Abstract: A gas supplied from a gas source is exposed to an atmosphere above a liquid surface in a tank saving the liquid and thereafter is supplied around a wafer in a treatment chamber through a gas supply passage and a supply port. The gas supplied around the wafer uniformly flows from around the wafer toward above the center of the wafer and thereafter is discharged from an exhaust port which is formed at the top of the treatment chamber. Meanwhile, with respect to the wafer, heat treatment is performed by a heating mechanism and a predetermined PEB is carried out. The humidified gas is supplied into the treatment chamber, thereby preventing drying in the treatment chamber. Therefore, water in resist is not taken out, resulting in that a required resist pattern can be formed on the wafer.

Abstract: A substrate-processing apparatus comprising a processing chamber in which a substrate is processed, an air-supplying device for supplying air having controlled temperature and humidity into the processing chamber, an air passage having an inlet port and an outlet port connected to the processing chamber, for guiding the air from the inlet port to the outlet port, a cooling/dehumidifying section arranged in the air passage and having a thermoelectric cooling device, for cooling and dehumidifying the air introduced from the inlet port, a heating section arranged in the air passage, for heating the air that has been cooled and dehumidified by the cooling/dehumidifying section, a humidifying section provided in the air passage, for humidifying the air heated by the heating section and guiding the air to the outlet port, a temperature-humidity sensor provided at a position in the air passage, and a control device for controlling the cooling/dehumidifying section, the heating section and the humidifying section, in

Abstract: A substrate processing apparatus is composed of: a mounting table for mounting thereon a cassette including a lid detachably attached on an opening for carrying in/out a wafer; a cassette station for processing the wafer housed in the cassette on the mounting table; a sub-arm mechanism for taking the wafer out of the cassette on the mounting table, transferring it to the cassette station, and returning the wafer after processing to the cassette on the mounting table; a partition plate for partitioning an atmosphere on the sub-arm mechanism side from an atmosphere on the mounting table side; a slide stage for moving the cassette in a direction of an opening of the partition plate on the mounting table; a lid removing mechanism for removing the lid from the opening of the cassette through the opening of the partition plate; and an X-axis cylinder for controlling a thrust of the slide stage.

Abstract: A substrate transfer system comprising a cassette table for mounting a cassette which has an opening portion for loading and unloading a substrate and a cover detachably provided to the opening portion, process portion for processing the substrate housed in a cassette on the cassette table, a transfer arm mechanism for taking out the substrate from the cassette table, transferring it to process units G1 to G5, and returning a processed substrate to the cassette on the cassette table, partition members provided between the transfer arm mechanism and the cassette table, for separating an atmosphere on the side of the transfer arm mechanism from that on the side of the cassette table, a passage formed in the partition member so as to face the opening portion of the cassette on the cassette table, for passing the substrate taken out from the cassette on the cassette table by the transfer arm mechanism and returning the substrate to the cassette on the cassette table, cassette moving mechanisms for moving the open