Abstract: A liquid crystal panel (display panel) 11 includes a display area AA configured to display images, a non-display area NAA outside the display area AA, a light blocking layer (a light blocking portion) 11i disposed at least in the non-display area NAA and configured to block light, a signal line connection line (a narrow line portion) 29 where lines are arranged at intervals in the non-display area NAA, and a common electrode connection line portion (a wide line portion) 30 disposed in the non-display area and having a line width greater than that of the signal line connection line 29 and including empty portions 34.

Abstract: A liquid crystal panel (display panel) 11 includes a display area AA configured to display images, a non-display area NAA outside the display area AA, a light blocking layer (a light blocking portion) 11i disposed at least in the non-display area NAA and configured to block light, a signal line connection line (a narrow line portion) 29 where lines are arranged at intervals in the non-display area NAA, and a common electrode connection line portion (a wide line portion) 30 disposed in the non-display area and having a line width greater than that of the signal line connection line 29 and including empty portions 34.

Abstract: A liquid crystal panel (display panel) 11 includes a display area AA configured to display images, a non-display area NAA outside the display area AA, a light blocking layer (a light blocking portion) 11i disposed at least in the non-display area NAA and configured to block light, a signal line connection line (a narrow line portion) 29 where lines are arranged at intervals in the non-display area NAA, and a common electrode connection line portion (a wide line portion) 30 disposed in the non-display area and having a line width greater than that of the signal line connection line 29 and including empty portions 34.

Abstract: A liquid crystal panel (display panel) 11 includes a display area AA configured to display images, a non-display area NAA outside the display area AA, a light blocking layer (a light blocking portion) 11i disposed at least in the non-display area NAA and configured to block light, a signal line connection line (a narrow line portion) 29 where lines are arranged at intervals in the non-display area NAA, and a common electrode connection line portion (a wide line portion) 30 disposed in the non-display area and having a line width greater than that of the signal line connection line 29 and including empty portions 34.

Abstract: A liquid crystal panel (display panel) 11 includes a display area AA configured to display images, a non-display area NAA outside the display area AA, a light blocking layer (a light blocking portion) 11i disposed at least in the non-display area NAA and configured to block light, a signal line connection line (a narrow line portion) 29 where lines are arranged at intervals in the non-display area NAA, and a common electrode connection line portion (a wide line portion) 30 disposed in the non-display area and having a line width greater than that of the signal line connection line 29 and including empty portions 34.

Abstract: A silicone resin composition useful for producing a cured product which shows high thermal shock resistance is provided. The composition contains a silicone resin containing silicon atoms selected from A1 silicon atoms and A2 silicon atoms, and A3 silicon atoms, in which the ratio of the content of the A3 silicon atoms to the total content of the A1 silicon atoms, the A2 silicon atoms, and the A3 silicon atoms is 50 mol % or more and 99 mol % or less. Side chains bonded to the silicon atoms include an alkyl group having 1 to 3 carbons and an alkoxy group having 1 or 2 carbons, and the molar ratio of alkoxy groups of alkyl groups is 5 or more to 100.

Abstract: A liquid crystal panel (display panel) 11 includes a display area AA configured to display images, a non-display area NAA outside the display area AA, a light blocking layer (a light blocking portion) 11i disposed at least in the non-display area NAA and configured to block light, a signal line connection line (a narrow line portion) 29 where lines are arranged at intervals in the non-display area NAA, and a common electrode connection line portion (a wide line portion) 30 disposed in the non-display area and having a line width greater than that of the signal line connection line 29 and including empty portions 34.

Abstract: A liquid crystal panel (display panel) 11 includes a display area AA configured to display images, a non-display area NAA outside the display area AA, a light blocking layer (a light blocking portion) 11i disposed at least in the non-display area NAA and configured to block light, a signal line connection line (a narrow line portion) 29 where lines are arranged at intervals in the non-display area NAA, and a common electrode connection line portion (a wide line portion) 30 disposed in the non-display area and having a line width greater than that of the signal line connection line 29 and including empty portions 34.

Abstract: A silicone resin composition for production of a cured product having high UV stability is provided. The composition contains at least one silicone resin satisfying the following requirements (i) to (iii): (i) silicon atoms contained therein are essentially A1, A2, and A3 silicon atoms, and a ratio of the content of the A3 silicon atoms to the total content of the A1, A2, and A3 silicon atoms is 50 mol % or more and 99 mol % or less; (ii) side chains bonded to the silicon atoms are alkyl groups having 1 to 3 carbons, alkoxy groups having 1 or 2 carbons, or hydroxyl groups, a molar ratio of the alkoxy groups is less than 5 to 100 of the alkyl groups, and a molar ratio of the hydroxyl groups is 10 or more to 100 of the alkyl groups; and (iii) a metallic catalyst is not substantially contained.

Abstract: A composition is provided which is useful for the production of a cured product which is excellent in heat resistance and light permeability. The composition includes a polysiloxane, at least one alkoxysilane partial condensate having no hydroxyl group selected from the group consisting of a T-type alkoxysilane partial condensate having no hydroxyl group and a Q-type alkoxysilane partial condensate having no hydroxyl group, and a phosphoric acid-based catalyst. The polysiloxane is represented by the following formula (1): In formula (1), m represents an integer of 5 to 3000 and R1 represents an alkyl group. The plurality of R1 may be the same or different.

Abstract: A walking training system includes a detection unit that detects whether a leg portion of a walking trainee on which a walking assistance apparatus has been mounted has performed a walking operation or a stepping operation on a belt of a treadmill on which the walking trainee performs walking training, and a controller maintains an operation prohibition state in which a rotational operation of the belt is not started until the time that the detection unit detects the walking operation or the stepping operation a predetermined number of times and cancels the operation prohibition state after the detection unit detects the walking operation or the stepping operation the predetermined number of times.

Abstract: A method for producing a semiconductor light-emitting device containing a substrate, an element and an encapsulating material as constituent members is provided. The method involves providing the substrate with the element; potting at least one encapsulating material (i) before curing selected from addition polymerization-type encapsulating materials and polycondensation-type encapsulating materials onto the substrate to cover the element; curing the potted encapsulating material (i); potting a polycondensation-type encapsulating material (ii) before curing onto the encapsulating material (i) after curing which covers the element, and then curing the potted polycondensation-type encapsulating material (ii), thereby laminating the encapsulating material. A semiconductor light-emitting device produced by the method is also provided, in which two or more layers each containing the encapsulating material are laminated.

Abstract: A silicone-based encapsulating material composition contains a bifunctional thermosetting silicone resin (A), a multifunctional thermosetting silicone resin having a hydroxyl group (B), and a curing catalyst (C). In the composition, a weight-average molecular weight of the component (A) is 300 to 4,500, a mass ratio of the component (B) relative to a total mass of the component (A) and the component (B) is 0.5% by mass or more and less than 100% by mass, an average functional number of the component (B) is 2.5 to 3.5, and the repeating units constituting the component (B) which are trifunctional account for 50% by mass or more relative to a total mass of the component (B). A visible light transmittance measured at an optical path length of 1 cm and a wavelength of 600 nm is 70% or higher.

Abstract: A method for producing a semiconductor light-emitting device having a substrate, an element and an encapsulating material as constituent members, includes: a first step of providing the substrate with the element; a second step of potting an uncured encapsulating material onto the substrate to cover the element; and a third step of curing the potted encapsulating material in such a manner that all of the following formulae (1), (2) and (3) are satisfied when the absorbances which a cured encapsulating material having a thickness of t [nm] has at wavelengths of 380 nm, 316 nm and 260 nm are represented by AbsA(t), AbsB(t) and AbsC(t), respectively, and the light transmittance thereof at 380 nm is represented by T(t): (1) T(1.7)?90%; (2) AbsB(t)?AbsA(t)<0.011t; and (3) AbsC(t)?AbsA(t)<0.125t.

Abstract: A method for producing a semiconductor light-emitting device involves applying a silicone resin composition to a surface of a semiconductor light-emitting element and forming an encapsulating portion covering the surface of the light-emitting element by heat curing the applied resin composition. The silicone resin composition contains at least 60% by mass of a silicone resin in which the constituent silicon atoms are substantially only silicon atoms to which three oxygen atoms are bonded. The heat curing satisfies 5<a?b<20, in which “a cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 1,000 to 1,050 cm?1 of the silicone resin before the heat curing and “b cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 950 to 1,050 cm?1 of the silicone resin composition after the heat curing.

Abstract: A silicone resin liquid composition containing a silicone resin is provided. The 29Si-NMR measurement of the resin exhibits a ratio of the area of signals assigned to A3 silicon atoms to the area of all signals derived from silicon atoms of 51% to 69%. An A3 silicon atom represents a silicon atom to which are bonded three oxygen atoms bonded to another silicon atom.

Abstract: A phosphoric acid-based catalyst is used as a cure accelerator for a polysilsesquioxane-based UV-LED-encapsulating material, a cured product of which has a light transmittance of 65% or more at 260 nm. A polysilsesquioxane-based UV-LED-encapsulating material composition contains a polysilsesquioxane-based UV-LED-encapsulating material and a phosphoric acid-based catalyst.

Abstract: A gait training apparatus includes: a walking assistance device that is attached to a leg portion of a user and assists walking of the user; a peripheral device used for gait training of the user; a control unit that controls the walking assistance device and the peripheral device; and a switching unit that switches the control unit between a cooperative control mode for performing a cooperative control of the walking assistance device and the peripheral device based on information output from the walking assistance device, and an operation mode for controlling the peripheral device based on set operation information. When the control unit is switched to the operation mode by the switching unit, the control unit executes the control of the peripheral device even when the control unit is in a non-connected state with the walking assistance device.

Abstract: A method for producing a semiconductor light-emitting device involves applying a silicone resin composition to a surface of a semiconductor light-emitting element and forming an encapsulating portion covering the surface of the light-emitting element by heat curing the applied resin composition. The silicone resin composition contains at least 60% by mass of a silicone resin in which the constituent silicon atoms are substantially only silicon atoms to which three oxygen atoms are bonded. The heat curing satisfies 5<a-b<20, in which “a cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 1,000 to 1,050 cm?1 of the silicone resin before the heat curing and “b cm?1” is an infrared absorption spectrum peak position assigned to Si—O—Si linkages in a range from 950 to 1,050 cm?1 of the silicone resin composition after the heat curing.

Abstract: A silicone-based encapsulating material composition contains a bifunctional the silicone resin (A), a multifunctional thermosetting silicone resin having a hydroxyl group (B), and a curing catalyst (C). In the composition, a weight-average molecular weight of the component (A) is 300 to 4,500, a mass ratio of the component (B) relative to a total mass of the component (A) and the component (B) is 0.5% by mass or more and less than 100% by mass, an average functional number of the component (B) is 2.5 to 3.5, and the repeating units constituting the component (B) which are trifunctional account for 50% by mass or more relative to a total mass of the component (B). A visible light transmittance measured at an optical path length of 1 cm and a wavelength of 600 nm is 70% or higher.