Patents by Inventor Masumi Suzuki

Masumi Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100139891
    Abstract: A radiator for dissipating heat by liquid coolant flowing includes a plate including at least two flat sections parallel to each other, a flection connecting the flat sections, a passage configured within the two flat sections and the flection to allow the liquid coolant to flow from a first opening to a second opening provided at each end of the two flat sections, the two flat sections opposed to each other, and the plate including a plurality of fins; an inlet tube having an opening formed so as to fit the first opening and an end opening for allowing the liquid coolant to flow in the passage; and an outlet tube having an opening so as to fit of the second opening and an end opening for allowing the liquid coolant to flow out the passage. The outlet tube is disposed in parallel with the inlet tube.
    Type: Application
    Filed: October 30, 2009
    Publication date: June 10, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda
  • Publication number: 20100142145
    Abstract: A cooling jacket includes: a flow channel member through which a cooling medium flows, at least a part of which is in contact with an object to be cooled, and which includes a region having a channel cross-sectional area larger than that of any other region; and a projection portion which is provided at a downstream side of the region where the channel cross-sectional area is large.
    Type: Application
    Filed: November 17, 2009
    Publication date: June 10, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda
  • Publication number: 20100142148
    Abstract: A liquid cooling unit includes a pump body. A nipple is formed in the pump body. The nipple defines an outflow passage for coolant. An elastic tube has the tip end receiving insertion of the nipple so that the elastic tube is coupled to the nipple. A fixation member defines a groove supporting the nipple inside the elastic tube over a first predetermined length from the tip end of the nipple. The groove receives the elastic tube alone ahead of the tip end of the nipple over a second predetermined length from the tip end of the nipple.
    Type: Application
    Filed: February 2, 2010
    Publication date: June 10, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Kazuhiro Nitta, Masumi Suzuki
  • Patent number: 7721789
    Abstract: To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate; a heat radiator having a configuration of a plurality of horizontally oriented vertically spaced heat radiation plates; and a heat pipe H having a generally U-shaped or V-shaped profile, the middle portion of which is secured to the heat receiving plate; and wherein each end of the heat pipe H passes through the heat radiation plates.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: May 25, 2010
    Assignee: Fujitsu Limited
    Inventors: Akira Ueda, Masumi Suzuki
  • Patent number: 7710722
    Abstract: A heat exchanger allows establishment of a flat space between first and second plates. The heat exchanger is inserted in a closed circulating loop for coolant. The flat space is allowed to have a cross-section larger than that of a cylindrical duct of the closed circulating loop. The flat space serves as a flow passage. An increased cross-section enables a reduction in the flow speed of the coolant. The coolant is allowed to slowly flow through the flat space. The coolant thus contacts with the first and second plates for a longer time. The heat of the coolant is sufficiently transferred to the first and second plates. The efficiency of heat radiation is enhanced.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: May 4, 2010
    Assignee: Fujitsu Limited
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Patent number: 7701715
    Abstract: An electronic apparatus includes an enclosure enclosing a liquid cooling unit. The liquid cooling unit includes a heat receiver received on an electronic component. Heat of the electronic component is transferred to the heat receiver. The heat of the heat receiver is transferred to the coolant flowing through the flow passage of the heat receiver. The electronic component gets cooled. The coolant flows into a tank in the liquid cooling unit. The tank stores the coolant and air. The air inlet is formed in the enclosure. Fresh air is introduced into the enclosure through the air inlet. Since the tank is opposed to the air inlet, the tank is exposed to the fresh air. The heat of the coolant in the tank is thus radiated into the air. The coolant gets cooled in an efficient manner. The efficiency of heat radiation is enhanced in this manner.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: April 20, 2010
    Assignee: Fujitsu Limited
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Patent number: 7684190
    Abstract: A heat sink includes a generally rectangular flat base, a plurality of fins provided on the surface of the base in parallel to each other, a protrusion provided on the surface of the base along substantially the overall width of the base in the transverse direction to the fins. The fins become gradually shorter on one end side of the base. The ends of the fins are arranged on an oblique line with respect to a line perpendicular to the fins.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: March 23, 2010
    Assignee: Fujitsu Limited
    Inventors: Michimasa Aoki, Masumi Suzuki
  • Patent number: 7672125
    Abstract: An electronic component generates heat in an electronic apparatus. The heat of the electronic component is transferred to a thermal conductive plate of a heat receiver in a liquid cooling unit. The heat is transferred to coolant from the thermal conductive plate. The temperature of the coolant rises. The heat exchanger absorbs heat of the coolant. The coolant gets cooled. The heat of the electronic component is also transferred to the printed wiring board. The heat spreads over the printed wiring board through a wiring pattern in the printed wiring board. Since the tank or/and pump is placed at a position outside the printed wiring board, the heat cannot be transferred to the tank or/and the pump. This results in prevention of rise in the temperature of the coolant in the tank or/and the pump. The efficiency of heat radiation can thus be enhanced.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: March 2, 2010
    Assignee: Fujitsu Limited
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20100039772
    Abstract: In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on another side of the heat pipe, a first fan unit that sends an airflow to the first heat-radiating fin is provided on one side of the heat pipe, and a first duct that guides the airflow produced by the first fan unit to the first heat-radiating fin is provided on the other surface of the heat pipe.
    Type: Application
    Filed: October 22, 2009
    Publication date: February 18, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Kazuhiro NITTA, Masumi SUZUKI, Michimasa AOKI, Keizou TAKEMURA, Kenji KATSUMATA
  • Patent number: 7652884
    Abstract: A liquid cooling unit includes components such as first and second heat receivers, a heat exchanger, a tank and a pump in an electronic apparatus. The electronic apparatus includes a first enclosure and a second enclosure coupled to the second enclosure for relative movement. The liquid cooling unit is enclosed in the first enclosure. No component of the liquid cooling unit is enclosed in the second enclosure. The liquid cooling unit is thus incorporated in the first enclosure in a facilitated manner. This results in a reduced production cost. The liquid cooling unit can also be removed from the first enclosure in a facilitated manner.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: January 26, 2010
    Assignee: Fujitsu Limited
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20090207569
    Abstract: A portable electronic apparatus includes a first unit, a second unit, and a hinge unit. The first unit includes a first housing, a heat generating component inside the first housing, a first heat diffusing member disposed inside the first housing and diffusing heat from the heat generating component, and a heat dissipating part dissipating heat diffused by the first heat diffusing member to the outside of the first housing. The second unit includes a second housing, a second heat diffusing member disposed inside the second housing and diffusing heat inside the second housing, and a heat receiving part conducting heat from the heat dissipating part to the second heat diffusing member upon the heat receiving part being in contact with the heat dissipating part.
    Type: Application
    Filed: January 22, 2009
    Publication date: August 20, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Yosuke TSUNODA, Masumi SUZUKI
  • Patent number: 7431072
    Abstract: A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: October 7, 2008
    Assignee: Fujitsu Limited
    Inventors: Ryuuji Miyazaki, Masumi Suzuki
  • Publication number: 20080236797
    Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
    Type: Application
    Filed: December 28, 2007
    Publication date: October 2, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Ryuuji Miyazaki, Masumi Suzuki, Minoru Hirano
  • Publication number: 20080158817
    Abstract: An electronic apparatus 100 includes a heat-generating element 1, a heat-radiating plate 4 which is used in heat radiation of the heat-generating element, and a housing 10 which accommodates the heat-generating element and the heat-radiating plate. The heat-radiating plate is disposed between the heat-generating element and a first wall portion 10a of the housing, and a support stage 5 for forming an air layer is disposed between the heat-radiating plate and the first wall portion. Since the heat-insulating effect of the air layer prevents the heat diffused from the heat-radiating plate from being easily conducted to the first wall portion, the formation of a heat spot in the first wall portion can be avoided even when the heat-generating element which generates a large amount of heat is used.
    Type: Application
    Filed: March 5, 2008
    Publication date: July 3, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Yosuke TSUNODA, Masumi SUZUKI, Michimasa AOKI
  • Patent number: 7337829
    Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: March 4, 2008
    Assignee: Fujitsu Limited
    Inventors: Ryuuji Miyazaki, Masumi Suzuki, Minoru Hirano
  • Publication number: 20080024981
    Abstract: An electronic component generates heat in an electronic apparatus. The heat of the electronic component is transferred to a thermal conductive plate of a heat receiver in a liquid cooling unit. The heat is transferred to coolant from the thermal conductive plate. The temperature of the coolant rises. The heat exchanger absorbs heat of the coolant. The coolant gets cooled. The heat of the electronic component is also transferred to the printed wiring board. The heat spreads over the printed wiring board through a wiring pattern in the printed wiring board. Since the tank or/and pump is placed at a position outside the printed wiring board, the heat cannot be transferred to the tank or/and the pump. This results in prevention of rise in the temperature of the coolant in the tank or/and the pump. The efficiency of heat radiation can thus be enhanced.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080024978
    Abstract: An electronic apparatus includes an enclosure enclosing a liquid cooling unit. The liquid cooling unit includes a heat receiver received on an electronic component. Heat of the electronic component is transferred to the heat receiver. The heat of the heat receiver is transferred to the coolant flowing through the flow passage of the heat receiver. The electronic component gets cooled. The coolant flows into a tank in the liquid cooling unit. The tank stores the coolant and air. The air inlet is formed in the enclosure. Fresh air is introduced into the enclosure through the air inlet. Since the tank is opposed to the air inlet, the tank is exposed to the fresh air. The heat of the coolant in the tank is thus radiated into the air. The coolant gets cooled in an efficient manner. The efficiency of heat radiation is enhanced in this manner.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080023178
    Abstract: A heat exchanger allows establishment of first and second flat spaces, namely parallel flat spaces along a reference. The heat exchanger is inserted in a closed circulating loop for coolant. The first and second flat spaces have a cross-section larger than that of a cylindrical duct of the closed circulating loop. These flat spaces serve as a flow passage for the coolant. An increased cross-section enables a reduction in the flow speed of the coolant. The coolant is allowed to slowly flow through the first and second flat spaces. The coolant thus contacts with the first and second plates and the third and fourth plates for a longer time. The heat of the coolant is sufficiently transferred to the first and second plates and the third and fourth plates. The efficiency of heat radiation is enhanced.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080024987
    Abstract: A heat exchanger allows establishment of a flat space between first and second plates. The heat exchanger is inserted in a closed circulating loop for coolant. The flat space is allowed to have a cross-section larger than that of a cylindrical duct of the closed circulating loop. The flat space serves as a flow passage. An increased cross-section enables a reduction in the flow speed of the coolant. The coolant is allowed to slowly flow through the flat space. The coolant thus contacts with the first and second plates for a longer time. The heat of the coolant is sufficiently transferred to the first and second plates. The efficiency of heat radiation is enhanced.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080024980
    Abstract: A liquid cooling unit includes components such as first and second heat receivers, a heat exchanger, a tank and a pump in an electronic apparatus. The electronic apparatus includes a first enclosure and a second enclosure coupled to the second enclosure for relative movement. The liquid cooling unit is enclosed in the first enclosure. No component of the liquid cooling unit is enclosed in the second enclosure. The liquid cooling unit is thus incorporated in the first enclosure in a facilitated manner. This results in a reduced production cost. The liquid cooling unit can also be removed from the first enclosure in a facilitated manner.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori