer arm mechanism from that on the side of the cassette table, a passage formed in the partition member so as to face the opening portion of the cassette on the cassette table, for passing the substrate taken out from the cassette on the cassette table by the transfer arm mechanism and returning the substrate to the cassette on the cassette table, cassette moving mechanisms for moving the openType: GrantFiled: March 8, 2000Date of Patent: July 30, 2002Assignee: Tokyo Electron LimitedInventors: Issei Ueda, Masami Akimoto, Kazuhiko Ito, Mitiaki Matsushita, Masatoshi Kaneda, Yuji Matsuyama