Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.

Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes: a substrate; an LED chip on the substrate; and a sealant which seals the LED chip. The sealant includes at least 0.05 wt % oxide of a transition metal as an additive for inhibiting deterioration of a base material of the sealant. Additionally or alternatively, the sealant includes at least one of a metal salt of a transition metal and an organic complex of a transition metal, as the additive.

Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.

Abstract: A light-emitting apparatus includes: a substrate; a plurality of LED chips disposed on the substrate and including a plurality of blue LED chips which emit blue light and a plurality of red LED chips which emit red light; and a sealing member that contains a yellow phosphor and seals the plurality of LED chips together. The plurality of LED chips include: a first LED chip group made up of the blue LED chips; a second LED chip group made up of the red LED chips and disposed around the first LED chip group in an annular shape centered on an optical axis; and a third LED chip group made up of the blue LED chips and disposed around the second LED chip group in an annular shape centered on the optical axis.

Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.

Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.

Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.

Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.

Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.

Abstract: Each of a plurality of semiconductor light-emitting element has, on an upper surface thereof that has a quadrilateral shape, a pair of connecting portions having different polarities from each other. The pair of connecting portions are aligned on a diagonal of the quadrilateral shape. The diagonal intersects a row direction along which the semiconductor light-emitting elements within a row are arranged. Connecting portions having identical polarity are positioned on an imaginary line parallel to the row direction. Metal wires intersect two sides extending from a corner, on the diagonal, of the upper surface of each of the semiconductor light-emitting elements when viewed from a direction perpendicular to a mounting surface of a substrate for mounting the semiconductor light-emitting elements.

Abstract: A light-emitting apparatus includes: a substrate; a plurality of LED chips disposed on the substrate and including a plurality of blue LED chips which emit blue light and a plurality of red LED chips which emit red light; and a sealing member that contains a yellow phosphor and seals the plurality of LED chips together. The plurality of LED chips include: a first LED chip group made up of the blue LED chips; a second LED chip group made up of the red LED chips and disposed around the first LED chip group in an annular shape centered on an optical axis; and a third LED chip group made up of the blue LED chips and disposed around the second LED chip group in an annular shape centered on the optical axis.

Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.

Abstract: A light-emitting apparatus includes: a substrate; an LED chip disposed on the substrate; and a sealing member that contains a yellow phosphor and a cerium oxide, and seals the LED chip. An amount of the cerium oxide contained in the sealing member depends on a peak wavelength of a light emission spectrum of the LED chip, and when the peak wavelength of the light emission, spectrum of the LED chip is 470 nm or less, the amount of the cerium oxide contained in the sealing member is 0.100 wt % or less.

Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.

Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.

Abstract: A light-emitting module includes a substrate, and elongated light-emitting units arranged in rows on the substrate. Each light-emitting unit includes an element array of light-emitting elements arranged on the substrate and a sealing member sealing the element array. The sealing member contains a wavelength converting material. When the light-emitting units are viewed from a direction that is parallel to a surface on which the plurality of light-emitting units are arranged and coincides with a row direction being a direction along which the light-emitting units are arranged in rows, two of the light-emitting units are arranged such that portions of one of the two light-emitting units nearer to the center in the row direction are visible without being obstructed by the other light-emitting unit.

Abstract: A light emitting device includes: a substrate; a plurality of light emitting elements mounted in a light emitting area of the substrate, and an intermediate line for electrically connecting a plurality of light emitting elements in parallel or series selectively, the intermediate line being disposed in the light emitting area.

Abstract: A light-emitting device includes a substrate and a plurality of light-emitting elements disposed above the substrate. In the plurality of light-emitting elements, a first light-emitting element and a second light-emitting element different in a rate of decrease in light output along with a temperature increase are included. The plurality of light-emitting elements include: a first serial element group including some light-emitting elements connected in series among the plurality of light-emitting elements; and a second serial element group connected in parallel with the first serial element group and including some light-emitting elements connected in series among the plurality of light-emitting elements. A ratio between a total number of first light-emitting elements and a total number of second light-emitting elements is different between the first serial element group and the second serial element group.

Abstract: A lighting apparatus includes a substrate, a light-emitting element, and a sealing member. The light-emitting element emits light in a first wavelength range. The sealing member contains a material that converts the light in the first wavelength range to light in a second wavelength range different from the first wavelength range. The sealing member has a curved convex contour in at least one cross section that passes through the center of the light-emitting element and is perpendicular to a principal surface of the substrate. A curved line indicating a change in output angle that occurs upon a change in observation angle is approximated by a quadratic or trigonometric function that passes through the origin.

Abstract: In a mounting area, a plurality of light-emitting elements are two-dimensionally mounted, and light-emitting elements are connected in series in each of light-emitting element blocks. The light-emitting element blocks) are connected in parallel by wires. The light-emitting element blocks located in a middle portion each include only blue light-emitting elements. On the other hand, the light-emitting elements located above the light-emitting element blocks and the light-emitting element blocks located below the light-emitting element blocks include one or more light-emitting element blocks each including not only blue light-emitting elements but also one or more red light-emitting elements.