Abstract: A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.

Abstract: A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

Abstract: Provided is a tire that is lightweight and excellent in riding characteristics while suppressing an increase in cost. A plurality of belt layers 7 are superimposed in a radial direction. The belt layers 7 include a plurality of steel cords 10 arranged in parallel in a row and rubber 11. The steel cords 10 have a 1×4 structure in which four filaments 20 are twisted, and when a center-to-center distance between the steel cords 10 in at least two of the belt layers 7 adjacent in the radial direction is T, and an average diameter of virtual circumscribed circles of the steel cords 10 having the 1×4 structure is D, 1.25?T/D?2.25.

Abstract: An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

Abstract: An electronic apparatus includes a housing, a heating component arranged inside the housing, a plurality of heat sinks arranged inside the housing, a heat transport member coupled such that heat is transferred from the heating component to the heat sinks, air intake regions positioned in the housing, corresponding to the respective heat sinks, and arranged below and close to the respective heat sinks, and an air exhaust region positioned in the housing and arranged above the heat sinks.

Abstract: A tire having a rubber body in which a steel cord is embedded, wherein a layer composed of ZnxCoyO is formed at the interface between the steel cord and the rubber body and x+y is 5/6 or more and 1 or less.

Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.

Abstract: A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.

Abstract: There is provided a steel cord including a steel wire and a plating layer that covers the steel wire and has Cu, Zn, and Co, wherein Cu and Zn are alloyed and a region covered with Co and a region not covered with Co are mixed on the outermost surface of the plating layer.

Abstract: An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.

Abstract: A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port.

Abstract: A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube.

Abstract: An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

Abstract: A heat exchanger includes: a plurality of first heat radiation members, each of the plurality of first heat radiation members including a first refrigerant flow path through which a refrigerant flows; a plurality of second heat radiation members, each of the plurality of second heat radiation members including a second refrigerant flow path through which the refrigerant flows; and a fin attached between the plurality of second heat radiation members, wherein an interval between the plurality of first heat radiation members is smaller than an interval between the plurality of second heat radiation members.

Abstract: A board assembly including a cooling system includes: a wiring board; a first heat generating component mounted on a surface of the wiring board; a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough; a second heat generating component mounted on another surface of the wiring board; a second heat receiving portion mounted on the second heat generating component and configured to allow the coolant to pass therethrough; and a support post disposed through the wiring board so as to extend between the first heat receiving portion and the second heat receiving portion, the support post having a space through which the coolant flows from the first heat receiving portion to the second heat receiving portion or from the second heat receiving portion to the first heat receiving portion.

Abstract: A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.

Abstract: A cooling unit includes a tank having an inlet port and a discharge port for refrigerant, first and second radiators connected to the tank, the first and second radiators each having a flow path, an inlet chamber defined in the tank for supplying the refrigerant flowing therein from the inlet port to the first radiator, a discharge chamber defined in the tank for discharging the refrigerant cooled in the second radiator to the discharge port, and a reservoir in which bubbles generated in the refrigerant are collected, the reservoir being provided between the inlet chamber and the discharge chamber in the tank.

Abstract: An electronic device includes: a casing; a board disposed inside the casing and having a heating element mounted thereon; an opposing member disposed inside the casing and having an opposing face opposed to a face of the board on which the heating element is mounted; a heat sink formed by alternately laminating thermal diffusion sheets and adhesive layers each having an opening at a location corresponding to the heating element on the opposing face of the opposing member; and a press member configured to press the heating element against a region of the heat sink corresponding to the opening of the adhesive layer, thus joining the thermal diffusion sheets together at the location of the opening.

Abstract: A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.