Abstract: A heat receiver includes a casing defining a flow passage on a thermal conductive plate. The thermal conductive plate is received on an electronic component. The thermal conductive plate serves to transfer heat to coolant in the flow passage. At least two inflow nozzles extend into the casing to have discharge openings opposed to the upstream end of the flow passage. The coolant flows into the flow passage through the inflow nozzles. At least two streams of the coolant are thus generated in the flow passage. The streams widely expand or spread in the flow passage. The coolant flows through the flow passage without stagnating. The coolant can thus absorb the heat of the thermal conductive plate in an efficient manner. This results in an efficient heat absorption of the heat receiver.

Abstract: A heat receiver includes a casing defining a flow passage on a thermal conductive plate. The thermal conductive plate is received on an electronic component. An outflow nozzle has an inflow opening at the downstream end of the flow passage at a position outside the thermal conductive plate. Since the thermal conductive plate is received on the electronic component, the outflow nozzle is connected to the flow passage at a position outside the electronic component. This results in avoidance of increase in the thickness of the casing as compared with the case where the outflow nozzle directly extends into the flow passage on the thermal conductive plate.

Abstract: An intake opening is defined in a printed circuit board inside a fan cover mounted on the printed circuit board. The intake opening has a particular extent inside the fan cover. This intake opening contributes to improvement in the cooling efficiency of a fan as compared with a conventional intake opening. Moreover, the intake opening allows a sufficient space to remain on the front and back surfaces of the printed circuit board inside the fan cover. Electronic components and/or wiring patterns may be disposed in the space. This contributes to disposition of electronic components and/or wiring patterns at a higher density on the printed circuit board.

Abstract: In a forming method for forming an assembly of a bead core and an apex rubber, there is used a rotating body which comprises a rotating base substance having an assembly forming surface, and a core receiving portion projecting from the rotating base substance in the axially outward direction of the rotating base substance. The core receiving portion projecting has a receiving surface supporting the radially inner peripheral surface of the bead core. The apex rubber is formed by winding an unvulcanized rubber strip along the assembly forming surface from a starting position constituted by the radially outer peripheral surface of the bead core supported on the receiving surface so as to laminate in a tapered cross sectional shape.

Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

Abstract: A tire (2) includes a belt (12) provided on a carcass (10) and a band (14) for covering the belt (12). The band (14) includes a full band (36) and a pair of edge bands (38) provided in the vicinity of a shoulder and positioned on an outside in a radial direction of the full band (36). The full band (36) has a first band cord (40) wound spirally in a substantially circumferential direction. The edge band (38) has a second band cord (44) wound spirally in the substantially circumferential direction. A modulus of the second band cord (44) is higher than that of the first band cord (40). In the tire (2), it is preferable that an outer end (50) of the full band (36) should be provided on an outside of an outer end (48) of the belt (12) in an axial direction. An outer end (52) of the edge band (38) is identical to the outer end (48) of the belt (12) or is provided on an inside thereof.

Abstract: A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

Abstract: A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

Abstract: To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate; a heat radiator having a configuration of a plurality of horizontally oriented vertically spaced heat radiation plates; and a heat pipe H having a generally U-shaped or V-shaped profile, the middle portion of which is secured to the heat receiving plate; and wherein each end of the heat pipe H passes through the heat radiation plates.

Abstract: To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate 3; a heat radiator having a configuration of a plurality of horizontally oriented heat radiation plates 5 extending vertically; and a heat pipe H having a generally U or V shaped profile, the middle portion of which is secured to the heat receiving plate 3: and wherein each end of the heat pipe H passes through the heat radiation plates 5.

Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

Abstract: In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on another side of the heat pipe, a first fan unit that sends an airflow to the first heat-radiating fin is provided on one side of the heat pipe, and a first duct that guides the airflow produced by the first fan unit to the first heat-radiating fin is provided on the other surface of the heat pipe.

Abstract: A pneumatic tire comprises a pair of bead portions, a carcass comprising a carcass ply extending between the bead portions, a pair of bead cores each disposed in each bead portion, the bead core comprising an annular core formed from one monofilament cord and a sheath having at least one sheath wire extending helically around the annular core, and a wrapping member wrapping the bead core and made of fabric-like body having an organic fiber cord.

Abstract: An intake opening is defined in a printed circuit board inside a fan cover mounted on the printed circuit board. The intake opening has a particular extent inside the fan cover. This intake opening contributes to improvement in the cooling efficiency of a fan as compared with a conventional intake opening. Moreover, the intake opening allows a sufficient space to remain on the front and back surfaces of the printed circuit board inside the fan cover. Electronic components and/or wiring patterns may be disposed in the space. This contributes to disposition of electronic components and/or wiring patterns at a higher density on the printed circuit board.

Abstract: A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

Abstract: A heat sink includes a heat receiving part for receiving heat from the outside, a first radiating part, connected to said heat receiving part, which forms a first air channel, and radiates the heat from said heat receiving part using air that passes through the first air channel, and a second radiating part, located apart from said heat receiving part and connected to said first radiating part, said second radiating part forming a second air channel which the air that has passed the first air channel enters, the second air channel being narrower than the first air channel, said second radiating part radiating the heat from said first radiating part.

Abstract: An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.

Abstract: A heat sink includes a generally rectangular flat base, a plurality of fins provided on the surface of the base in parallel to each other, a protrusion provided on the surface of the base along substantially the overall width of the base in the transverse direction to the fins. The fins become gradually shorter on one end side of the base. The ends of the fins are arranged on an oblique line with respect to a line perpendicular to the fins.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.