Abstract: Methods and apparatus for producing a semiconductor on insulator structure include: subjecting an implantation surface of a donor single crystal semiconductor wafer to an ion implantation process to create an exfoliation layer of the donor semiconductor wafer; bonding the implantation surface of the exfoliation layer to a glass substrate using electrolysis, wherein a liquidus viscosity of the glass substrate is about 100,000 Poise or greater.

Abstract: The invention is directed to a method of forming small, thin glass articles having a thickness of less than 5 mm by the use of a plunger and a die, the die having walls, a terminal area and a transition area in contact with both the walls and the transition area is such that the interior distance dimensions of the die gradually decrease as one progresses from the terminal area through the transition area to the walls.

Abstract: A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3.

Abstract: An aluminosilicate glass article having a high compressive stress layer. The glass article comprises at least about 50 mol % SiO2 and at least about 11 mol % Na2O, and has a layer under a compressive stress of at least about 900 MPa and the depth of layer that extends at least about 30 ?m from the surface of the glass article into the glass. A method of making such a glass article is also provided.

Abstract: A method of cutting a glass sheet that has been thermally or chemically strengthened along a predetermined line, axis, or direction with high speed and with minimum damage on the cut edges. The strengthened glass sheet may be an aluminoborosilicate glass material having at least one alkali metal oxide modifier, and the ratio Al 2 ? O 3 ? ( mol ? ? % ) + B 2 ? O 3 ? ( mol ? ? % ) ? ? modifiers ? ? ( mol ? ? % ) > 1. At least one damage line is formed within the strengthened glass sheet. The at least one damage line is formed outside the strengthened compressive stress surface layers and within the tensile stress layer of the strengthened glass sheet. The at least one damage line may be formed by laser treatment. A crack is initiated in the strengthened glass sheet and propagated along the at least one damage line to separate the strengthened glass sheet along the predetermined line, axis, or direction into at least two pieces.

Abstract: A silicate glass that is tough and scratch resistant. The toughness is increased by minimizing the number of non-bridging oxygen atoms in the glass. In one embodiment, the silicate glass is an aluminoborosilicate glass in which ?15 mol %?(R2O+R?O—Al2O3—ZrO2)—B2O3?4 mol %, where R is one of Li, Na, K, Rb, and Cs, and R? is one of Mg, Ca, Sr, and Ba.

Abstract: A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3.

Abstract: A housing/enclosure/cover can include an ion-exchanged glass exhibiting the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus ranging between about 50 to 100 GPa;; (7) a thermal conductivity of less than 2.0 W/m° C., and (9) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.

Abstract: A glass that is ion exchangeable to a depth of at least 20 ?m (microns) and has a internal region having a tension of less than or equal to 100 MPa. The glass is quenched or fast cooled from a first temperature above the anneal point of the glass to a second temperature that is below the strain point of the glass. In one embodiment, the glass is a silicate glass, such as an alkali silicate glass, an alkali aluminosilicate glass, an aluminosilicate glass, a borosilicate glass, an alkali aluminogermanate glass, an alkali germanate glass, an alkali gallogermanate glass, and combinations thereof.

Abstract: A fining agent for reducing the concentration of seeds or bubbles in a silicate glass. The fining agent includes at least one inorganic compound, such as a hydrate or a hydroxide that acts as a source of water. In one embodiment, the fining agent further includes at least one multivalent metal oxide and, optionally, an oxidizer. A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3 is also provided. Methods of reducing the seed concentration of a silicate glass, and a method of making a silicate glass having a seed concentration of less than about 1 seed/cm3 are also described.

Abstract: A rare-earth-containing glass material having a composition, expressed in mole percentages on and oxide basis, comprising: SiO2: 66-75 Al2O3: 11-17 B2O3: 0-4 MgO: 1-6.5 CaO: 2-7 SrO: 0-4 BaO: 0-4 Y2O3: 0-4 La2O3: 0-4 Y2O3+La2O3: 0.1-4. The inclusion of Y2O3 and/or La2O3 in the composition reduces the T2.3 of the glass thereby allowing higher annealing-point glasses to be produced. The glass is particularly useful for low-temperature polycrystalline silicon-based semiconductor devices.

Abstract: The invention relates to glass articles suitable for use as electronic device housing/enclosure or protective cover which comprise a glass material. Particularly, a housing/enclosure/cover comprising an ion-exchanged glass exhibiting the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm2 and a Vickers median/radial crack initiation threshold of at least 5 kgf, (6) a Young's Modulus ranging between about 50 to 100 GPa; (7) a thermal conductivity of less than 2.0 W/m° C., and (9) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.

Abstract: A fining agent for reducing the concentration of seeds or bubbles in a silicate glass. The fining agent includes at least one inorganic compound, such as a hydrate or a hydroxide that acts as a source of water. In one embodiment, the fining agent further includes at least one multivalent metal oxide and, optionally, an oxidizer. A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3 is also provided. Methods of reducing the seed concentration of a silicate glass, and a method of making a silicate glass having a seed concentration of less than about 1 seed/cm3 are also described.

Abstract: A fining agent for reducing the concentration of seeds or bubbles in a silicate glass. The fining agent includes at least one inorganic compound, such as a hydrate or a hydroxide that acts as a source of water. In one embodiment, the fining agent further includes at least one multivalent metal oxide and, optionally, an oxidizer. A fusion formable and ion exchangeable silicate glass having a seed concentration of less than about 1 seed/cm3 is also provided. Methods of reducing the seed concentration of a silicate glass, and a method of making a silicate glass having a seed concentration of less than about 1 seed/cm3 are also described.

Abstract: An ion exchangeable glass that is free of lithium and comprising 0.1-10 mol % P2O5 and at least 5 mol % Al2O3. The presence of P2O5 enables the glass to be ion exchanged more quickly and to a greater depth than comparable glasses that do not contain P2O5.

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

Abstract: The invention relates glass ceramic articles suitable for use as electronic device housing or enclosures which comprise a glass-ceramic material. Particularly, a glass-ceramic article housing/enclosure comprising a glass-ceramic material exhibiting both radio and microwave frequency transparency, as defined by a loss tangent of less than 0.5 and at a frequency range of between 15 MHz to 3.0 GHz, a fracture toughness of greater than 1.5 MPa·m1/2, an equibiaxial flexural strength (ROR strength) of greater than 100 MPa, a Knoop hardness of at least 400 kg/mm2, a thermal conductivity of less than 4 W/m° C. and a porosity of less than 0.1%.

Abstract: A glass that is down-drawable and ion exchangeable. The glass has a temperature T35kp which the viscosity is 35 kilopoise. T35kp less than the breakdown temperature Tbreakdown of zircon.

Abstract: A ceramic article may comprise a sintered phase ceramic composition comprising aluminum titanate (Al2TiO5), zirconium titanate (ZrTiO4), and a niobium-doped phase.

Abstract: A method of cutting a glass sheet that has been thermally or chemically strengthened along a predetermined line, axis, or direction with high speed and with minimum damage on the cut edges. The strengthened glass sheet may be an aluminoborosilicate glass material having at least one alkali metal oxide modifier, and the ratio Al 2 ? O 3 ? ( mol ? ? % ) + B 2 ? O 3 ? ( mol ? ? % ) ? ? modifiers ? ? ( mol ? ? % ) > 1. At least one damage line is formed within the strengthened glass sheet. The at least one damage line is formed outside the strengthened compressive stress surface layers and within the tensile stress layer of the strengthened glass sheet. The at least one damage line may be formed by laser treatment. A crack is initiated in the strengthened glass sheet and propagated along the at least one damage line to separate the strengthened glass sheet along the predetermined line, axis, or direction into at least two pieces.