Patents by Inventor Masumi Suzuki
Masumi Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170150648Abstract: A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port.Type: ApplicationFiled: February 3, 2017Publication date: May 25, 2017Inventors: Masumi SUZUKI, Michimasa AOKI, Jie WEI
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Patent number: 9661780Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.Type: GrantFiled: July 25, 2014Date of Patent: May 23, 2017Assignee: FUJITSU LIMITEDInventors: Michimasa Aoki, Masumi Suzuki, Jie Wei, Fumihiro Tawa, Kenji Sasabe
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Patent number: 9653380Abstract: A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.Type: GrantFiled: April 26, 2016Date of Patent: May 16, 2017Assignee: FUJITSU LIMITEDInventors: Makoto Suwada, Mitsutaka Yamada, Masumi Suzuki, Michimasa Aoki, Keizou Takemura, Shinichirou Okamoto, Kenji Katsumata, Jie Wei
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Patent number: 9600042Abstract: An electronic device includes: a heating element; a casing including a tightly sealed waterproof compartment where the heating element is disposed and a ventilation chamber being disposed adjacent to the waterproof compartment to allow outside air to flow; and a heat dissipation member provided at a side of the waterproof compartment of a partition wall partitioning the waterproof compartment and the ventilation chamber, wherein the heating element is disposed on the heat dissipation member and a thickness of the partition wall at a position where at least the heating element is disposed is thinner than that of other portions of the partition wall.Type: GrantFiled: December 3, 2014Date of Patent: March 21, 2017Assignee: FUJITSU LIMITEDInventors: Yosuke Tsunoda, Jie Wei, Masumi Suzuki
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Patent number: 9603285Abstract: A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port.Type: GrantFiled: July 30, 2013Date of Patent: March 21, 2017Assignee: FUJITSU LIMITEDInventors: Masumi Suzuki, Michimasa Aoki, Jie Wei
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Publication number: 20160374230Abstract: A cooling jacket includes: first and second pipe portions through which a coolant flows; and a main portion connected with side surfaces of the first and second pipe portions, defining, with a single member, a flow path through which the coolant flows, and cooling an object to be cooled.Type: ApplicationFiled: June 29, 2016Publication date: December 22, 2016Applicant: FUJITSU LIMITEDInventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Kenji Katsumata
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Publication number: 20160351471Abstract: A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.Type: ApplicationFiled: April 26, 2016Publication date: December 1, 2016Applicant: FUJITSU LIMITEDInventors: MAKOTO SUWADA, Mitsutaka YAMADA, Masumi SUZUKI, Michimasa AOKI, Keizou Takemura, Shinichirou OKAMOTO, Kenji Katsumata, JIE WEI
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Patent number: 9406586Abstract: A cooling jacket includes: first and second pipe portions through which a coolant flows; and a main portion connected with side surfaces of the first and second pipe portions, defining, with a single member, a flow path through which the coolant flows, and cooling an object to be cooled.Type: GrantFiled: March 28, 2011Date of Patent: August 2, 2016Assignee: FUJITSU LIMITEDInventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masaru Sugie, Shinichirou Kouno, Hiroshi Muto, Kenji Katsumata
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Publication number: 20160205809Abstract: A heat exchanger includes: a plurality of first heat radiation members, each of the plurality of first heat radiation members including a first refrigerant flow path through which a refrigerant flows; a plurality of second heat radiation members, each of the plurality of second heat radiation members including a second refrigerant flow path through which the refrigerant flows; and a fin attached between the plurality of second heat radiation members, wherein an interval between the plurality of first heat radiation members is smaller than an interval between the plurality of second heat radiation members.Type: ApplicationFiled: December 17, 2015Publication date: July 14, 2016Applicant: FUJITSU LIMITEDInventors: Michimasa AOKI, Masumi SUZUKI, JIE WEI
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Publication number: 20160183407Abstract: A board assembly including a cooling system includes: a wiring board; a first heat generating component mounted on a surface of the wiring board; a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough; a second heat generating component mounted on another surface of the wiring board; a second heat receiving portion mounted on the second heat generating component and configured to allow the coolant to pass therethrough; and a support post disposed through the wiring board so as to extend between the first heat receiving portion and the second heat receiving portion, the support post having a space through which the coolant flows from the first heat receiving portion to the second heat receiving portion or from the second heat receiving portion to the first heat receiving portion.Type: ApplicationFiled: October 1, 2015Publication date: June 23, 2016Inventors: Kenji Katsumata, Jie WEI, Masumi SUZUKI
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Publication number: 20160143128Abstract: An electronic device includes: a casing; a board disposed inside the casing and having a heating element mounted thereon; an opposing member disposed inside the casing and having an opposing face opposed to a face of the board on which the heating element is mounted; a heat sink formed by alternately laminating thermal diffusion sheets and adhesive layers each having an opening at a location corresponding to the heating element on the opposing face of the opposing member; and a press member configured to press the heating element against a region of the heat sink corresponding to the opening of the adhesive layer, thus joining the thermal diffusion sheets together at the location of the opening.Type: ApplicationFiled: August 28, 2015Publication date: May 19, 2016Inventors: Yosuke TSUNODA, JIE WEI, Masumi SUZUKI
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Patent number: 9313919Abstract: A radiator includes a header including a supply chamber for a coolant to cool an electronic part mounted on a circuit board and a discharge chamber partitioned from the supply chamber, and a plurality of tubes stacked in a heightwise direction of the header, one end of each of the plurality of tubes being connected to the supply chamber and the other end of each of the plurality of tubes being connected to the discharge chamber, and the coolant flowing from the one end to the other end. The plurality of tubes include a first tube at least including a lowermost tube, and a second tube provided over the first tube and having a surface area greater than that of the first tube.Type: GrantFiled: July 30, 2013Date of Patent: April 12, 2016Assignee: FUJITSU LIMITEDInventors: Michimasa Aoki, Masumi Suzuki, Jie Wei
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Patent number: 9271426Abstract: A radiator includes a header including a supply chamber for a coolant to cool an electronic part mounted on a circuit board and a discharge chamber partitioned from the supply chamber, and a plurality of tubes stacked in a heightwise direction of the header, one end of each of the plurality of tubes being connected to the supply chamber and the other end of each of the plurality of tubes being connected to the discharge chamber, and the coolant flowing from the one end to the other end. The plurality of tubes include a first tube at least including a lowermost tube, and a second tube provided over the first tube and having a surface area greater than that of the first tube.Type: GrantFiled: July 30, 2013Date of Patent: February 23, 2016Assignee: FUJITSU LIMITEDInventors: Michimasa Aoki, Masumi Suzuki, Jie Wei
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Patent number: 9223362Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.Type: GrantFiled: September 17, 2013Date of Patent: December 29, 2015Assignee: FUJITSU LIMITEDInventors: Masayuki Watanabe, Kenji Sasabe, Eiji Wajima, Masumi Suzuki, Michimasa Aoki
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Publication number: 20150351283Abstract: A heatsink includes, a fin base that receives heat from a heat generating part; a cover that cooperates with the fin base to form a flow path of coolant along which the coolant flows; a plurality of fins formed on the fin base and partitioning the flow path into a plurality of small flow paths; and an adjustment plate vertically disposed between the fin base and the cover, and perpendicularly disposed with respect to the plurality of fins, wherein the adjustment plate including different height potions.Type: ApplicationFiled: May 20, 2015Publication date: December 3, 2015Applicant: Fujitsu LimitedInventors: Mitsutaka Yamada, Shinichirou Okamoto, Masumi Suzuki, Jie Wei
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Patent number: 9134070Abstract: There is provided a radiator which includes a tank including first and second chambers that are separated from each other, the first and second chambers including first and second openings, respectively, a first tube including first and second ends, the first and second ends communicating with the first and second chambers, respectively, and a second tube being next to the first tube, the second tube including first and second ends communicating with the first and second chambers, respectively, wherein the first chamber includes first and second flow channels that communicate with the first opening, the first and second channels being split so as to sandwich at least part of the second chamber, and the first ends of the first and second tubes sandwich the second ends of the first and second tubes.Type: GrantFiled: February 1, 2013Date of Patent: September 15, 2015Assignee: FUJITSU LIMITEDInventors: Michimasa Aoki, Masumi Suzuki, Yosuke Tsunoda
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Patent number: 9101079Abstract: A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.Type: GrantFiled: August 16, 2013Date of Patent: August 4, 2015Assignee: FUJITSU LIMITEDInventors: Nobumitsu Aoki, Takeshi Nishiyama, Takashi Urai, Masumi Suzuki, Michimasa Aoki, Jie Wei, Fumihiro Tawa, Yoshinori Uzuka
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Publication number: 20150195952Abstract: An electronic device includes: a heating element; a casing including a tightly sealed waterproof compartment where the heating element is disposed and a ventilation chamber being disposed adjacent to the waterproof compartment to allow outside air to flow; and a heat dissipation member provided at a side of the waterproof compartment of a partition wall partitioning the waterproof compartment and the ventilation chamber, wherein the heating element is disposed on the heat dissipation member and a thickness of the partition wall at a position where at least the heating element is disposed is thinner than that of other portions of the partition wall.Type: ApplicationFiled: December 3, 2014Publication date: July 9, 2015Inventors: Yosuke TSUNODA, Jie Wei, Masumi Suzuki
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Publication number: 20150062822Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.Type: ApplicationFiled: July 25, 2014Publication date: March 5, 2015Applicant: FUJITSU LIMITEDInventors: Michimasa AOKI, Masumi Suzuki, Jie Wei, Fumihiro Tawa, Kenji Sasabe
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Patent number: D742337Type: GrantFiled: February 6, 2014Date of Patent: November 3, 2015Assignee: FUJITSU LIMITEDInventors: Masayuki Watanabe, Hideki Kimura, Kenji Sasabe, Fumihiro Tawa, Takeshi Nishiyama, Jie Wei, Masumi Suzuki, Michimasa Aoki