Abstract: An ion exchangeable glass having a high degree of resistance to damage caused by abrasion, scratching, indentation, and the like. The glass comprises alumina, B2O3, and alkali metal oxides, and contains boron cations having three-fold coordination. The glass, when ion exchanged, has a Vickers crack initiation threshold of at least 10 kilogram force (kgf).

Abstract: A glass that is down-drawable and ion exchangeable. The glass has a temperature T35kp which the viscosity is 35 kilopoise. T35kp is less than the breakdown temperature Tbreakdown of zircon.

Abstract: Described herein are various glass compositions, glass articles, and information storage devices that comprise the glass articles as substrates therefor, along with methods for their manufacture and use.

Abstract: Described herein are glass, ceramic, or glass-ceramic articles having improved antimicrobial efficacy. Further described are methods of making and using the improved articles. The improved articles generally include a glass, ceramic, or glass-ceramic substrate, a compressive stress layer that extends inward from a surface of the glass, ceramic, or glass-ceramic substrate to a first depth therein, and an antimicrobial agent-containing region that extends inward from the surface of the glass, ceramic, or glass-ceramic substrate to a second depth therein.

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

Abstract: An ion exchangeable glass that is free of lithium and comprising 0.1-10 mol % P2O5 and at least 5 mol % Al2O3. The presence of P2O5 enables the glass to be ion exchanged more quickly and to a greater depth than comparable glasses that do not contain P2O5.

Abstract: An ion exchangeable glass having a high degree of resistance to damage caused by abrasion, scratching, indentation, and the like. The glass comprises alumina, B2O3, and alkali metal oxides, and contains boron cations having three-fold coordination. The glass, when ion exchanged, has a Vickers crack initiation threshold of at least 10 kilogram force (kgf).

Abstract: A glass that is down-drawable and ion exchangeable. The glass has a temperature T35kp at which the viscosity is 35 kilopoise. T35kp is less than the breakdown temperature Tbreakdown of zircon.

Abstract: An ion exchangeable glass having a high degree of resistance to damage caused by abrasion, scratching, indentation, and the like. The glass comprises alumina, B2O3, and alkali metal oxides, and contains boron cations having three-fold coordination. The glass, when ion exchanged, has a Vickers crack initiation threshold of at least 10 kilogram force (kgf).

Abstract: An ion exchangeable glass that is free of lithium and comprising 0.1-10 mol % P2O5 and at least 5 mol % Al2O3. The presence of P2O5 enables the glass to be ion exchanged more quickly and to a greater depth than comparable glasses that do not contain P2O5.

Abstract: A fining agent for reducing the concentration of seeds or bubbles in a silicate glass. The fining agent includes at least one inorganic compound, such as a hydrate or a hydroxide that acts as a source of water. In one embodiment, the fining agent further includes at least one multivalent metal oxide and, optionally, an oxidizer. A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3 is also provided. Methods of reducing the seed concentration of a silicate glass, and a method of making a silicate glass having a seed concentration of less than about 1 seed/cm3 are also described.

Abstract: An ion exchangeable glass having a high degree of resistance to damage caused by abrasion, scratching, indentation, and the like. The glass comprises alumina, B2O3, and alkali metal oxides, and contains boron cations having three-fold coordination. The glass, when ion exchanged, has a Vickers crack initiation threshold of at least about 30 kilogram force.

Abstract: Disclosed herein are one or more of formable and/or color-tunable, crystallizable glasses; formed and/or color-tuned glass-ceramics; IXable, formed and/or color-tuned glass-ceramics; IX, formed and/or color-tuned glass-ceramics; a machine or equipment including a formed and/or color-tuned glass-ceramic; a machine or equipment including an IXable, formed and/or color-tuned glass-ceramics; a machine or equipment including an IX, formed and/or color-tuned glass-ceramics; one or more processes for making formable, crystallizable glasses crystallizable; one or more processes for making formable and/or color-tunable, crystallizable glasses; one or more processes for making formed and/or color-tuned glass-ceramics; one or more processes for making IXable, formed and/or color-tuned glass-ceramics; one or more processes for making IX, formed and/or color-tuned glass-ceramics; and one or more processes for using any one of formable and/or color-tunable, crystallizable glasses; formed and/or color-tuned glass-ceramics;

Abstract: Disclosed herein are glass-ceramics having crystalline phases including ?-spodumene ss and either (i) pseudobrookite or (ii) vanadium or vanadium containing compounds so as to be colored and opaque glass-ceramics having coordinates, determined from total reflectance—specular included—measurements, in the CIELAB color space of the following ranges: L*=from about 20 to about 45; a*=from about ?2 to about +2; and b*=from about ?12 to about +1. Such CIELAB color space coordinates can be substantially uniform throughout the glass-ceramics. In each of the proceeding, ?-quartz ss can be substantially absent from the crystalline phases. If present, ?-quartz ss can be less than about 20 wt % or, alternatively, less than about 15 wt % of the crystalline phases. Also Further crystalline phases might include spinel ss (e.g., hercynite and/or gahnite-hercynite ss), rutile, magnesium zinc phosphate, or spinel ss (e.g., hercynite and/or gahnite-hercynite ss) and rutile.

Abstract: A silicate glass that is tough and scratch resistant. The toughness is increased by minimizing the number of non-bridging oxygen atoms in the glass. In one embodiment, the silicate glass is an aluminoborosilicate glass in which ?15 mol %?(R2O+R?O—Al2O3—ZrO2)—B2O3?4 mol %, where R is one of Li, Na, K, Rb, and Cs, and R? is one of Mg, Ca, Sr, and Ba.

Abstract: A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3.

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

Abstract: A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3.

Abstract: Methods and apparatus for producing a semiconductor on insulator structure include: subjecting an implantation surface of a donor single crystal semiconductor wafer to an ion implantation process to create an exfoliation layer of the donor semiconductor wafer; bonding the implantation surface of the exfoliation layer to a glass substrate using electrolysis, wherein a liquidus viscosity of the glass substrate is about 100,000 Poise or greater.

Abstract: The invention is directed to a method of forming small, thin glass articles having a thickness of less than 5 mm by the use of a plunger and a die, the die having walls, a terminal area and a transition area in contact with both the walls and the transition area is such that the interior distance dimensions of the die gradually decrease as one progresses from the terminal area through the transition area to the walls.