Abstract: There is provided a solid-state imaging device capable of preventing the sensitivity difference from being generated between the pixels. The fixed imaging device of the present disclosure includes: a first pixel; and a second pixel located in a first direction of the first pixel, in which each of the first and second pixels includes a first transistor and a second transistor, and the first and second transistors in the second pixel are disposed periodically in the first direction with respect to the first and second transistors in the first pixel.

Abstract: The present technology relates to a solid-state imaging device capable of increasing sensitivity while reducing color mixing degradation. A solid-state imaging device includes: a substrate; a plurality of photoelectric conversion regions formed in the substrate; a trench that is formed between the photoelectric conversion regions, and penetrates the substrate; and a recessed region that includes a plurality of concave portions, and is provided above the photoelectric conversion regions and on the side of the light receiving surface of the substrate, in which the substrate includes a III-V semiconductor or polycrystalline SiXGe (1-x) (x=0 to 1). The recessed region is also provided below the photoelectric conversion regions and on the side of a surface of the substrate, the surface facing the light receiving surface. The present technology can be applied to back-illuminated solid-state imaging devices and the like, for example.

Abstract: A resin powder includes resin particles each binding a first quantum dot phosphor.

Abstract: A light-emitting apparatus includes: a base; a wiring pattern disposed on a major surface of the base; a light-emitting element mounted on the major surface of the base; a metal wire that electrically connects the light-emitting element and the wiring pattern; a light-transmissive film that covers the metal wire, at least a portion of the wiring pattern, and at least a portion of the light-emitting element; and a sealant that covers the light-transmissive film. The light-transmissive film includes a wall portion that is located between the metal wire and the base, and that extends from the major surface of the base to the metal wire.

Abstract: A light-emitting device includes a substrate and a plurality of light-emitting elements disposed above the substrate. In the plurality of light-emitting elements, a first light-emitting element and a second light-emitting element different in a rate of decrease in light output along with a temperature increase are included. The plurality of light-emitting elements include: a first serial element group including some light-emitting elements connected in series among the plurality of light-emitting elements; and a second serial element group connected in parallel with the first serial element group and including some light-emitting elements connected in series among the plurality of light-emitting elements. A ratio between a total number of first light-emitting elements and a total number of second light-emitting elements is different between the first serial element group and the second serial element group.

Abstract: A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.

Abstract: A lighting apparatus includes an LED chip that emits primary light, and phosphor particles that emit secondary light by being excited with the primary light. The lighting apparatus emits light including the primary light and the secondary light. The light has an emission spectrum having a first peak in a wavelength ranging from 420 nm to 460 nm, a second peak in the wavelength ranging from 530 nm to 580 nm, a third peak in the wavelength ranging from 605 nm to 655 nm, a first trough in the wavelength ranging from 440 nm to 480 nm, and a second trough in the wavelength ranging from 555 nm to 605 nm.

Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.

Abstract: A light-emitting apparatus includes a first relay line and a second relay line. The first and second relay lines are disposed between a first region and a second region of a substrate. Further, the first and second relay lines extend at least partially parallel to each other in a second direction that crosses a first direction in which the first region and the second region are aligned. The first relay line electrically connects a first light-emitting element group disposed in the first region and a third light-emitting element group disposed in the second region. The second relay line electrically connects a second light-emitting element group disposed in the first region and a fourth light-emitting element group disposed in the second region.

Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.

Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.

Abstract: A mounting substrate includes: a substrate; a first terminal, a fifth terminal, and a sixth terminal which are disposed in a first region; a second terminal disposed in a second region; a third terminal and a seventh terminal which are disposed in a third region; and a fourth terminal disposed in a fourth region. The mounting substrate includes: a first connecting line which electrically connects the fifth terminal and the second terminal; a second connecting line which electrically connects the sixth terminal and the third terminal; and a third connecting line which electrically connects the seventh terminal and the fourth terminal.

Abstract: A mounting substrate includes: a substrate; a first terminal, a fifth terminal, and a sixth terminal which are disposed in a first region; a second terminal disposed in a second region; a third terminal and a seventh terminal which are disposed in a third region; and a fourth terminal disposed in a fourth region. The mounting substrate includes: a first connecting line which electrically connects the fifth terminal and the second terminal; a second connecting line which electrically connects the sixth terminal and the third terminal; and a third connecting line which electrically connects the seventh terminal and the fourth terminal.

Abstract: A method of manufacturing a light-emitting apparatus includes mounting a first light-emitting element and a second light-emitting element on a substrate. A sealing layer is formed above the first light-emitting element and the second light-emitting element for sealing the first light-emitting element and the second light-emitting element. A first phosphor layer is applied above a first portion of the sealing layer, in which the first phosphor layer includes at least one first phosphor. A second phosphor layer is applied above a second portion of the sealing layer, in which the second phosphor layer includes at least one second phosphor.

Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.

Abstract: Light emitting apparatus including: substrate; LED chips on substrate; sealing member sealing LED chips; buffer layer on substrate; and dam material on the top surface of buffer layer, for holding back sealing member, wherein the adhesive strength of buffer layer to substrate and the adhesive strength of dam material to buffer layer are higher than the adhesive strength of dam material to substrate.

Abstract: A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.

Abstract: A light-emitting module is provided. The light-emitting module includes a substrate, a light-emitting element mounted on the substrate, and a sealant that seals the light-emitting element. The sealant includes a resin material containing a wavelength converter. A cross section of the sealant taken through the light-emitting element satisfies HMAX/W?0.3, where W is a width of a base of the sealant and HMAX is a maximum height of the sealant.

Abstract: A method of manufacturing a light-emitting apparatus includes mounting a first light-emitting element and a second light-emitting element on a substrate. A sealing layer is formed above the first light-emitting element and the second light-emitting element for sealing the first light-emitting element and the second light-emitting element. A first phosphor layer is applied above a first portion of the sealing layer, in which the first phosphor layer includes at least one first phosphor. A second phosphor layer is applied above a second portion of the sealing layer, in which the second phosphor layer includes at least one second phosphor.

Abstract: A light-emitting apparatus includes a first relay line and a second relay line. The first and second relay lines are disposed between a first region and a second region of a substrate. Further, the first and second relay lines extend at least partially parallel to each other in a second direction that crosses a first direction in which the first region and the second region are aligned. The first relay line electrically connects a first light-emitting element group disposed in the first region and a third light-emitting element group disposed in the second region. The second relay line electrically connects a second light-emitting element group disposed in the first region and a fourth light-emitting element group disposed in the second region.