Patents by Inventor Masayuki Imai

Masayuki Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240085405
    Abstract: An image processing device includes a determination unit configured to determine a type of autophagy induced in a cell, based on information indicative of autophagic activity in the cell present in a cell image in which the cell is image captured and based on information indicative of congestion of molecules in the cell present in the cell image.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicants: NIKON CORPORATION, THE UNIVERSITY OF TOKYO
    Inventors: Kenta IMAI, Mamiko Masutani, Masayuki Murata, Fumi Kano, Yoshiyuki Noguchi
  • Patent number: 11541461
    Abstract: A coated cutting tool includes a substrate and a hard film on coated on the substrate. The hard film contains a complex nitride of Al and Cr. The hard film includes aggregates of columnar grains grown on the substrate along the thickness of the film. The nitride has an Al content of 60 atom % or more, a Cr content of 10 atom % or more, and a total content of Al and Cr of 90 atom % or more relative to the total amount of metal and metalloid elements. The complex nitride has the highest peak intensity assigned to crystal plane (311) of an fcc structure in X-ray diffractometry. In the hard film, the ratio of an X-ray diffraction intensity of plane (311) to the intensities of the other planes is 1.30 or more. A method and a system are also provided for manufacturing the coated cutting tool by chemical vapor deposition.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: January 3, 2023
    Assignee: MOLDINO Tool Engineering, Ltd.
    Inventors: Yuuzoh Fukunaga, Masayuki Imai
  • Publication number: 20210354204
    Abstract: A coated cutting tool includes a substrate and a hard film on coated on the substrate. The hard film contains a complex nitride of Al and Cr. The hard film includes aggregates of columnar grains grown on the substrate along the thickness of the film. The nitride has an Al content of 60 atom % or more, a Cr content of 10 atom % or more, and a total content of Al and Cr of 90 atom % or more relative to the total amount of metal and metalloid elements. The complex nitride has the highest peak intensity assigned to crystal plane (311) of an fcc structure in X-ray diffractometry. In the hard film, the ratio of an X-ray diffraction intensity of plane (311) to the intensities of the other planes is 1.30 or more. A method and a system are also provided for manufacturing the coated cutting tool by chemical vapor deposition.
    Type: Application
    Filed: November 9, 2018
    Publication date: November 18, 2021
    Inventors: Yuuzoh Fukunaga, Masayuki Imai
  • Patent number: 11015242
    Abstract: A hard coating comprising a lower layer formed by an fcc-based titanium aluminum nitride coating, and an upper layer formed by an aluminum nitride coating having an hcp crystal system, the upper layer having a columnar crystal structure, the columnar crystals having an average transverse cross section diameter of 0.05-0.6 ?m, and a ratio of an X-ray diffraction peak value Ia(002) of (002) planes to an X-ray diffraction peak value Ia(100) of (100) planes in the upper layer meeting the relation of Ia(002)/Ia(100)?6.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: May 25, 2021
    Assignee: Moldino Tool Engineering, Ltd.
    Inventors: Yuuzoh Fukunaga, Masayuki Imai
  • Patent number: 10767258
    Abstract: A titanium aluminum nitride coating having a columnar crystal structure, which is formed on a substrate, comprises high-Al TiAlN having an fcc structure, which has a composition represented by (Tix1, Aly1)N, wherein x1 and y1 are numbers meeting x1=0.005-0.1, and y1=0.995-0.9 by atomic ratio, and network-like, high-Ti TiAlN having an fcc structure, which has a composition represented by (Tix2, Aly2)N, wherein x2 and y2 are numbers meeting x2=0.5-0.9, and y2=0.5-0.1 by atomic ratio; the high-Al TiAlN being surrounded by the network-like, high-Ti TiAlN.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: September 8, 2020
    Assignee: MITSUBISHI HITACHI TOOL ENGINEERING, LTD.
    Inventors: Yuuzoh Fukunaga, Masayuki Imai
  • Publication number: 20190177839
    Abstract: A hard coating comprising a lower layer formed by an fcc-based titanium aluminum nitride coating, and an upper layer formed by an aluminum nitride coating having an hcp crystal system, the upper layer having a columnar crystal structure, the columnar crystals having an average transverse cross section diameter of 0.05-0.6 ?m, and a ratio of an X-ray diffraction peak value Ia(002) of (002) planes to an X-ray diffraction peak value Ia(100) of (100) planes in the upper layer meeting the relation of Ia(002)/Ia(100)?6.
    Type: Application
    Filed: June 30, 2017
    Publication date: June 13, 2019
    Applicant: Mitsubishi Hitachi Tool Engineering, Ltd.
    Inventors: Yuuzoh Fukunaga, Masayuki Imai
  • Publication number: 20180305811
    Abstract: A titanium aluminum nitride coating having a columnar crystal structure, which is formed on a substrate, comprises high-Al TiAlN having an fcc structure, which has a composition represented by (Tix1, Aly1)N, wherein x1 and y1 are numbers meeting x1=0.005-0.1, and y1=0.995-0.9 by atomic ratio, and network-like, high-Ti TiAlN having an fcc structure, which has a composition represented by (Tix2, Aly2)N, wherein x2 and y2 are numbers meeting x2=0.5-0.9, and y2=0.5-0.1 by atomic ratio; the high-Al TiAlN being surrounded by the network-like, high-Ti TiAlN.
    Type: Application
    Filed: November 18, 2016
    Publication date: October 25, 2018
    Inventors: Yuuzoh Fukunaga, Masayuki Imai
  • Patent number: 8956951
    Abstract: A method for manufacturing an SOI wafer includes performing a flattening heat treatment on an SOI wafer under an atmosphere containing an argon gas, in which conditions of SOI wafer preparation are set so that a thickness of an SOI layer of the SOI wafer to be subjected to the flattening heat treatment is 1.4 or more times thicker than that of a BOX layer, and the thickness of the SOI layer is reduced to less than a thickness 1.4 times the thickness of the BOX layer by performing a sacrificial oxidation treatment on the SOI layer of the SOI wafer after the flattening heat treatment.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: February 17, 2015
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Isao Yokokawa, Masahiro Kato, Masayuki Imai
  • Publication number: 20120135584
    Abstract: A method for manufacturing an SOI wafer includes performing a flattening heat treatment on an SOI wafer under an atmosphere containing an argon gas, in which conditions of SOI wafer preparation are set so that a thickness of an SOI layer of the SOI wafer to be subjected to the flattening heat treatment is 1.4 or more times thicker than that of a BOX layer, and the thickness of the SOI layer is reduced to less than a thickness 1.4 times the thickness of the BOX layer by performing a sacrificial oxidation treatment on the SOI layer of the SOI wafer after the flattening heat treatment.
    Type: Application
    Filed: September 1, 2010
    Publication date: May 31, 2012
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Isao Yokokawa, Masahiro Kato, Masayuki Imai
  • Patent number: 8057417
    Abstract: A lower back supporter including a pair of flat anchor parts that come into contact with the lower back of a wearer with a specified space in between, a pair of anchor belts that wrap around the abdomen with the end portions connected to each other, a first and second support belt that cross over each other on the back, and a connecting belt that connects the anchor parts. The inner side surface of the anchor part comprising a non-slip material that closely contacts the skin of the wearer, and the outer side surface comprising a material that fastens to surface fasteners. After the anchor belts are put on, operation belts connected to the first and second support belts are pulled, the surface fasteners are fastened to the outer side surfaces of the anchor parts, applying tensile force between the anchor parts in closely contact to the lower back.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: November 15, 2011
    Assignees: Daiya Industry Co., Ltd.
    Inventor: Masayuki Imai
  • Patent number: 7902042
    Abstract: A method of manufacturing an SOI wafer includes a bonding step, a thinning and a bonding annealing step. Assuming refractive index n1 of SiO2 as 1.5, refractive index n2 of Si as 3.5, and optical thickness tOP of the silicon oxide film 2 and the SOI layer 15 in the infrared wavelength region as tOP=n1×t1+n2×t2, the thickness t1 of the silicon oxide film 2 and thickness t2 of the SOI layer so as to satisfy a relation of 0.1?<tOP<2?, and so as to make (t1×n1)/(t2×n2) fall within 0.2 to 3. By nuclei killer annealing carried out before the bonding annealing, density of formation of oxygen precipitate in the base wafer after the bonding annealing is adjusted to less than 1×109/cm3. This configuration successfully provides a method of manufacturing the SOI wafer having the thin silicon oxide film and the SOI layer, and being less likely to cause warping.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: March 8, 2011
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Hiroji Aga, Norihiro Kobayashi, Masayuki Imai, Tatsuo Enomoto, Hiroshi Takeno
  • Publication number: 20100228170
    Abstract: A lower back supporter including a pair of flat anchor parts that come into contact with the lower back of a wearer with a specified space in between, a pair of anchor belts that wrap around the abdomen with the end portions connected to each other, a first and second support belt that cross over each other on the back, and a connecting belt that connects the anchor parts. The inner side surface of the anchor part comprising a non-slip material that closely contacts the skin of the wearer, and the outer side surface comprising a material that fastens to surface fasteners. After the anchor belts are put on, operation belts connected to the first and second support belts are pulled, the surface fasteners are fastened to the outer side surfaces of the anchor parts, applying tensile force between the anchor parts in closely contact to the lower back.
    Type: Application
    Filed: March 9, 2009
    Publication date: September 9, 2010
    Inventor: Masayuki Imai
  • Patent number: 7735391
    Abstract: To provide a steering device for tilt and telescopic adjustments in which the locked condition can be made stronger, and when unlocked, tilt and telescopic adjustment can be smoothly carried out. A steering device, comprising: a fixed bracket having fixed side parts on both sides in the width direction; a movable bracket arranged between the fixed side parts; a friction plate fixed and oppositely arranged with a suitable gap with respect to at least one of the two fixed side parts of the fixed bracket; and a friction washer that is inserted between the fixed side part and the friction plate. A lock bolt passes through for connecting the fixed bracket, the movable bracket, the friction plate, and the friction washer to be freely locked and unlocked.
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: June 15, 2010
    Assignee: Yamada Manufacturing Co., Ltd.
    Inventors: Toshihito Osawa, Masayuki Imai
  • Publication number: 20090205348
    Abstract: There is provided a brazing method which makes it possible to rationally perform not only the brazing between a metal member such as a stator made of a magnetic material and a metal member such as a guide pipe made of a non-magnetic material but also the magnetic annealing of these metal members. By making use of a brazing material (90) which can be fused at a lower temperature than a magnetic annealing temperature of metal member (33), the metal member such as a stator made of a magnetic material and the metal member (35) such as a guide pipe made of a non-magnetic material are heated to a predetermined temperature in a furnace to perform the magnetic annealing of the metal member (33) concurrent with the brazing of these metal members.
    Type: Application
    Filed: April 24, 2009
    Publication date: August 20, 2009
    Inventors: Yoshiyuki Kume, Masayuki Imai, Tatsuya Kondo, Toru Watanuki
  • Patent number: 7393207
    Abstract: The present invention provides a wafer support tool for heat treatment easy in working and capable of realizing reduction in cost without generating damages or slip dislocations that would be otherwise caused by high temperature heat treatment and a heat treatment apparatus. The present invention is directed to a wafer support tool for heat treatment comprising: a plurality of wafer support members for supporting a wafer to be heat treated; and a support member holder for holding the wafer support members, wherein the wafer support members each has a contact portion with the wafer, at least one of the contact portions being movable relative to the support member holder.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: July 1, 2008
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Masayuki Imai
  • Publication number: 20080128851
    Abstract: A method of manufacturing an SOI wafer includes a bonding step, a thinning and a bonding annealing step. Assuming refractive index n1 of SiO2 as 1.5, refractive index n2 of Si as 3.5, and optical thickness tOP of the silicon oxide film 2 and the SOI layer 15 in the infrared wavelength region as tOP=n1×t1+n2×t2, the thickness t1 of the silicon oxide film 2 and thickness t2 of the SOI layer so as to satisfy a relation of 0.1?<tOP<2?, and so as to make (t1×n1)/(t2×n2) fall within 0.2 to 3. By nuclei killer annealing carried out before the bonding annealing, density of formation of oxygen precipitate in the base wafer after the bonding annealing is adjusted to less than 1×109/cm3. This configuration successfully provides a method of manufacturing the SOI wafer having the thin silicon oxide film and the SOI layer, and being less likely to cause warping.
    Type: Application
    Filed: September 9, 2005
    Publication date: June 5, 2008
    Applicant: Shin-Etsu Handotai Co., Ltd.
    Inventors: Hiroji Aga, Norihiro Kobayashi, Masayuki Imai, Tatsuo Enomoto, Hiroshi Takeno
  • Publication number: 20070006806
    Abstract: The present invention provides a wafer support tool for heat treatment easy in working and capable of realizing reduction in cost without generating damages or slip dislocations that would be otherwise caused by high temperature heat treatment and a heat treatment apparatus. The present invention is directed to a wafer support tool for heat treatment comprising: a plurality of wafer support members for supporting a wafer to be heat treated; and a support member holder for holding the wafer support members, wherein the wafer support members each has a contact portion with the wafer, at least one of the contact portions being movable relative to the support member holder.
    Type: Application
    Filed: March 22, 2004
    Publication date: January 11, 2007
    Inventor: Masayuki Imai
  • Publication number: 20060243084
    Abstract: To provide a steering device for tilt and telescopic adjustments in which the locked condition can be made stronger, and when unlocked, tilt and telescopic adjustment can be smoothly carried out. A steering device, comprising: a fixed bracket having fixed side parts on both sides in the width direction; a movable bracket arranged between the fixed side parts; a friction plate fixed and oppositely arranged with a suitable gap with respect to at least one of the two fixed side parts of the fixed bracket; and a friction washer that is inserted between the fixed side part and the friction plate. A lock bolt passes through for connecting the fixed bracket, the movable bracket, the friction plate, and the friction washer to be freely locked and unlocked.
    Type: Application
    Filed: April 4, 2006
    Publication date: November 2, 2006
    Applicant: YAMADA MANUFACTURING CO., LTD.
    Inventors: Toshihito Osawa, Masayuki Imai
  • Publication number: 20060193733
    Abstract: There is provided a brazing method which makes it possible to rationally perform not only the brazing between a metal member such as a stator made of a magnetic material and a metal member such as a guide pipe made of a non-magnetic material but also the magnetic annealing of these metal members. By making use of a brazing material (90) which can be fused at a lower temperature than a magnetic annealing temperature of metal member (33), the metal member such as a stator made of a magnetic material and the metal member (35) such as a guide pipe made of a non-magnetic material are heated to a predetermined temperature in a furnace to perform the magnetic annealing of the metal member (33) concurrent with the brazing of these metal members.
    Type: Application
    Filed: February 22, 2006
    Publication date: August 31, 2006
    Applicant: Fujikoki Corporation
    Inventors: Yoshiyuki Kume, Masayuki Imai, Tatsuya Kondo, Toru Watanuki
  • Patent number: D558794
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: January 1, 2008
    Assignee: Fujikoki Corporation
    Inventors: Tadashi Kabayama, Masayuki Imai